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L7987 on a board, in 3D

L7987

STMicroelectronics

-40℃~+150℃@(TJ) 1 1mA 3A 4.5V~61V Adjustable Buck Buck Built-in No HTSSOP-16-EP DC-DC Converters ROHS

Extended
Category
DC DC Converters
Package
HTSSOP-16-EP
Pins
16

Overview

The L7987 is a DC DC Converter made by STMicroelectronics in a HTSSOP-16-EP package with 17 pins. -40℃~+150℃@(TJ) 1 1mA 3A 4.5V~61V Adjustable Buck Buck Built-in No HTSSOP-16-EP DC-DC Converters ROHS.

PCBKit's library has its KiCad symbol (EasyEDA_Cloud:L7987LTR, from EasyEDA) and its footprint (EasyEDA_Cloud:HTSSOP-16_L5.0-W4.4-P0.65-LS6.4-BL-EP, from EasyEDA), ready for a KiCad board. 1,031 are in stock at JLCPCB (part C2832776). 2 open-source boards in 1 repository on GitHub use it.

Symbol

VBIAS1VIN2VIN3VCC4EN5SS6SYNCH7COMP8FB9FSW10ILIM11PGOOD12LX13LX14BOOT15GND16EP17
EasyEDA_Cloud:L7987LTRFrom EasyEDA

Footprint

123456789101112131415161717171717
EasyEDA_Cloud:HTSSOP-16_L5.0-W4.4-P0.65-LS6.4-BL-EPFrom EasyEDA

From the datasheet

12
Supply, least
4.5 V · VIN, recommended operating min · p. 1
Supply, most
61 V · VIN, recommended operating max · p. 1
Supply, absolute maximum
61 V · VIN, absolute maximum · p. 7
Junction, hottest
150 °C · junction operating temperature max · p. 7
Takes working
2.5 mA · VIN and VCC quiescent typical, VBIAS = GND, LX floating, VFB = 1 V · p. 8
Takes working
2.6 mA · sum of VIN/VCC and VBIAS quiescent typical, VBIAS = 3.3 V, LX floating, VFB = 1 V · p. 8
Takes asleep
11 µA · VIN shutdown current typical, VEN = GND · p. 8
Gives
3 A · continuous DC output current max · p. 1
Current limit
4 A · peak current limit typical, ILIM floating, VFB = 0.6 V · p. 8
Feedback reference
800 mV · feedback voltage typical · p. 9
Switches at
250 kHz · switching frequency typical, FSW floating · p. 8
Junction to air (HTSSOP16)
40 K/W · junction to ambient on demonstration board · p. 30

What it is and has

14
Output current
3 A DC · p. 1
Input voltage
4.5 V to 61 V · p. 1
Switching frequency
Adjustable, 250 kHz - 1.5 MHz · p. 1
Output voltage
Adjustable from 0.8 V to VIN · p. 1
Synchronization
Supported · p. 1
Soft-start
Adjustable · p. 1
Current limitation
Adjustable · p. 1
Auxiliary bias
VBIAS improves efficiency at light load · p. 1
Power good
PGOOD open collector output · p. 1
Output voltage sequencing
Supported · p. 1
Protection
Digital frequency foldback in short-circuit · p. 1
Protection
Peak current foldback in short-circuit · p. 1
Protection
Auto-recovery thermal shutdown · p. 1
Package
HTSSOP16 · p. 1

Around it

4
cap 1 F
between VBIAS and GND; Ceramic; required when VBIAS is supplied by the output voltage or an auxiliary rail. Connect VBIAS to signal GND if unused. · p. 6
cap 1 F
between VCC and GND; Ceramic; bypass to signal GND. · p. 6
cap 100 nF
between BOOT and LX; Typical bootstrap capacitor. · p. 6
cap 1 F or higher
between VIN and GND; Place as close as possible to the input voltage pin to filter high frequency noise. · p. 30

Specifications

71
ParameterConditionsAs printedPage
VIN VINmin -0.3 · max 61 V7
VCC VCCmin -0.3 · max 61 V7
VBOOT - GND BOOTmin -0.3 · max 65 V7
VBOOT - VLX BOOTmin -0.3 · max 4 V7
VBIAS VBIASMaximum = VCCmin -0.3 V7
EN ENMaximum = VCCmin -0.3 V7
PGOOD PGOODMaximum = VCCmin -0.3 V7
LX LXMaximum = VIN + 0.3 Vmin -0.3 V7
SYNCH SYNCHmin -0.3 · max 5.5 V7
SS SSmin -0.3 · max 3.6 V7
FSW FSWmin -0.3 · max 3.6 V7
COMP COMPmin -0.3 · max 3.6 V7
ILIM ILIMmin -0.3 · max 3.6 V7
FB FBmin -0.3 · max 3.6 V7
Operating temperature range TJJunction temperaturemin -40 · max 150 °C7
Storage temperature range TSTGmin -65 · max 150 °C7
Lead temperature (soldering 10 sec.) TLEADSoldering 10 sec.max 260 °C7
High-side RMS current IHSmax 3 A7
Thermal resistance junction-ambient (device soldered on the STMicroelectronics® demonstration board) RthJAHTSSOP16; device soldered on the STMicroelectronics® demonstration boardtyp 40 °C/W7
HBM ESDHBMmax 2 KV7
CDM ESDCDMmax 500 V7
Operating input voltage range VINTJ = -40 to +125 °C; footnote 1min 4.5 · max 61 V8
High side RDSON RDSON HSISW = 0.5 A; TJ = 25 °Ctyp 0.2 · max 0.32 8
High side RDSON RDSON HSISW = 0.5 A; TJ = -40 to +125 °C; footnote 1typ 0.2 · max 0.42 8
Switching frequency fSWFSW floating; TJ = 25 °Cmin 233 · typ 250 · max 267 kHz8
Switching frequency fSWFSW floating; TJ = -40 to +125 °C; footnote 1min 225 · typ 250 · max 275 kHz8
Selected switching frequency fSWRSW = 10 k min 1350 · typ 1500 · max 1650 kHz8
Peak current limit IPKILIM floating; VFB = 0.6 V; footnote 2min 3.4 · typ 4 · max 4.6 A8
Selected peak current limit IPKRILIM = 100 k VFB = 0.6 V; footnote 2min 0.68 · typ 0.85 · max 1.01 A8
Pulse skipping peak current ISKIPFootnote 2typ 0.5 A8
Feedback foldback level VFOLDNot tested in production; footnote 3typ 400 mV8
Maximum on time TONMAXtyp 12 us8
Minimum on time TONMINtyp 120 · max 150 ns8
Minimum off time TOFFMINNot tested in production; footnote 3typ 360 ns8
VCC UVLO rising threshold VCCHTJ = -40 to +125 °C; footnote 1min 3.85 · typ 4.1 · max 4.3 V8
VCC UVLO hysteresis VCCHYSTTJ = -40 to +125 °C; footnote 1min 160 · typ 250 · max 340 mV8
VBIAS threshold SWOSwitch internal supply from VCC to VBIAS. VBIAS ramping up from 0 V. TJ = -40 to +125 °C; footnote 1min 2.84 · typ 2.9 · max 2.96 V8
VBIAS threshold SWOHysteresis; not tested in production; footnote 3typ 80 mV8
VCC - VBIAS threshold SWOSwitch internal supply from VCC to VBIAS. VIN = VCC = 24 V, VBIAS falling from 24 V to GND. TJ = -40 to +125 °C; footnote 1min 3.35 · typ 4.05 · max 4.9 V8
VCC - VBIAS threshold SWOHysteresis; not tested in production; footnote 3typ 750 mV8
Shutdown current from VIN ISHTDWNVEN = GNDtyp 11 · max 16 A8
Quiescent current from VIN and VCC IQUIESCLX floating, VFB = 1 V, VBIAS = GND, FSW floatingtyp 2.5 · max 3.4 mA8
Quiescent current from VIN and VCC IQOPVINLX floating, VFB = 1 V, VBIAS = 3.3 V, FSW floatingtyp 1 · max 1.4 mA8
Quiescent current from VBIAS IQOPVBIASLX floating, VFB = 1 V, VBIAS = 3.3 V, FSW floatingtyp 1.6 · max 2.4 mA8
Device OFF level VENmin 0.06 · max 0.3 V9
Device ON level VENmin 0.35 · max 0.9 V9
Soft start setup time TSSSETUPDelay from UVLO rising to switching activity; not tested in production; footnote 3typ 640 s9
CSS charging current ISS CHVSS = GNDmin 4.3 · typ 5 · max 5.7 A9
Voltage feedback VFBTJ = 25 °Cmin 0.792 · typ 0.8 · max 0.808 V9
Voltage feedback VFBTJ = -40 to +125 °C; footnote 1min 0.788 · typ 0.8 · max 0.812 V9
VCOMPH VCOMPHVFB = GND; VSS = 3.2 Vmin 3.2 · typ 3.35 · max 3.5 V9
VCOMPL VCOMPLVFB =1 V; VSS = 3.2 Vmax 0.1 V9
FB biasing current IFBVFB =3.6 Vtyp 5 · max 50 nA9
IOSOURCE IOSOURCEVFB =GND; SS pin floating; VCOMP =2 V; not tested in production; footnote 3typ 3.1 mA9
Output stage sinking capability IOSINKUnity gain buffer configuration (FB connected to COMP). COMP voltage variation due to IOSINK injection lower than ± 0.1 · VFB; not tested in production; footnote 3typ 5 mA9
Error amplifier gain AV0Not tested in production; footnote 3typ 100 dB9
GBWP GBWPUnity gain buffer configuration (FB connected to COMP). No load on COMP pin. Not tested in production; footnote 3typ 23 MHz9
Synchronization frequency fSYN MINFSW floatingmin 280 kHz9
Master output amplitude VSYNOUTILOAD = 4 mAmin 2.45 V9
Master output amplitude VSYNOUTILOAD = 0 A; pin SYNCH floatingmax 3.8 V9
Output pulse width VSYNOWILOAD = 0 A; pin SYNCH floatingmin 155 · typ 225 · max 275 ns9
SYNCH slave high level input threshold VSYNIHmin 2 V9
SYNCH slave low level input threshold VSYNILmax 1 V9
Slave SYNCH pull-down current ISYNVSYNCH = 5 Vmin 550 · typ 750 · max 950 A9
Input pulse width VSYNIWmin 200 ns9
PGOOD rising threshold VPGDTHVFB risingmin 0.67 · typ 0.7 · max 0.73 V9
PGOOD hysteresis VPGDHYSTVFB falling; not tested in production; footnote 3typ 30 mV9
PGOOD low level VPGDLOWIPGD = 1 mA, VFB = GNDtyp 30 mV10
PGOOD leakage current IPGDLKGVPGOOD = 61 V;VFB = 0.8 Vmax 0.1 A10
Thermal shutdown temperature TSHDWNNot tested in production; footnote 3typ 170 °C10
Thermal shutdown hysteresis THYSNot tested in production; footnote 3typ 15 °C10

Pins, by the datasheet

17
1 VBIAS
Auxiliary analog supply, typically connected to the regulated output or an external rail higher than 3 V; connect to signal GND if unused, otherwise bypass with a 1 uF ceramic capacitor. · p. 6
2 VIN
DC input voltage. · p. 6
3 VIN
DC input voltage. · p. 6
4 VCC
Filtered DC input voltage to internal circuitry; bypass to signal GND with a 1 uF ceramic capacitor. · p. 6
5 EN
Active high enable; connect to VCC if unused. · p. 6
6 SS
An internal current generator charges the external soft-start capacitor. · p. 6
7 SYNCH
Master / slave synchronization. · p. 6
8 COMP
Error amplifier output; connect the compensation network here. · p. 6
9 FB
Inverting input of the error amplifier. · p. 6
10 FSW
A pull-down resistor to GND selects the switching frequency. · p. 6
11 ILIM
A pull-down resistor to GND selects the peak current limitation. · p. 6
12 PGOOD
Open collector output driven low when the output voltage sensed on FB is out of regulation. · p. 6
13 LX
Switching node. · p. 6
14 LX
Switching node. · p. 6
15 BOOT
Connect an external capacitor, typically 100 nF, between BOOT and LX to supply the internal n-DMOS gate charge. · p. 6
16 GND
Signal GND. · p. 6
- E.P.
Exposed pad must be connected to signal GND. · p. 6

Ordering codes, by the datasheet

2
L7987
HTSSOP16 · Tube packaging · p. 36
L7987TR
HTSSOP16 · Tape and reel packaging · p. 36

Parameters

19
Current Limit
4A
Features
Operating status indication
Frequency - Switching
250kHz
Function
Step-down type
Junction Temperature(Max)
150℃
Number of Outputs
1
Operating Temperature
-40℃~+150℃@(TJ)
Output Current
3A
Output Type
Adjustable
Output Voltage
800mV~61V
Quiescent Current
1mA
Reference Voltage
800mV
Standby Current
11uA
Switch tube (built-in/external)
Built-in
Synchronous Rectifier
No
Thermal Resistance(Junction to Ambient)
40℃/W
Topology
Buck
Voltage - Supply
4.5V~61V
Voltage - Supply(Absolute Max)
61V

Order codes

2

Pinout

17
The pins of the L7987
PinNameType
1VBIASUnspecified
2VINUnspecified
3VINUnspecified
4VCCUnspecified
5ENUnspecified
6SSUnspecified
7SYNCHUnspecified
8COMPUnspecified
9FBUnspecified
10FSWUnspecified
11ILIMUnspecified
12PGOODUnspecified
13LXUnspecified
14LXUnspecified
15BOOTUnspecified
16GNDUnspecified
17EPUnspecified

Open-source boards using it

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  • 2 layers40.1 × 40.1 mmSTEPDOWN1A, the printed circuit board in 3D

    STEPDOWN1A

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    Step down power converter

    38 parts

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Questions

Is there a KiCad symbol and footprint for the L7987?

Yes. The symbol is EasyEDA_Cloud:L7987LTR and the footprint EasyEDA_Cloud:HTSSOP-16_L5.0-W4.4-P0.65-LS6.4-BL-EP, both drawn on this page. PCBKit places them on a board for you when you design with it.

What package is the L7987?

HTSSOP-16-EP, with 17 pins. Its footprint is drawn on this page.

Where is the L7987 datasheet?

STMicroelectronics publishes it: the Datasheet link on this page opens it.

Where can I order the L7987?

JLCPCB lists it as part C2832776, with 1,031 in stock; the sellers' links on this page open their listings.

What can replace the L7987?

Parts like it in the library: the TPS54395PWP by Texas Instruments, the LT1765EFE-5#PBF by Analog Devices, the LT3430EFE#TRPBF by Analog Devices and the LT1374CFE#TRPBF by Analog Devices. Check their datasheets: a part that fits the footprint may still differ in its ratings.

Which open-source boards use the L7987?

2 boards in 1 repository on GitHub; the most starred are listed on this page, with their KiCad files.

Parts like it

8