
Circuit board design
ImperialSpaceSociety/Project-Mach-1
This is the code and hardware designs for the high powered rocketry project at the Imperial College Space Society

The IIS2MDC is a 3D Magnetic Sensor made by STMicroelectronics in a LGA-12(2x2) package with 12 pins. -40℃~+85℃ 1.13mA 1.71V~3.6V 16bit I2C、SPI ±4.9152mT ±4.9152mT LGA-12(2x2) 3D Magnetic Sensors ROHS.
PCBKit's library has its KiCad symbol (IIS2MDCTR:IIS2MDCTR, from Antmicro) and its footprint (4ms_Package_QFP:LGA-12_2x2mm_P0.5mm, from KiCad's library), ready for a KiCad board. 3,326 are in stock at JLCPCB (part C2655002). 8 open-source boards in 7 repositories on GitHub use it.
| Parameter | Conditions | As printed | Page |
|---|---|---|---|
| Magnetic dynamic range FS | Vdd = 2.5 V, T = 25 °C; typical range when field is fully aligned with one sensitive axis; minimum range with cross-axis stray field | min 25 · typ 49.152 gauss | 9 |
| Sensitivity So | Vdd = 2.5 V, T = 25 °C; after factory calibration and trimming; minimum and maximum are -7% and +7% of typical | typ 1.5 mgauss/LSB | 9 |
| Sensitivity change vs. temperature TCSo | Vdd = 2.5 V; typical value is ±0.03 | typ 0.03 %/°C | 9 |
| Magnetic sensor offset TyOff | Vdd = 2.5 V, T = 25 °C; with offset cancellation; excluding drift due to magnetic shock | min -60 · max 60 mgauss | 9 |
| Magnetic sensor offset change vs. temp. TCOff | Vdd = 2.5 V; with offset cancellation | min -0.3 · max 0.3 mgauss/°C | 9 |
| RMS noise RMS | Vdd = 2.5 V, T = 25 °C; high-resolution mode; low-pass filter or offset cancellation enabled | typ 3 · max 4.6 mgauss (RMS) | 9 |
| Output data rate ODR | Vdd = 2.5 V, T = 25 °C | typ 10 Hz | 9 |
| Output data rate ODR | Vdd = 2.5 V, T = 25 °C | typ 20 Hz | 9 |
| Output data rate ODR | Vdd = 2.5 V, T = 25 °C | typ 50 Hz | 9 |
| Output data rate ODR | Vdd = 2.5 V, T = 25 °C | typ 100 Hz | 9 |
| Output data rate ODR | Vdd = 2.5 V, T = 25 °C; LP, single measurement mode | typ 150 Hz | 9 |
| Self-test ST | Vdd = 2.5 V, T = 25 °C; output with self-test enabled minus output with self-test disabled | min 15 · max 500 mgauss | 9 |
| Operating temperature range Top | min -40 · max 85 °C | 9 | |
| Temperature sensor output change vs. temp. TSDr | Vdd = 2.5 V, T = 25 °C; 12-bit resolution | typ 8 digit/°C | 10 |
| Supply voltage Vdd | T = 25 °C | min 1.71 · typ 2.5 · max 3.6 V | 10 |
| Module power supply for I/O Vdd_IO | Vdd = 2.5 V, T = 25 °C | min 1.71 · max 3.6 V | 10 |
| Current consumption in high-resolution mode Idd_HR | Vdd = 2.5 V, T = 25 °C; ODR = 100 Hz; offset cancellation turned on | typ 1130 uA | 10 |
| Current consumption in low-power mode Idd_LP | Vdd = 2.5 V, T = 25 °C; ODR = 10 Hz; offset cancellation turned off | typ 25 uA | 10 |
| Current consumption in power-down Idd_PD | Vdd = 2.5 V, T = 25 °C | typ 1.5 uA | 10 |
| Low-level output voltage VOL | Vdd = 2.5 V, T = 25 °C; IOL = 4 mA | max 0.2 V | 10 |
| Operating temperature range TOP | min -40 · max 85 °C | 10 | |
| Supply voltage Vdd | min -0.3 · max 4.8 V | 14 | |
| I/O pins supply voltage Vdd_IO | min -0.3 · max 4.8 V | 14 | |
| Input voltage on any control pin (CS, SCL/SPC, SDA/SDI/SDO) Vin | Maximum = Vdd_IO +0.3 | min -0.3 V | 14 |
| Maximum exposed field MEF | max 10000 gauss | 14 | |
| Operating temperature range TOP | min -40 · max 85 °C | 14 | |
| Storage temperature range TSTG | min -40 · max 125 °C | 14 | |
| Electrostatic discharge protection (HBM) ESD | HBM | max 2 kV | 14 |
| Noise RMS | High-resolution mode, CFG_REG_A[LP = 0]; CFG_REG_B[LPF] or CFG_REG_B[OFF_CANC] = 0 (disable); BW = ODR/2 | typ 4.5 mg | 16 |
| Noise RMS | Low-power mode, CFG_REG_A[LP = 1]; CFG_REG_B[LPF] or CFG_REG_B[OFF_CANC] = 0 (disable); BW = ODR/2 | typ 9 mg | 16 |
| Noise RMS | High-resolution mode, CFG_REG_A[LP = 0]; CFG_REG_B[LPF] or CFG_REG_B[OFF_CANC] = 1 (enable); BW = ODR/4 | typ 3 mg | 16 |
| Noise RMS | Low-power mode, CFG_REG_A[LP = 1]; CFG_REG_B[LPF] or CFG_REG_B[OFF_CANC] = 1 (enable); BW = ODR/4 | typ 6 mg | 16 |
| Current consumption | ODR = 10 Hz; high-resolution; CFG_REG_A[LP] = 0; CFG_REG_B[OFF_CANC] = 0 | typ 100 uA | 16 |
| Current consumption | ODR = 10 Hz; low-power; CFG_REG_A[LP] = 1; CFG_REG_B[OFF_CANC] = 0 | typ 25 uA | 16 |
| Current consumption | ODR = 10 Hz; high-resolution; CFG_REG_A[LP] = 0; CFG_REG_B[OFF_CANC] = 1 | typ 120 uA | 16 |
| Current consumption | ODR = 10 Hz; low-power; CFG_REG_A[LP] = 1; CFG_REG_B[OFF_CANC] = 1 | typ 50 uA | 16 |
| Current consumption | ODR = 20 Hz; high-resolution; CFG_REG_A[LP] = 0; CFG_REG_B[OFF_CANC] = 0 | typ 200 uA | 16 |
| Current consumption | ODR = 20 Hz; low-power; CFG_REG_A[LP] = 1; CFG_REG_B[OFF_CANC] = 0 | typ 50 uA | 16 |
| Current consumption | ODR = 20 Hz; high-resolution; CFG_REG_A[LP] = 0; CFG_REG_B[OFF_CANC] = 1 | typ 235 uA | 16 |
| Current consumption | ODR = 20 Hz; low-power; CFG_REG_A[LP] = 1; CFG_REG_B[OFF_CANC] = 1 | typ 100 uA | 16 |
| Current consumption | ODR = 50 Hz; high-resolution; CFG_REG_A[LP] = 0; CFG_REG_B[OFF_CANC] = 0 | typ 475 uA | 16 |
| Current consumption | ODR = 50 Hz; low-power; CFG_REG_A[LP] = 1; CFG_REG_B[OFF_CANC] = 0 | typ 125 uA | 16 |
| Current consumption | ODR = 50 Hz; high-resolution; CFG_REG_A[LP] = 0; CFG_REG_B[OFF_CANC] = 1 | typ 575 uA | 16 |
| Current consumption | ODR = 50 Hz; low-power; CFG_REG_A[LP] = 1; CFG_REG_B[OFF_CANC] = 1 | typ 235 uA | 16 |
| Current consumption | ODR = 100 Hz; high-resolution; CFG_REG_A[LP] = 0; CFG_REG_B[OFF_CANC] = 0 | typ 950 uA | 16 |
| Current consumption | ODR = 100 Hz; low-power; CFG_REG_A[LP] = 1; CFG_REG_B[OFF_CANC] = 0 | typ 250 uA | 16 |
| Current consumption | ODR = 100 Hz; high-resolution; CFG_REG_A[LP] = 0; CFG_REG_B[OFF_CANC] = 1 | typ 1130 uA | 16 |
| Current consumption | ODR = 100 Hz; low-power; CFG_REG_A[LP] = 1; CFG_REG_B[OFF_CANC] = 1 | typ 460 uA | 16 |
| Turn-on time | CFG_REG_A[LP] = 0 (high-resolution); CFG_REG_A[OFF_CANC = 0] | typ 9.4 ms | 17 |
| Turn-on time | CFG_REG_A[LP] = 1 (low-power); CFG_REG_A[OFF_CANC = 0] | typ 6.4 ms | 17 |
| Maximum ODR | Single measurement mode; High resolution (LP = ‘0’) | max 100 Hz | 17 |
| Maximum ODR | Single measurement mode; Low power (LP = ‘1’) | max 150 Hz | 17 |
| Pin | Name | Type |
|---|---|---|
| 1 | SCL | Input |
| 2 | NC | Not connected |
| 3 | CS | Input |
| 4 | SDA | Input/output |
| 5 | C1 | Passive |
| 6 | GND | Power in |
| 7 | INT/DRDY | Output |
| 8 | GND | Passive |
| 9 | V_{DD} | Power in |
| 10 | V_{DDIO} | Power in |
| 11 | NC | Not connected |
| 12 | NC | Not connected |

ImperialSpaceSociety/Project-Mach-1
This is the code and hardware designs for the high powered rocketry project at the Imperial College Space Society

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<iframe src="https://pcbkit.io/embed/parts/st/IIS2MDC" title="IIS2MDC in PCBKit" width="100%" height="480" style="border:0;border-radius:12px" allow="fullscreen" loading="lazy"></iframe><img src="https://pcbkit.io/embed/parts/st/IIS2MDC.jpg" alt="IIS2MDC" width="1200" height="900">[](https://pcbkit.io/parts/st/IIS2MDC)Yes. The symbol is IIS2MDCTR:IIS2MDCTR and the footprint 4ms_Package_QFP:LGA-12_2x2mm_P0.5mm, both drawn on this page. PCBKit places them on a board for you when you design with it.
LGA-12(2x2), with 12 pins. Its footprint is drawn on this page.
STMicroelectronics publishes it: the Datasheet link on this page opens it.
JLCPCB lists it as part C2655002, with 3,326 in stock; the sellers' links on this page open their listings.
Parts like it in the library: the LIS3MDL by STMicroelectronics and the LIS2MDL by STMicroelectronics. Check their datasheets: a part that fits the footprint may still differ in its ratings.
8 boards in 7 repositories on GitHub; the most starred are listed on this page, with their KiCad files.