4 layers46.5 × 40 mm
Overview
The FUSB302MPX is a USB Converter made by onsemi in a WFQFN-14(2.5x2.5) package with 15 pins. -40℃~+85℃ 2.8V~5.5V 25uA 25uA Controller USB 3.1 WFQFN-14(2.5x2.5) USB Converters ROHS.
PCBKit's library has its KiCad symbol (EasyEDA_Cloud:FUSB302MPX, from EasyEDA) and its footprint (EasyEDA_Cloud:MLP-14_L2.5-W2.5-P0.50-BL-EP, from EasyEDA), ready for a KiCad board. 3,910 are in stock at JLCPCB (part C442699). 5 open-source boards in 5 repositories on GitHub use it.
Symbol
Footprint
From the datasheet
14- Supply, least
- 2.8 V · VDD, recommended operating min; functional operation only · p. 12
- Supply, most
- 5.5 V · VDD, recommended operating max · p. 12
- Supply, least
- 4 V · VBUS, recommended operating min · p. 12
- Supply, most
- 21 V · VBUS, recommended operating max · p. 12
- Supply, least
- 2.7 V · VCONN, recommended operating min · p. 12
- Supply, absolute maximum
- 6 V · VDD, absolute max · p. 12
- Supply, absolute maximum
- 28 V · VBUS, absolute max · p. 12
- Works from
- -40 °C · Operating ambient temperature min · p. 12
- Works up to
- 85 °C · Operating ambient temperature max · p. 12
- Junction, hottest
- 150 °C · Junction temperature absolute max · p. 12
- Takes asleep
- 370 nA · Disabled current typical; nothing attached, no I2C transactions · p. 15
- Takes asleep
- 25 µA · Unattached standby toggle current typical · p. 15
- Takes asleep
- 40 µA · BMC PD standby current typical; attached, neither sending nor receiving · p. 15
- Current limit
- 800 mA · VCONN switch OCP typical; OCPreg=0Fh · p. 14
What it is and has
7- Controller
- Programmable USB Type-C Controller w/PD · p. 1
- USB Type-C
- Full Type-C 1.1 support · p. 1
- USB Power Delivery
- PD 2.0, Version 1.1 support · p. 1
- PD response
- Automatic GoodCRC packet response · p. 1
- Accessory support
- Audio adapter accessory mode · p. 1
- Accessory support
- Debug accessory mode · p. 1
- Cable detection
- Active cable detection · p. 1
Around it
7- cap 200–600 pF
- between CCx and GND; CRECV, CCX receiver capacitance. · p. 32
- cap 10–220 µF
- between VCONN and GND; CBULK, VCONN source bulk capacitance. · p. 32
- cap 0.1 µF
- between VCONN and GND; CVCONN, VCONN decoupling capacitance. · p. 32
- cap 0.1 µF
- between VDD and GND; CVDD1, VDD decoupling capacitance. · p. 32
- cap 1.0 µF
- between VDD and GND; CVDD2, VDD decoupling capacitance. · p. 32
- res 4.7 kΩ
- between SDA and VPU; I2C pull-up resistor; pull-up voltage from 1.71 V to VDD. · p. 32
- res 4.7 kΩ
- between INT_N and pull-up supply; RPU_INT, typical value; minimum 1.0 kΩ. · p. 32
Specifications
68| Parameter | Conditions | As printed | Page |
|---|---|---|---|
| Supply Voltage from VDD VvDD | min -0.5 · max 6 V | 12 | |
| CC pins when configured as Host, Device or Dual Role Port VCC_HDDRP | min -0.5 · max 6 V | 12 | |
| VBUS Supply Voltage VVBUS | min -0.5 · max 28 V | 12 | |
| Storage Temperature Range TSTORAGE | min -65 · max 150 C | 12 | |
| Maximum Junction Temperature TJ | max 150 C | 12 | |
| Lead Temperature (Soldering, 10 Seconds) TL | max 260 C | 12 | |
| IEC 61000-4-2 System ESD ESD | Connector Pins (VBUS, CCx), Air Gap | min 15 kV | 12 |
| IEC 61000-4-2 System ESD ESD | Connector Pins (VBUS, CCx), Contact | min 8 kV | 12 |
| Human Body Model, ANSI/ESDA/JEDEC JS-001-2012 ESD | All Pins | min 4 kV | 12 |
| Charged Device Model, JEDEC JESD22-C101 ESD | All Pins | min 1 kV | 12 |
| VBUS Supply Voltage VVBUS | min 4 · typ 5 · max 21 V | 12 | |
| VDD Supply Voltage VVDD | Minimum is for functional operation only; all electrical parameters have a minimum of 3.0 V operation. | min 2.8 · typ 3.3 · max 5.5 V | 12 |
| VCONN Supply Voltage VVCONN | min 2.7 · max 5.5 V | 12 | |
| VCONN Supply Current IVCONN | max 560 mA | 12 | |
| Operating Temperature TA | min -40 · max 85 C | 12 | |
| RDSON for SW1_CC1 and SW1_CC2 RSW_CCx | VCONN to CC1 & CC2; TA=-40 to +85°C, TJ=-40 to +125°C | typ 0.4 · max 1.2 Ω | 14 |
| Over-Current Protection (OCP) limit at which VCONN switch shuts off over the entire VCONN voltage range. OCPreg=0Fh. ISW_CCX | TA=-40 to +85°C, TJ=-40 to +125°C | min 600 · typ 800 · max 1000 mA | 14 |
| Time taken for the VCONN switch to turn on during which Over-Current Protection is disabled tSoftStart | TA=-40 to +85°C, TJ=-40 to +125°C | typ 1.5 ms | 14 |
| SRC 80 uA CC current (Default) I80_CCX | HOST_CUR1=0, HOST_CUR0=1; TA=-40 to +85°C, TJ=-40 to +125°C | min 64 · typ 80 · max 96 uA | 14 |
| SRC 180 uA CC Current (1.5 A) I180_CCX | HOST_CUR1=1, HOST_CUR0=0; TA=-40 to +85°C, TJ=-40 to +125°C | min 166 · typ 180 · max 194 uA | 14 |
| SRC 330 uA CC Current (3 A) I330_CCX | HOST_CUR1=1, HOST_CUR0=1; TA=-40 to +85°C, TJ=-40 to +125°C | min 304 · typ 330 · max 356 uA | 14 |
| SNK Pull-down Voltage in Dead Battery under all Pull-up SRC Loads VUFPDB | TA=-40 to +85°C, TJ=-40 to +125°C | max 2.18 V | 14 |
| Device Pull-down Resistance(6) RDEVICE | Minimum and maximum guaranteed only when power is applied; TA=-40 to +85°C, TJ=-40 to +125°C | min 4.6 · typ 5.1 · max 5.6 kΩ | 14 |
| CC Resistance for Disabled State zOPEN | TA=-40 to +85°C, TJ=-40 to +125°C | min 126 kΩ | 14 |
| Wake threshold for CC pin SRC or SNK LOW value. WAKElow | Bandgap and wake circuit turned on, PWR[0]=1; TA=-40 to +85°C, TJ=-40 to +125°C | typ 0.25 V | 14 |
| Wake threshold for CC pin SRC or SNK HIGH value. WAKEhigh | Bandgap and wake circuit turned on, PWR[0]=1; TA=-40 to +85°C, TJ=-40 to +125°C | typ 1.45 V | 14 |
| Hysteresis on the Ra and Rd Comparators vBC_LVLhys | TA=-40 to +85°C, TJ=-40 to +125°C | typ 20 mV | 14 |
| CC Pin Thresholds, Assumes PWR=4’h7 vBC_LVL | BC=2’b00; TA=-40 to +85°C, TJ=-40 to +125°C | min 0.15 · typ 0.2 · max 0.25 V | 14 |
| CC Pin Thresholds, Assumes PWR=4’h7 vBC_LVL | BC=2’b01; TA=-40 to +85°C, TJ=-40 to +125°C | min 0.61 · typ 0.66 · max 0.7 V | 14 |
| CC Pin Thresholds, Assumes PWR=4’h7 vBC_LVL | BC=2’b10; TA=-40 to +85°C, TJ=-40 to +125°C | min 1.16 · typ 1.23 · max 1.31 V | 14 |
| Measure block MDAC step size for each code in MDAC[5:0] register vMDACstepCC | TA=-40 to +85°C, TJ=-40 to +125°C | typ 42 mV | 14 |
| Measure block MDAC step size for each code in MDAC[5:0] register for VBUS measurement vMDACstepVBUS | TA=-40 to +85°C, TJ=-40 to +125°C | typ 420 mV | 14 |
| VBUS threshold at which I_VBUSOK interrupt is triggered. vVBUSthr | Measure block on, PWR[2]=1; TA=-40 to +85°C, TJ=-40 to +125°C | max 4 V | 14 |
| When TOGGLE=1, time at which internal versions of PU_EN1=PU_EN2=0 and PWDN1=PDWN2=1 selected to present externally as a SNK in the DRP toggle tTOG1 | TA=-40 to +85°C, TJ=-40 to +125°C | min 30 · typ 45 · max 60 ms | 14 |
| When TOGGLE=1, time at which internal versions of PU_EN1=1 or PU_EN2=1 and PWDN1=PDWN2=0 selected to present externally as a SRC in the DRP toggle tTOG2 | TA=-40 to +85°C, TJ=-40 to +125°C | min 20 · typ 30 · max 40 ms | 14 |
| Disable time after a full toggle (tTOG1+tTOG2) cycle so as to save power tDIS | TOG_SAVE_PWR2:1=00; TA=-40 to +85°C, TJ=-40 to +125°C | typ 0 ms | 14 |
| Disable time after a full toggle (tTOG1+tTOG2) cycle so as to save power tDIS | TOG_SAVE_PWR2:1=01; TA=-40 to +85°C, TJ=-40 to +125°C | typ 40 ms | 14 |
| Disable time after a full toggle (tTOG1+tTOG2) cycle so as to save power tDIS | TOG_SAVE_PWR2:1=10; TA=-40 to +85°C, TJ=-40 to +125°C | typ 80 ms | 14 |
| Disable time after a full toggle (tTOG1+tTOG2) cycle so as to save power tDIS | TOG_SAVE_PWR2:1=11; TA=-40 to +85°C, TJ=-40 to +125°C | typ 160 ms | 14 |
| Temp. for Vconn Switch Off Tshut | TA=-40 to +85°C, TJ=-40 to +125°C | typ 145 °C | 14 |
| Temp. Hysteresis for Vconn Switch Turn On Thys | TA=-40 to +85°C, TJ=-40 to +125°C | typ 10 °C | 14 |
| Disabled Current Idisable | VDD=3.0 to 5.5 V; Nothing Attached, No I2C Transactions; TA=-40 to +85°C, TJ=-40 to +125°C | typ 0.37 · max 5 uA | 15 |
| Unattached (standby) toggle current Itog | VDD=3.0 to 5.5 V; Nothing attached, TOGGLE=1, PWR[3:0]=1h, WAKE_EN=0, TOG_SAVE_PWR2:1=01; TA=-40 to +85°C, TJ=-40 to +125°C | typ 25 · max 40 uA | 15 |
| BMC PD Standby Current Ipd_stby_meas | VDD=3.0 to 5.5 V; Device Attached, BMC PD Active But Not Sending or Receiving Anything, PWR[3:0]=7h; TA=-40 to +85°C, TJ=-40 to +125°C | typ 40 uA | 15 |
| If a Soft Reset message fails, a Hard Reset is sent after tHardReset of CRCReceiveTimer expiring tHardReset | TA=-40 to +85°C, TJ=-40 to +125°C | max 5 ms | 15 |
| If the FUSB302 cannot send a Hard Reset within tHardResetComplete time because of a busy line, then a I_HARDFAIL interrupt is triggered tHardResetComplete | TA=-40 to +85°C, TJ=-40 to +125°C | max 5 ms | 15 |
| This is the value for which the CRCReceiveTimer expires. The CRCReceiveTimer is started upon the last bit of the EOP of the transmitted packet tReceive | TA=-40 to +85°C, TJ=-40 to +125°C | min 0.9 · max 1.1 ms | 15 |
| Once the CRCReceiveTimer expires, a retry packet has to be sent out within tRetry time. This time is hard to separate externally from tReceive since they both happen sequentially with no visible difference in the CC output tRetry | TA=-40 to +85°C, TJ=-40 to +125°C | max 75 us | 15 |
| If a GoodCRC packet is not received within tReceive for NRETRIES then a Soft Reset packet is sent within tSoftReset time. tSoftReset | TA=-40 to +85°C, TJ=-40 to +125°C | max 5 ms | 15 |
| From receiving a packet, we have to send a GoodCRC in response within tTransmit time. It is measured from the last bit of the EOP of the received packet to the first bit sent of the preamble of the GoodCRC packet tTransmit | TA=-40 to +85°C, TJ=-40 to +125°C | max 195 us | 15 |
| Output Low Voltage VOLINTN | INT_N; VDD=3.0 to 5.5 V; IOL=4 mA; TA=-40 to +85°C, TJ=-40 to +125°C | max 0.4 V | 16 |
| Time from global interrupt mask bit cleared to when INT_N goes LOW TINT_Mask | VDD=3.0 to 5.5 V; TA=-40 to +85°C, TJ=-40 to +125°C | min 50 us | 16 |
| Low-Level Input Voltage VILI2C | SDA, SCL; Standard, Fast, or Fast Mode Plus; VDD=3.0 to 5.5 V; TA=-40 to +85°C, TJ=-40 to +125°C | max 0.51 V | 16 |
| High-Level Input Voltage VIHI2C | SDA, SCL; Standard, Fast, or Fast Mode Plus; VDD=3.0 to 5.5 V; TA=-40 to +85°C, TJ=-40 to +125°C | min 1.32 V | 16 |
| Hysteresis of Schmitt Trigger Inputs VHYS | VDD=3.0 to 5.5 V; TA=-40 to +85°C, TJ=-40 to +125°C | min 94 mV | 16 |
| Input Current of SDA and SCL Pins II2C | VDD=3.0 to 5.5 V; Input Voltage 0.26 V to 2.0 V; TA=-40 to +85°C, TJ=-40 to +125°C | min -10 · max 10 uA | 16 |
| VDD Current when SDA or SCL is HIGH ICCTI2C | VDD=3.0 to 5.5 V; Input Voltage 1.8 V; TA=-40 to +85°C, TJ=-40 to +125°C | min -10 · max 10 uA | 16 |
| Low-Level Output Voltage (Open-Drain) VOLSDA | VDD=3.0 to 5.5 V; IOL=2 mA; TA=-40 to +85°C, TJ=-40 to +125°C | min 0 · max 0.35 V | 16 |
| Low-Level Output Current (Open-Drain) IOLSDA | VDD=3.0 to 5.5 V; VOLSDA=0.4 V; TA=-40 to +85°C, TJ=-40 to +125°C | min 20 mA | 16 |
| Capacitance for Each I/O Pin CI | VDD=3.0 to 5.5 V; TA=-40 to +85°C, TJ=-40 to +125°C | typ 5 pF | 16 |
| CCX Receiver Capacitance CRECV | min 200 · max 600 pF | 32 | |
| VCONN Source Bulk Capacitance CBULK | min 10 · max 220 uF | 32 | |
| VCONN Decoupling Capacitance CVCONN | typ 0.1 uF | 32 | |
| VDD Decoupling Capacitance CVDD1 | typ 0.1 uF | 32 | |
| VDD Decoupling Capacitance CVDD2 | typ 1 uF | 32 | |
| I2C Pull-up Resistors RPU | typ 4.7 kΩ | 32 | |
| INT_N Pull-up Resistor RPU_INT | min 1 · typ 4.7 kΩ | 32 | |
| I2C Pull-up Voltage VPU | Maximum VDD | min 1.71 V | 32 |
Pins, by the datasheet
14- 1 CC2
- Configuration channel for attach, orientation, detach, charging current indication or detection, and USB BMC Power Delivery communication. · p. 3
- 2 VBUS
- VBUS input for attach and detach detection as a device; expected to be an OVP protected input. · p. 3
- 3 VDD
- Input supply voltage. · p. 3
- 4 VDD
- Input supply voltage. · p. 3
- 5 INT_N
- Active LOW interrupt output prompting the processor to read I2C register bits. · p. 3
- 6 SCL
- I2C serial clock connected to the phone-based I2C master. · p. 3
- 7 SDA
- I2C serial data connected to the phone-based I2C master. · p. 3
- 8 GND
- Ground. · p. 3
- 9 GND
- Ground. · p. 3
- 10 CC1
- Configuration channel for attach, orientation, detach, charging current indication or detection, and USB BMC Power Delivery communication. · p. 3
- 11 CC1
- Configuration channel for attach, orientation, detach, charging current indication or detection, and USB BMC Power Delivery communication. · p. 3
- 12 VCONN
- Regulated input switched to the correct CC pin to power USB3.1 full-featured cables and other accessories. · p. 3
- 13 VCONN
- Regulated input switched to the correct CC pin to power USB3.1 full-featured cables and other accessories. · p. 3
- 14 CC2
- Configuration channel for attach, orientation, detach, charging current indication or detection, and USB BMC Power Delivery communication. · p. 3
Ordering codes, by the datasheet
2- FUSB302UCX
- 9-Ball Wafer-Level Chip Scale Package (WLCSP), 0.4 mm Pitch · WLCSP package; -40 to 85°C; Tape and Reel · p. 1
- FUSB302MPX
- 14-Lead MLP 2.5 mm x 2.5 mm, 0.5 mm Pitch · 14-lead MLP package; -40 to 85°C; Tape and Reel · p. 1
Parameters
11- Applications Function
- Controller
- Current - Supply
- 25uA
- Current Limit
- 800mA
- Features
- FIFO buffer；Wake-up function；Low-power mode；Power-on reset
- Junction Temperature(Max)
- 150℃
- Operating Temperature
- -40℃~+85℃
- Quiescent Supply Current
- 25uA
- Standby Current
- 370nA
- USB Protocol
- USB 3.1
- Voltage - Supply
- 2.7V~21V
- Voltage - Supply(Absolute Max)
- 6V
Order codes
1- Fusb302mpxLCSC C442699
Pinout
15| Pin | Name | Type |
|---|---|---|
| 1 | CC2 | Unspecified |
| 2 | VBUS | Unspecified |
| 3 | VDD | Unspecified |
| 4 | VDD | Unspecified |
| 5 | INT_N | Unspecified |
| 6 | SCL | Unspecified |
| 7 | SDA | Unspecified |
| 8 | GND | Unspecified |
| 9 | GND | Unspecified |
| 10 | CC1 | Unspecified |
| 11 | CC1 | Unspecified |
| 12 | VCONN | Unspecified |
| 13 | VCONN | Unspecified |
| 14 | CC2 | Unspecified |
| 15 | EP | Unspecified |
Open-source boards using it
All 5- 2 layers21.5 × 19 mm
- 2 layers90 × 90 mm
PocketPSU elec main
jarrod89/pocketPSU
Input1: - Output1 can be used to supply pocketPSU via a battery - Optional battery charging capability (addon board with BMS)
97 parts2 - 4 layers
- 2 layers40 × 10 mm
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Is there a KiCad symbol and footprint for the FUSB302MPX?
Yes. The symbol is EasyEDA_Cloud:FUSB302MPX and the footprint EasyEDA_Cloud:MLP-14_L2.5-W2.5-P0.50-BL-EP, both drawn on this page. PCBKit places them on a board for you when you design with it.
What package is the FUSB302MPX?
WFQFN-14(2.5x2.5), with 15 pins. Its footprint is drawn on this page.
Where is the FUSB302MPX datasheet?
onsemi publishes it: the Datasheet link on this page opens it.
Where can I order the FUSB302MPX?
JLCPCB lists it as part C442699, with 3,910 in stock; the sellers' links on this page open their listings.
What can replace the FUSB302MPX?
Parts like it in the library: the FUSB302TMPX by onsemi, the FUSB302TV01MPX by onsemi, the FUSB302BVMPX by onsemi and the FUSB302TVMPX by onsemi. Check their datasheets: a part that fits the footprint may still differ in its ratings.
Which open-source boards use the FUSB302MPX?
5 boards in 5 repositories on GitHub; the most starred are listed on this page, with their KiCad files.
Parts like it
8
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