
Data center rdimm ddr4-tester
antmicro/rdimm-ddr4-tester
Experimental platform built around Xilinx Kintex-7 FPGA for development and customization of RAM controllers supporting RDIMM DDR4 RAM modules used in data centers.
MurataExtended
26mΩ 4.4A 6.1A 680nH Wire-wound chip inductor ±20% 1210 Power Inductors ROHS
The DFE322512F-R68M=P2 is an inductor made by Murata in a 1210 package with 2 pins. 26mΩ 4.4A 6.1A 680nH Wire-wound chip inductor ±20% 1210 Power Inductors ROHS.
PCBKit's library has its KiCad symbol (Device:L, from KiCad's library) and its footprint (Inductor_SMD:L_1210_3225Metric, from KiCad's library), ready for a KiCad board. 2,936 are in stock at JLCPCB (part C1136650). 1 open-source board in 1 repository on GitHub use it.
| Parameter | Conditions | As printed | Page |
|---|---|---|---|
| Inductance Nominal Value | DFE322512F-R68M=P2; test frequency 1MHz, level 0.5V | typ 0.68 uH | 2 |
| Inductance Tolerance | DFE322512F-R68M=P2 | min -20 · max 20 % | 2 |
| DC Resistance | DFE322512F-R68M=P2 | max 26 mΩ | 2 |
| Rated Current Based on Inductance Change | DFE322512F-R68M=P2; initial inductance decreases by 30% | max 6.1 A | 2 |
| Rated Current Based on Temperature rise | DFE322512F-R68M=P2; 40℃ temperature rise on manufacturer's 6-layer test PCB | max 4.4 A | 2 |
| Withstand voltage | DC | max 20 V | 2 |
| Bending test L | Change from initial inductance after bending to 2mm at about 0.5mm/s and holding for 30±5 s | min -10 · max 10 % | 3 |
| Adhesion strength L | Change from initial inductance after static load with R0.5 pressing tool, held for 60±5 s; measured after removing pressure | min -10 · max 10 % | 3 |
| Vibration L | Change from initial inductance; 1.5mm amplitude, 10–55–10Hz sweep per minute, 2 h per axis | min -10 · max 10 % | 3 |
| Mechanical shock L | Change from initial inductance; peak acceleration 1962 m/s2, pulse duration 6 ms, 3 times per axis | min -10 · max 10 % | 3 |
| Free fall test L | Change from initial inductance; test board attached to 500g fixture, dropped from 100cm onto rigid wood, 3 times per axis | min -10 · max 10 % | 3 |
| Solder ability | New solder coverage of immersed electrode surface; soldering at 245±5℃ for 3±0.5s after preheat | min 90 % | 3 |
| Resistance to soldering heat L | Change from initial inductance after two specified reflow processes; measured after 1 h at standard atmospheric conditions | min -10 · max 10 % | 3 |
| Low temperature L | Change from initial inductance; -40±3℃ for 500±12 h, stabilized for 1 h, measured within 1 h | min -10 · max 10 % | 4 |
| Dry heat L | Change from initial inductance; 125±2℃ for 500±12 h, stabilized for 1 h, measured within 1 h | min -10 · max 10 % | 4 |
| Damp heat L | Change from initial inductance; 60±2℃, 90–95% relative humidity for 500±12 h, stabilized for 1 h, measured within 1 h | min -10 · max 10 % | 4 |
| Temperature cycle L | Change from initial inductance; 500 cycles between -40℃ and 125℃, 30 min at each temperature, transit 2min or less | min -10 · max 10 % | 4 |
| Inductance temperature coefficient | Temperature drift; measured from -40℃ to 125℃ | max 1000 ppm/℃ | 4 |
| Operating temperature range | Including self temperature rise (⊿T=40℃ max.) | min -40 · max 125 ℃ | 4 |
| Storage temperature range | min -40 · max 85 ℃ | 4 |

antmicro/rdimm-ddr4-tester
Experimental platform built around Xilinx Kintex-7 FPGA for development and customization of RAM controllers supporting RDIMM DDR4 RAM modules used in data centers.
Yes. The symbol is Device:L and the footprint Inductor_SMD:L_1210_3225Metric, both drawn on this page. PCBKit places them on a board for you when you design with it.
1210, with 2 pins. Its footprint is drawn on this page.
Murata publishes it: the Datasheet link on this page opens it.
JLCPCB lists it as part C1136650, with 2,936 in stock; the sellers' links on this page open their listings.
1 board in 1 repository on GitHub; the most starred are listed on this page, with their KiCad files.