

Overview
The USB2514B-I/M2 is a USB HUB Controller made by Microchip Technology in a SQFN-36-EP(6x6) package with 37 pins. -40℃~+85℃ 3.3V 4 Hub I2C USB 2.0 SQFN-36-EP(6x6) USB HUB Controllers ROHS.
PCBKit's library has its KiCad symbol (EasyEDA_Cloud:USB2514BI-AEZG, from EasyEDA) and its footprint (EasyEDA_Cloud:SQFN-36_L6.0-W6.0-P0.50-BL-EP, from EasyEDA), ready for a KiCad board. 1,168 are in stock at JLCPCB (part C220679). 20 open-source boards in 14 repositories on GitHub use it.
Symbol
Footprint
From the datasheet
8- Supply, least
- 3 V · VDD33, recommended operating min · p. 39
- Supply, most
- 3.6 V · VDD33, recommended operating max · p. 39
- Supply, absolute maximum
- 4.6 V · VDD33, absolute max · p. 39
- Works from
- -40 °C · Industrial operating ambient min · p. 39
- Works up to
- 85 °C · Industrial operating ambient max · p. 39
- Takes working
- 70 mA · Configured hi-speed host, one downstream port base current, typical · p. 41
- Takes asleep
- 550 µA · Suspend, all supplies combined, typical · p. 42
- Takes working
- 50 mA · typical configured full-speed host, one downstream port base current · p. 42
What it is and has
10- USB compliance
- USB 2.0 · p. 1
- USB termination
- Integrated termination and pull-up/pull-down resistors · p. 4
- Power modes
- Self-powered or bus-powered · p. 1
- Package option
- 36-pin SQFN, 6x6 mm, preferred · p. 1
- Package option
- 36-pin QFN, 6x6 mm, legacy · p. 1
- Controller
- USB 2.0 Hi-Speed Hub Controller · p. 1
- Downstream ports
- 4 · p. 46
- Power management
- Individual or ganged power control of each downstream port · p. 1
- Supply
- Single external 3.3 V supply · p. 1
- Package
- 36-lead SQFN, 6x6x0.9 mm · p. 46
Around it
4- res 100 k
- between upstream VBUS and VBUS_DET; Upper resistor of suggested 2:1 voltage divider for a detachable hub; use with another 100 k resistor to ground. · p. 12
- res 12.0 k (+/- 1%)
- between RBIAS and GND; Sets USB transceiver internal bias. · p. 12
- crystal 24 MHz 350 ppm
- between XTALIN and XTALOUT; Parallel resonant, fundamental mode. · p. 44
- cap 18 pF
- between XTALIN and GND; C1, typical approximate value; calculate from crystal and board capacitances using Figure 7-2. · p. 44
Specifications
54| Parameter | Conditions | As printed | Page |
|---|---|---|---|
| Storage Temperature TSTOR | min -55 · max 150 °C | 39 | |
| 3.3 V supply voltage VDD33, VDDA33 | Applies to all packages | max 4.6 V | 39 |
| Voltage on any I/O pin | min -0.5 · max 5.5 V | 39 | |
| Voltage on XTALIN | min -0.5 · max 4 V | 39 | |
| Voltage on XTALOUT | min -0.5 · max 2.5 V | 39 | |
| Industrial Operating Temperature TAI | USB2514Bi; ambient temperature in still air | min -40 · max 85 °C | 39 |
| 3.3 V supply voltage VDD33, VDDA33 | Applies to all parts | min 3 · max 3.6 V | 39 |
| 3.3 V supply rise time tRT33 | See Figure 6-1 and Note 6-2 | min 0 · max 400 s | 39 |
| Voltage on any I/O pin | If any 3.3 V supply voltage drops below 3.0 V, MAX becomes (3.3 V supply voltage) + 0.5 | min -0.3 · max 5.5 V | 39 |
| Voltage on XTALIN | Maximum is VDD33 | min -0.3 V | 39 |
| Low Input Level VILI | I, IS Type Input Buffer; TTL Levels | max 0.8 V | 40 |
| High Input Level VIHI | I, IS Type Input Buffer | min 2 V | 40 |
| Input Leakage IIL | I, IS Type Input Buffer; VIN = 0 to VDD33 | min -10 · max 10 A | 40 |
| Hysteresis (IS only) VHYSI | I, IS Type Input Buffer | min 250 · max 350 mV | 40 |
| Low Input Level VILI | Input Buffer with Pull-Up (IPU); TTL Levels | max 0.8 V | 40 |
| High Input Level VIHI | Input Buffer with Pull-Up (IPU) | min 2 V | 40 |
| Low Input Leakage IILL | Input Buffer with Pull-Up (IPU); VIN = 0 | min 35 · max 90 A | 40 |
| High Input Leakage IIHL | Input Buffer with Pull-Up (IPU); VIN = VDD33 | min -10 · max 10 A | 40 |
| Low Input Level VILI | Input Buffer with Pull-Down (IPD); TTL Levels | max 0.8 V | 40 |
| High Input Level VIHI | Input Buffer with Pull-Down (IPD) | min 2 V | 40 |
| Low Input Leakage IILL | Input Buffer with Pull-Down (IPD); VIN = 0 | min 10 · max -10 A | 40 |
| High Input Leakage IIHL | Input Buffer with Pull-Down (IPD); VIN = VDD33 | min -35 · max -90 A | 40 |
| Low Input Level VILCK | ICLK Input Buffer | max 0.3 V | 40 |
| High Input Level VIHCK | ICLK Input Buffer | min 0.9 V | 40 |
| Input Leakage IIL | ICLK Input Buffer; VIN = 0 to VDD33 | min -10 · max 10 A | 40 |
| Low Output Level VOL | O12, I/O12 & I/OSD12 Type Buffer; IOL = 12 mA @ VDD33 = 3.3 V | max 0.4 V | 41 |
| High Output Level VOH | O12, I/O12 & I/OSD12 Type Buffer; IOH = -12 mA @ VDD33 = 3.3 V | min 2.4 V | 41 |
| Output Leakage IOL | O12, I/O12 & I/OSD12 Type Buffer; pins in high impedance | min -10 · max 10 A | 41 |
| Hysteresis (SD pad only) IHYSC | O12, I/O12 & I/OSD12 Type Buffer; VIN = VDD33 | min 250 · max 350 mV | 41 |
| Supply Current Unconfigured: Hi-Speed Host ICCINTHS | USB2514B/14Bi | typ 45 · max 50 mA | 41 |
| Supply Current Unconfigured: Full-Speed Host ICCINTFS | USB2514B/14Bi | typ 35 · max 40 mA | 41 |
| Supply Current Configured Hi-Speed Host IHCH1 | USB2514Bi; base current of one downstream port | typ 70 · max 85 mA | 41 |
| Supply Current Configured Hi-Speed Host, each additional downstream port IHCH1 | USB2514Bi; added to one-port base current | typ 25 · max 25 mA | 41 |
| Supply Current Configured: Full-Speed Host IFCC1 | USB2514Bi; base current of one downstream port | typ 50 · max 65 mA | 42 |
| Supply Current Configured Full-Speed Host, each additional downstream port IFCC1 | USB2514Bi; added to one-port base current | typ 8 · max 8 mA | 42 |
| Supply Current Suspend ICSBY | USB2514Bi; all supplies combined | typ 550 · max 1500 A | 42 |
| Supply Current Reset ICRST | USB2514Bi; all supplies combined | typ 750 · max 1600 A | 42 |
| Clock Input Capacitance CXTAL | All pins except USB pins and the pins under test tied to AC ground; TA = 25°C; fc = 1 MHz; VDD33 = 3.3 V | max 6 pF | 42 |
| Input Capacitance CIN | All pins except USB pins and the pins under test tied to AC ground; TA = 25°C; fc = 1 MHz; VDD33 = 3.3 V | max 6 pF | 42 |
| Output Capacitance COUT | All pins except USB pins and the pins under test tied to AC ground; TA = 25°C; fc = 1 MHz; VDD33 = 3.3 V | max 6 pF | 42 |
| Junction-to-ambient-temperature JA | USB2514B/14Bi; velocity 0 meters/s; exposed pad soldered to thermal vias in multilayer 2S2P PCB per JESD51 | typ 40.1 °C/W | 43 |
| Junction-to-ambient-temperature JA | USB2514B/14Bi; velocity 1 meters/s; exposed pad soldered to thermal vias in multilayer 2S2P PCB per JESD51 | typ 35 °C/W | 43 |
| Junction-to-bottom-of-case JT | USB2514B/14Bi; velocity 0 meters/s; description as printed in Table 6-9 | typ 0.5 °C/W | 43 |
| Junction-to-bottom-of-case JT | USB2514B/14Bi; velocity 1 meters/s; description as printed in Table 6-9 | typ 0.7 °C/W | 43 |
| Junction-to-top-of-package JC | USB2514B/14Bi; velocity 0 meters/s; description as printed in Table 6-9 | typ 6.3 °C/W | 43 |
| Junction-to-top-of-package JC | USB2514B/14Bi; velocity 1 meters/s; description as printed in Table 6-9 | typ 6.3 °C/W | 43 |
| Supply Current Configured Full-Speed Host IFCC1 | USB2514Bi; base current of one downstream port | typ 50 · max 65 mA | 42 |
| Supply Current Configured Full-Speed Host, each additional downstream port IFCC1 | USB251xB/xBi; added to one-port base current | typ 8 · max 8 mA | 42 |
| Junction-to-ambient-temperature JA | USB2514B/14Bi; velocity 0 meters/s; exposed pad soldered to thermal vias in a multilayer 2S2P PCB per JESD51 | typ 40.1 °C/W | 43 |
| Junction-to-ambient-temperature JA | USB2514B/14Bi; velocity 1 meters/s; exposed pad soldered to thermal vias in a multilayer 2S2P PCB per JESD51 | typ 35 °C/W | 43 |
| Junction-to-bottom-of-case JT | USB2514B/14Bi; velocity 0 meters/s; exposed pad soldered to thermal vias in a multilayer 2S2P PCB per JESD51 | typ 0.5 °C/W | 43 |
| Junction-to-bottom-of-case JT | USB2514B/14Bi; velocity 1 meters/s; exposed pad soldered to thermal vias in a multilayer 2S2P PCB per JESD51 | typ 0.7 °C/W | 43 |
| Junction-to-top-of-package JC | USB2514B/14Bi; velocity 0 meters/s; exposed pad soldered to thermal vias in a multilayer 2S2P PCB per JESD51 | typ 6.3 °C/W | 43 |
| Junction-to-top-of-package JC | USB2514B/14Bi; velocity 1 meters/s; exposed pad soldered to thermal vias in a multilayer 2S2P PCB per JESD51 | typ 6.3 °C/W | 43 |
Parameters
12- Current - Supply
- 70mA
- Data Rate
- 480Mbps
- Features
- Port power switch control
- Memory Interface
- I2C
- Number of Channels
- 4
- Operating Temperature
- -40℃~+85℃
- Quiescent Supply Current
- 550uA
- Standby Current
- 550uA
- USB Protocol
- USB 2.0
- Voltage - Supply
- 3V~3.6V
- Voltage - Supply(Absolute Max)
- 4.6V
- type
- Hub
Order codes
1- USB2514B-I/M2LCSC C220679
Pinout
37| Pin | Name | Type |
|---|---|---|
| 1 | USBDM_DN1/PRT_DIS_M1 | Unspecified |
| 2 | USBDP_DN1/PRT_DIS_P1 | Unspecified |
| 3 | USBDM_DN2/PRT_DIS_M2 | Unspecified |
| 4 | USBDP_DN2/PRT_DIS_P2 | Unspecified |
| 5 | VDDA33 | Unspecified |
| 6 | USBDM_DN3/PRT_DIS_M3 | Unspecified |
| 7 | USBDP_DN3/PRT_DIS_P3 | Unspecified |
| 8 | USBDM_DN4/PRT_DIS_M4 | Unspecified |
| 9 | USBDP_DN4/PRT_DIS_P4 | Unspecified |
| 10 | VDDA33 | Unspecified |
| 11 | TEST | Unspecified |
| 12 | PRTPWR1/BC_EN1 | Unspecified |
| 13 | OCS_N1 | Unspecified |
| 14 | CRFILT | Unspecified |
| 15 | VDD33 | Unspecified |
| 16 | PRTPWR2/BC_EN2 | Unspecified |
| 17 | OCS_N2 | Unspecified |
| 18 | PRTPWR3/BC_EN3 | Unspecified |
| 19 | OCS_N3 | Unspecified |
| 20 | PRTPWR4/BC_EN4 | Unspecified |
| 21 | OCS_N4 | Unspecified |
| 22 | SDA/SMBBATA/NON_REM1 | Unspecified |
| 23 | VDD33 | Unspecified |
| 24 | SCL/SMBCLK/CFG_SEL0 | Unspecified |
| 25 | HS_IND/CFG_SEL1 | Unspecified |
| 26 | RESET_N | Unspecified |
| 27 | VBUS_DET | Unspecified |
| 28 | SUSP_IND/LOCAL_PWR/NON_REM0 | Unspecified |
| 29 | VDDA33 | Unspecified |
| 30 | USBDM_UP | Unspecified |
| 31 | USBDP_UP | Unspecified |
| 32 | XTALOUT | Unspecified |
| 33 | XTALIN/CLKIN | Unspecified |
| 34 | PLLFILT | Unspecified |
| 35 | RBIAS | Unspecified |
| 36 | VDDA33 | Unspecified |
| 37 | EP | Unspecified |
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Bachelor Main PCB
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Is there a KiCad symbol and footprint for the USB2514B-I/M2?
Yes. The symbol is EasyEDA_Cloud:USB2514BI-AEZG and the footprint EasyEDA_Cloud:SQFN-36_L6.0-W6.0-P0.50-BL-EP, both drawn on this page. PCBKit places them on a board for you when you design with it.
What package is the USB2514B-I/M2?
SQFN-36-EP(6x6), with 37 pins. Its footprint is drawn on this page.
Where is the USB2514B-I/M2 datasheet?
Microchip Technology publishes it: the Datasheet link on this page opens it.
Where can I order the USB2514B-I/M2?
JLCPCB lists it as part C220679, with 1,168 in stock; the sellers' links on this page open their listings.
Which open-source boards use the USB2514B-I/M2?
20 boards in 14 repositories on GitHub; the most starred are listed on this page, with their KiCad files.