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TC6320TG-G on a board, in 3D

TC6320TG-G

Microchip Technology

-55℃~+150℃ 1 N-Channel + 1 P-Channel 110pF 1V 200V 23pF 2A 8Ω@10V SOIC-8 MOSFETs ROHS

Extended
DatasheetJLCPCBLCSCmicrochip/TC6320TG-G
Category
MOSFETs
Package
SOIC-8
Pins
8

Overview

The TC6320TG-G is a MOSFET made by Microchip Technology in a SOIC-8 package with 8 pins. -55℃~+150℃ 1 N-Channel + 1 P-Channel 110pF 1V 200V 23pF 2A 8Ω@10V SOIC-8 MOSFETs ROHS.

PCBKit's library has its KiCad symbol (EasyEDA_Cloud:TC2320TG-G, from EasyEDA) and its footprint (Package_SO:SOIC-8_3.9x4.9mm_P1.27mm, from KiCad's library), ready for a KiCad board. 1,092 are in stock at JLCPCB (part C624992). 7 open-source boards in 4 repositories on GitHub use it.

Symbol

SN1GN2SP3GP4DP5DP6DN7DN8
EasyEDA_Cloud:TC2320TG-GFrom EasyEDA

Footprint

12345678
Package_SO:SOIC-8_3.9x4.9mm_P1.27mmFrom KiCad's library

From the datasheet

9
Works from
-55 °C · min operating ambient temperature · p. 5
Works up to
150 °C · max operating ambient temperature · p. 5
Drain-source, most
200 V · N-channel max drain-to-source voltage; min breakdown at VGS = 0V, ID = 2 mA · p. 4
Gate threshold
2 V · N-channel max, VGS = VDS, ID = 1 mA · p. 4
Gate threshold
2.4 V · P-channel max, VGS = VDS, ID = –1 mA · p. 5
On resistance
8 Ω · N-channel max, VGS = 4.5V, ID = 150 mA · p. 4
On resistance
7 Ω · N-channel max, VGS = 10V, ID = 1A · p. 4
On resistance
10 Ω · P-channel max, VGS = –4.5V, ID = –150 mA · p. 5
Junction to air (8-lead SOIC)
101 K/W · typical, 1 oz., four-layer, 3” x 4” PCB · p. 5

What it is and has

7
Device type
N-Channel and P-Channel Enhancement-Mode MOSFET Pair · p. 1
Integrated resistor
Gate-to-source resistor · p. 1
Integrated clamp
Gate-to-source Zener diode · p. 1
Threshold
Low threshold · p. 1
On-resistance
Low on-resistance · p. 1
Package
8-lead SOIC · p. 12
Environmental
Lead (Pb)-free/RoHS-compliant package · p. 12

Specifications

48
ParameterConditionsAs printedPage
Operating Ambient Temperature TAmin -55 · max 150 °C4
Storage Temperature TSmin -55 · max 150 °C4
Drain-to-source Breakdown Voltage BVDSSTA = TJ = 25°C; VGS = 0V, ID = 2 mAmin 200 V4
Gate Threshold Voltage VGS(th)TA = TJ = 25°C; VGS = VDS, ID = 1 mAmin 1 · max 2 V4
Change in VGS(th) with Temperature ∆VGS(th)VGS = VDS, ID = 1 mA (Note 2)max -4.5 mV/°C4
Gate-to-source Shunt Resistor RGSTA = TJ = 25°C; IGS = 100 uAmin 10 · max 50 kΩ4
Gate-to-Source Zener Voltage VZGSTA = TJ = 25°C; IGS = 2 mAmin 13.2 · max 25 V4
Zero-gate Voltage Drain Current IDSSTA = TJ = 25°C; VDS = Maximum rating, VGS = 0Vmax 10 uA4
Zero-gate Voltage Drain Current IDSSVDS = 0.8 Maximum rating, VGS = 0V, TA = 125°C (Note 2)max 1 mA4
On-state Drain Current ID(ON)TA = TJ = 25°C; VGS = 4.5V, VDS = 25Vmin 1 A4
On-state Drain Current ID(ON)TA = TJ = 25°C; VGS = 10V, VDS = 25Vmin 2 A4
Static Drain-to-source On-state Resistance RDS(ON)TA = TJ = 25°C; VGS = 4.5V, ID = 150 mAmax 8 Ω4
Static Drain-to-source On-state Resistance RDS(ON)TA = TJ = 25°C; VGS = 10V, ID = 1Amax 7 Ω4
Change in RDS(ON) with Temperature ∆RDS(ON)VGS = 4.5V, ID = 150 mA (Note 2)max 1 %/°C4
Forward Transconductance GFSTA = TJ = 25°C; VDS = 25V, ID = 500 mA; Note 2min 400 mmho4
Input Capacitance CISSTA = TJ = 25°C; VGS = 0V, VDS = 25V, f = 1 MHz; Note 2max 110 pF4
Common Source Output Capacitance COSSTA = TJ = 25°C; VGS = 0V, VDS = 25V, f = 1 MHz; Note 2max 60 pF4
Reverse Transfer Capacitance CRSSTA = TJ = 25°C; VGS = 0V, VDS = 25V, f = 1 MHz; Note 2max 23 pF4
Turn-on Delay Time td(ON)TA = TJ = 25°C; VDD = 25V, ID = 1A, RGEN = 25Ω; Note 2max 10 ns4
Rise Time trTA = TJ = 25°C; VDD = 25V, ID = 1A, RGEN = 25Ω; Note 2max 15 ns4
Turn-off Delay Time td(OFF)TA = TJ = 25°C; VDD = 25V, ID = 1A, RGEN = 25Ω; Note 2max 20 ns4
Fall Time tfTA = TJ = 25°C; VDD = 25V, ID = 1A, RGEN = 25Ω; Note 2max 15 ns4
Diode Forward Voltage Drop VSDTA = TJ = 25°C; VGS = 0V, ISD = 500 mA (Note 1)max 1.8 V4
Reverse Recovery Time trrTA = TJ = 25°C; VGS = 0V, ISD = 500 mA (Note 2)typ 300 ns4
Drain-to-source Breakdown Voltage BVDSSTA = TJ = 25°C; VGS = 0V, ID = –2 mAmin -200 V5
Gate Threshold Voltage VGS(th)TA = TJ = 25°C; VGS = VDS, ID = –1 mAmin -1 · max -2.4 V5
Change in VGS(th) with Temperature ∆VGS(th)VGS = VDS, ID = –1 mA (Note 2)max 4.5 mV/°C5
Gate-to-Source Zener Voltage VZGSTA = TJ = 25°C; IGS = –2 mAmin 13.2 · max 25 V5
Zero-gate Voltage Drain Current IDSSTA = TJ = 25°C; VDS = Maximum rating, VGS = 0Vmax -10 uA5
Zero-gate Voltage Drain Current IDSSVDS = 0.8 Maximum rating, VGS = 0V, TA = 125°C (Note 2)max -1 mA5
On-state Drain Current ID(ON)TA = TJ = 25°C; VGS = –4.5V, VDS = –25Vmin -1 A5
On-state Drain Current ID(ON)TA = TJ = 25°C; VGS = –10V, VDS = –25Vmin -2 A5
Static Drain-to-source On-state Resistance RDS(ON)TA = TJ = 25°C; VGS = –4.5V, ID = –150 mAmax 10 Ω5
Static Drain-to-source On-state Resistance RDS(ON)TA = TJ = 25°C; VGS = –10V, ID = –1Amax 8 Ω5
Change in RDS(ON) with Temperature ∆RDS(ON)VGS = –10V, ID = –200 mA (Note 2)max 1 %/°C5
Forward Transconductance GFSTA = TJ = 25°C; VDS = –25V, ID = –500 mA; Note 2min 400 mmho5
Input Capacitance CISSTA = TJ = 25°C; VGS = 0V, VDS = –25V, f = 1 MHz; Note 2max 200 pF5
Common Source Output Capacitance COSSTA = TJ = 25°C; VGS = 0V, VDS = –25V, f = 1 MHz; Note 2max 55 pF5
Reverse Transfer Capacitance CRSSTA = TJ = 25°C; VGS = 0V, VDS = –25V, f = 1 MHz; Note 2max 30 pF5
Turn-on Delay Time td(ON)TA = TJ = 25°C; VDD = –25V, ID = –1A, RGEN = 25Ω; Note 2max 10 ns5
Rise Time trTA = TJ = 25°C; VDD = –25V, ID = –1A, RGEN = 25Ω; Note 2max 15 ns5
Turn-off Delay Time td(OFF)TA = TJ = 25°C; VDD = –25V, ID = –1A, RGEN = 25Ω; Note 2max 20 ns5
Fall Time tfTA = TJ = 25°C; VDD = –25V, ID = –1A, RGEN = 25Ω; Note 2max 15 ns5
Diode Forward Voltage Drop VSDTA = TJ = 25°C; VGS = 0V, ISD = –500 mA (Note 1)max -1.8 V5
Reverse Recovery Time trrTA = TJ = 25°C; VGS = 0V, ISD = –500 mA (Note 2)typ 300 ns5
Operating Ambient Temperature TAmin -55 · max 150 °C5
Storage Temperature TSmin -55 · max 150 °C5
8-lead SOIC JA8-lead SOIC; Note 1: 1 oz., four-layer, 3” x 4” PCBtyp 101 °C/W5

Pins, by the datasheet

8
1 SN
Source N-channel. · p. 6
2 GN
Gate N-channel. · p. 6
3 SP
Source P-channel. · p. 6
4 GP
Gate P-channel. · p. 6
5 DP
Drain P-channel. · p. 6
6 DP
Drain P-channel. · p. 6
7 DN
Drain N-channel. · p. 6
8 DN
Drain N-channel. · p. 6

Ordering codes, by the datasheet

2
TC6320K6-G
8-lead (4x4) VDFN · Lead (Pb)-free/RoHS-compliant; 3300/Reel · p. 12
TC6320TG-G
8-lead SOIC · Lead (Pb)-free/RoHS-compliant; 3300/Reel · p. 12

Parameters

11
Current - Continuous Drain(Id)
2A
Drain to Source Voltage
200V
Gate Threshold Voltage (Vgs(th))
1V
Input Capacitance(Ciss)
110pF
Number
1 N-Channel + 1 P-Channel
Operating Temperature
-55℃~+150℃
Output Capacitance(Coss)
60pF
RDS(on)
8Ω@10V
Reverse Transfer Capacitance (Crss@Vds)
23pF
Thermal Resistance(Junction to Ambient)
101℃/W
Type
N-Channel + P-Channel

Order codes

1

Pinout

8
The pins of the TC6320TG-G
PinNameType
1SNUnspecified
2GNUnspecified
3SPUnspecified
4GPUnspecified
5DPUnspecified
6DPUnspecified
7DNUnspecified
8DNUnspecified

Open-source boards using it

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Questions

Is there a KiCad symbol and footprint for the TC6320TG-G?

Yes. The symbol is EasyEDA_Cloud:TC2320TG-G and the footprint Package_SO:SOIC-8_3.9x4.9mm_P1.27mm, both drawn on this page. PCBKit places them on a board for you when you design with it.

What package is the TC6320TG-G?

SOIC-8, with 8 pins. Its footprint is drawn on this page.

Where is the TC6320TG-G datasheet?

Microchip Technology publishes it: the Datasheet link on this page opens it.

Where can I order the TC6320TG-G?

JLCPCB lists it as part C624992, with 1,092 in stock; the sellers' links on this page open their listings.

What can replace the TC6320TG-G?

Parts like it in the library: the IRF7820TRPBF by Infineon Technologies, the VBA1203M by VBsemi Elec, the SI4490DY by Vishay Intertechnology and the FDS2734 by onsemi. Check their datasheets: a part that fits the footprint may still differ in its ratings.

Which open-source boards use the TC6320TG-G?

7 boards in 4 repositories on GitHub; the most starred are listed on this page, with their KiCad files.

Parts like it

8