
MXLSMLG58CAE3
Microchip Technology
-65℃~+150℃ 2uA 32A 3kW 58V 64.4V 93.6V Bidirectional IEC 61000-4-2、IEC 61000-4-5、IEC 61000-4-4 TVS DO-215AB(SMLG) ESD and Surge Protection (TVS/ESD) ROHS
- Category
- ESD And Surge Protection (TVS, ESD)
- Package
- DO-215AB(SMLG)
- Pins
- 2
Overview
The MXLSMLG58CAE3 is an ESD And Surge Protection made by Microchip Technology in a DO-215AB(SMLG) package with 2 pins. -65℃~+150℃ 2uA 32A 3kW 58V 64.4V 93.6V Bidirectional IEC 61000-4-2、IEC 61000-4-5、IEC 61000-4-4 TVS DO-215AB(SMLG) ESD and Surge Protection (TVS/ESD) ROHS.
PCBKit's library has its KiCad symbol (Device:D_TVS, from KiCad's library) and its footprint (EasyEDA_Cloud:DO-215AB_L6.9-W5.9-LS9.9-BI, from EasyEDA), ready for a KiCad board. JLCPCB lists it (part C2627645).
Symbol
Footprint
Parameters
6- Breakdown Voltage
- 64.4V
- Maximum Clamping Voltage
- 93.6V
- Peak Pulse Current (Ipp)@10/1000us
- 32A
- Peak Pulse Power Dissipation (Ppp)@10/1000us
- 3kW
- Reverse Stand-Off Voltage (Vrwm)
- 58V
- Type
- TVS
Order codes
1- MXLSMLG58CAE3LCSC C2627645
Pinout
2| Pin | Name | Type |
|---|---|---|
| 1 | A1 | Passive |
| 2 | A2 | Passive |
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Is there a KiCad symbol and footprint for the MXLSMLG58CAE3?
Yes. The symbol is Device:D_TVS and the footprint EasyEDA_Cloud:DO-215AB_L6.9-W5.9-LS9.9-BI, both drawn on this page. PCBKit places them on a board for you when you design with it.
What package is the MXLSMLG58CAE3?
DO-215AB(SMLG), with 2 pins. Its footprint is drawn on this page.
Where is the MXLSMLG58CAE3 datasheet?
Microchip Technology publishes it: the Datasheet link on this page opens it.
Where can I order the MXLSMLG58CAE3?
JLCPCB lists it as part C2627645, with 0 in stock; the sellers' links on this page open their listings.
What can replace the MXLSMLG58CAE3?
Parts like it in the library: the SMCG58CA-HRA by Littelfuse, the MASMCG58CA by Microchip Technology, the MASMLG58CA/TR by Microchip Technology and the MSMLG58CA by Microchip Technology. Check their datasheets: a part that fits the footprint may still differ in its ratings.
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