MCP4812-E/MS
Microchip TechnologyExtended
-40℃~+125℃ 10 2 2.7V~5.5V 3.5LSB 4.5us 415uA Integrated buffer、Power-on reset、Power-down mode、Multi-chip synchronization、Programmable gain、Built-in reference source SPI Voltage Buffer MSOP-8 Digital to Analog Converters (DAC) ROHS
- Part id
- microchip/MCP4812-E/MS
- Category
- Digital To Analog Converters (DAC)
- Package
- MSOP-8
- Pins
- 8
- In stock
- 39 at JLCPCB (C219484)
Overview
The MCP4812-E/MS is a digital To Analog Converter made by Microchip Technology in a MSOP-8 package with 8 pins. -40℃~+125℃ 10 2 2.7V~5.5V 3.5LSB 4.5us 415uA Integrated buffer、Power-on reset、Power-down mode、Multi-chip synchronization、Programmable gain、Built-in reference source SPI Voltage Buffer MSOP-8 Digital to Analog Converters (DAC) ROHS.
PCBKit's library has its KiCad symbol (Analog_DAC:MCP4812, from KiCad's library) and its footprint (Package_SO:MSOP-8_3x3mm_P0.65mm, from KiCad's library), ready for a KiCad board. 39 are in stock at JLCPCB (part C219484).
Symbol
Footprint
From the datasheet
11- Supply, least
- 2.7 V · VDD, recommended operating min · p. 3
- Supply, most
- 5.5 V · VDD, recommended operating max · p. 3
- Supply, absolute maximum
- 6.5 V · VDD, absolute max · p. 3
- Works from
- -40 °C · Operating ambient temperature min · p. 7
- Works up to
- 125 °C · Operating ambient temperature max; reduced performance · p. 7
- Junction, hottest
- 150 °C · Junction temperature absolute max · p. 3
- Takes working
- 415 µA · VDD input current typical, outputs unloaded, code 0x000h · p. 3
- Takes at most
- 750 µA · VDD input current max, outputs unloaded, code 0x000h · p. 3
- Takes asleep
- 3.3 µA · Software shutdown current typical · p. 3
- A pin gives at most
- 25 mA · Output pin current absolute max magnitude · p. 3
- Junction to air (8L-MSOP)
- 211 K/W · Junction-to-ambient thermal resistance typical · p. 7
What it is and has
8- DAC
- Dual 10-bit voltage output · p. 1
- Output
- Rail-to-rail · p. 1
- SPI
- 20 MHz clock support · p. 1
- Simultaneous update
- Dual DAC latching with LDAC pin · p. 1
- Settling time
- 4.5 µs · p. 1
- Output gain
- Selectable unity or 2x · p. 1
- Internal voltage reference
- 2.048V · p. 1
- Package options
- 8-pin PDIP, SOIC, MSOP · p. 1
Around it
2- cap 0.1 µF
- between VDD and VSS; Ceramic bypass capacitor, in parallel with 10 uF tantalum; place within 4 mm of the device power pin. · p. 25
- cap 10 µF
- between VDD and VSS; Tantalum bypass capacitor, in parallel with 0.1 uF ceramic; place within 4 mm of the device power pin. · p. 25
Specifications
74| Parameter | Conditions | As printed | Page |
|---|---|---|---|
| VDD VDD | max 6.5 V | 3 | |
| Current at Input Pins | min -2 · max 2 mA | 3 | |
| Current at Supply Pins | min -50 · max 50 mA | 3 | |
| Current at Output Pins | min -25 · max 25 mA | 3 | |
| Storage temperature | min -65 · max 150 °C | 3 | |
| Ambient temp. with power applied | min -55 · max 125 °C | 3 | |
| ESD protection on all pins | HBM | min 4 kV | 3 |
| ESD protection on all pins | MM | min 400 V | 3 |
| Maximum Junction Temperature TJ | max 150 °C | 3 | |
| Input Voltage VDD | min 2.7 · max 5.5 V | 3 | |
| Input Current IDD | All digital inputs are grounded, all analog outputs (VOUT) are unloaded. Code = 0x000h; VDD = 5V; TA = -40 to +85°C; typical at +25°C | typ 415 · max 750 uA | 3 |
| Software Shutdown Current ISHDN_SW | VDD = 5V; TA = -40 to +85°C; typical at +25°C | typ 3.3 · max 6 uA | 3 |
| Power-on Reset Threshold VPOR | typ 2 V | 3 | |
| Resolution n | MCP4812 | min 10 Bits | 3 |
| INL Error INL | MCP4812 | min -3.5 · max 3.5 LSb | 3 |
| DNL DNL | MCP4812; Note 1: Guaranteed monotonic by design over all codes. | min -0.5 · max 0.5 LSb | 3 |
| Offset Error VOS | Code = 0x000h | min -1 · max 1 % of FSR | 3 |
| Offset Error Temperature Coefficient VOS/°C | -45°C to +25°C | typ 0.16 ppm/°C | 3 |
| Offset Error Temperature Coefficient VOS/°C | +25°C to +85°C | typ -0.44 ppm/°C | 3 |
| Gain Error gE | Code = 0xFFFh, not including offset error | min -2 · typ -0.1 · max 2 % of FSR | 3 |
| Gain Error Temperature Coefficient G/°C | typ -3 ppm/°C | 3 | |
| Internal Reference Voltage VREF | VOUTA when G = 1x and Code = 0xFFFh | min 2.008 · typ 2.048 · max 2.088 V | 4 |
| Temperature Coefficient (Note 2) VREF/°C | -40°C to 0°C | typ 125 · max 325 ppm/°C | 4 |
| Temperature Coefficient (Note 2) VREF/°C | -40°C to 0°C | typ 0.25 · max 0.65 LSb/°C | 4 |
| Temperature Coefficient (Note 2) VREF/°C | 0°C to +85°C | typ 45 · max 160 ppm/°C | 4 |
| Temperature Coefficient (Note 2) VREF/°C | 0°C to +85°C | typ 0.09 · max 0.32 LSb/°C | 4 |
| Output Noise (VREF Noise) ENREF | 0.1-10 Hz; Code = 0xFFFh, G = 1x | typ 290 uVp-p | 4 |
| Output Noise Density eNREF | 1 kHz; Code = 0xFFFh, G = 1x | typ 1.2 uV/Hz | 4 |
| Output Noise Density eNREF | 10 kHz; Code = 0xFFFh, G = 1x | typ 1 uV/Hz | 4 |
| 1/f Corner Frequency fCORNER | typ 400 Hz | 4 | |
| Phase Margin PM | CL= 400 pF, RL = | typ 66 Degree (°) | 4 |
| Slew Rate SR | typ 0.55 V/us | 4 | |
| Short Circuit Current ISC | typ 15 · max 24 mA | 4 | |
| Settling Time tSETTLING | Within 1/2 LSb of final value from 1/4 to 3/4 full-scale range | typ 4.5 us | 4 |
| Major Code Transition Glitch | Note 2; 1 LSb change around major carry (0111 1111 to 1000 0000) | typ 45 nV-s | 4 |
| Input Voltage VDD | Typical values at +125°C by characterization or simulation | min 2.7 · max 5.5 V | 5 |
| Input Current IDD | VDD = 5V; +125°C by characterization or simulation; all digital inputs grounded, all analog outputs unloaded, Code = 0x000h | typ 440 uA | 5 |
| Software Shutdown Current ISHDN_SW | +125°C by characterization or simulation | typ 5 uA | 5 |
| Power-On Reset threshold VPOR | +125°C by characterization or simulation | typ 1.85 V | 5 |
| Resolution n | MCP4812; +125°C by characterization or simulation | min 10 Bits | 5 |
| Offset Error Temperature Coefficient VOS/°C | +25°C to +125°C | typ -5 ppm/°C | 5 |
| Gain Error gE | +125°C by characterization or simulation; Code = 0xFFFh, not including offset error | typ -0.1 % of FSR | 5 |
| Gain Error Temperature Coefficient G/°C | +125°C by characterization or simulation | typ -3 ppm/°C | 5 |
| Internal Reference Voltage VREF | +125°C by characterization or simulation; VOUTA when G = 1x and Code = 0xFFFh | typ 2.048 V | 5 |
| Temperature Coefficient (Note 2) VREF/°C | -40°C to 0°C | typ 125 ppm/°C | 5 |
| Temperature Coefficient (Note 2) VREF/°C | -40°C to 0°C | typ 0.25 LSb/°C | 5 |
| Temperature Coefficient (Note 2) VREF/°C | 0°C to +85°C | typ 45 ppm/°C | 5 |
| Temperature Coefficient (Note 2) VREF/°C | 0°C to +85°C | typ 0.09 LSb/°C | 5 |
| Output Noise (VREF Noise) ENREF | +125°C by characterization or simulation; 0.1 – 10 Hz; Code = 0xFFFh, G = 1x | typ 290 uVp-p | 5 |
| Output Noise Density eNREF | +125°C by characterization or simulation; 1 kHz; Code = 0xFFFh, G = 1x | typ 1.2 uV/Hz | 5 |
| Output Noise Density eNREF | +125°C by characterization or simulation; 10 kHz; Code = 0xFFFh, G = 1x | typ 1 uV/Hz | 5 |
| 1/f Corner Frequency fCORNER | +125°C by characterization or simulation | typ 400 Hz | 5 |
| Phase Margin PM | +125°C by characterization or simulation; CL= 400 pF, RL = | typ 66 Degree (°) | 6 |
| Slew Rate SR | +125°C by characterization or simulation | typ 0.55 V/us | 6 |
| Short Circuit Current ISC | +125°C by characterization or simulation | typ 17 mA | 6 |
| Settling Time tSETTLING | +125°C by characterization or simulation; within 1/2 LSb of final value from 1/4 to 3/4 full-scale range | typ 4.5 us | 6 |
| Major Code Transition Glitch | +125°C by characterization or simulation; Note 2; 1 LSb change around major carry (0111 1111 to 1000 0000) | typ 45 nV-s | 6 |
| Input Leakage Current ILEAKAGE | LDAC = CS = SDI = SCK = VDD or VSS | min -1 · max 1 A | 6 |
| Digital Pin Capacitance (All inputs/outputs) CIN, COUT | VDD = 5.0V, TA = +25°C, fCLK = 1 MHz (Note 1) | typ 10 pF | 6 |
| Clock Frequency FCLK | TA = +25°C (Note 1) | max 20 MHz | 6 |
| Clock High Time tHI | Note 1 | min 15 ns | 6 |
| Clock Low Time tLO | Note 1 | min 15 ns | 6 |
| CS Fall to First Rising CLK Edge tCSSR | Applies only when CS falls with CLK high. (Note 1) | min 40 ns | 6 |
| Data Input Setup Time tSU | Note 1 | min 15 ns | 6 |
| Data Input Hold Time tHD | Note 1 | min 10 ns | 6 |
| SCK Rise to CS Rise Hold Time tCHS | Note 1 | min 15 ns | 6 |
| CS High Time tCSH | Note 1 | min 15 ns | 7 |
| LDAC Pulse Width tLD | Note 1 | min 100 ns | 7 |
| LDAC Setup Time tLS | Note 1 | min 40 ns | 7 |
| SCK Idle Time before CS Fall tIDLE | Note 1 | min 40 ns | 7 |
| Specified Temperature Range TA | min -40 · max 125 °C | 7 | |
| Operating Temperature Range TA | Note 1: Reduced performance; TJ must not exceed +150°C. | min -40 · max 125 °C | 7 |
| Storage Temperature Range TA | min -65 · max 150 °C | 7 | |
| Thermal Resistance, 8L-MSOP JA | 8L-MSOP | typ 211 °C/W | 7 |
Pins, by the datasheet
8- 1 VDD
- Supply voltage input, 2.7V to 5.5V. · p. 15
- 2 CS
- Active-low chip select input enables serial clock and data functions. · p. 15
- 3 SCK
- SPI compatible serial clock input. · p. 15
- 4 SDI
- SPI compatible serial data input. · p. 15
- 5 LDAC
- Synchronization input transfers input registers to output registers; low updates both outputs simultaneously and may be tied to VSS. · p. 15
- 6 VOUTB
- DACB output with its own output amplifier. · p. 15
- 7 VSS
- Ground reference and current return; connect to a ground plane through a low-impedance connection. · p. 15
- 8 VOUTA
- DACA output with its own output amplifier. · p. 15
Parts like it
8
DAC8551IDGKR
MSOP-8-40℃~+105℃ 1 10us 12LSB 16 2.7V~5.5V 200nA 30MHz Built-in External SPI Voltage Buffer MSOP-8 Digital to Analog Converters (DAC) ROHSTexas InstrumentsDigital To Analog Converters (DAC)TPC116S1-VR
MSOP-8-40℃~+125℃ 1 14us 16 2.7V~5.5V 2LSB 30MHz 90uA Built-in External SPI、QSPI Voltage Buffer MSOP-8 Digital to Analog Converters (DAC) ROHS3PEAKDigital To Analog Converters (DAC)DAC8571IDGKR
MSOP-8-40℃~+105℃ 0.25LSB 1 10us 16 2.7V~5.5V 200nA I2C Integrated buffer、Power-on reset、Power-down mode、Multi-chip synchronization Voltage Buffer MSOP-8 Digital to Analog Converters (DAC) ROHSTexas InstrumentsDigital To Analog Converters (DAC)MCP4822-E/MS
MSOP-8-40℃~+125℃ 0.2LSB 12 2 2.7V~5.5V 4.5us 415uA Integrated buffer、Power-on reset、Power-down mode、Multi-chip synchronization、Programmable gain、Built-in reference source SPI Voltage Buffer MSOP-8 Digital to Analog Converters (DAC) ROHSMicrochip TechnologyDigital To Analog Converters (DAC)MCP4921-E/MS
MSOP-8-40℃~+125℃ 1 12 12LSB 175uA 2.7V~5.5V 4.5us Built-in External SPI Voltage Buffer MSOP-8 Digital to Analog Converters (DAC) ROHSMicrochip TechnologyDigital To Analog Converters (DAC)AD5660CRMZ-2
MSOP-8-40℃~+105℃ 1 10us 16 2.7V~5.5V 32LSB 480nA SPI、QSPI Voltage Buffer MSOP-8 Digital to Analog Converters (DAC) ROHSAnalog DevicesDigital To Analog Converters (DAC)HT7512ARMZ
MSOP-8-40℃~+105℃ 1 12 140uA 1LSB 2.7V~5.5V 30MHz 8us Built-in Built-in SPI、QSPI Voltage Buffer MSOP-8 Digital to Analog Converters (DAC) ROHSHTCSEMIDigital To Analog Converters (DAC)DS4412U+
uSOP-8-40℃~+85℃ 0.5LSB、1LSB 2 2.7V~5.5V 4 500uA I2C uSOP-8 Digital to Analog Converters (DAC) ROHSMaxim Integrated (Analog Devices)Digital To Analog Converters (DAC)
Questions
Is there a KiCad symbol and footprint for the MCP4812-E/MS?
Yes. The symbol is Analog_DAC:MCP4812 and the footprint Package_SO:MSOP-8_3x3mm_P0.65mm, both drawn on this page. PCBKit places them on a board for you when you design with it.
What package is the MCP4812-E/MS?
MSOP-8, with 8 pins. Its footprint is drawn on this page.
Where is the MCP4812-E/MS datasheet?
Microchip Technology publishes it: the Datasheet link on this page opens it.
Where can I order the MCP4812-E/MS?
JLCPCB lists it as part C219484, with 39 in stock; the sellers' links on this page open their listings.
What can replace the MCP4812-E/MS?
Parts like it in the library: the DAC8551IDGKR by Texas Instruments, the TPC116S1-VR by 3PEAK, the DAC8571IDGKR by Texas Instruments and the MCP4822-E/MS by Microchip Technology. Check their datasheets: a part that fits the footprint may still differ in its ratings.