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MDD2302 on a board, in 3D

MDD2302

MDD

-50℃~+150℃ 1 N-channel 1.25W 20V 28mΩ@2.5V 33pF 340pF 4A 5.4nC@10V 500mV SOT-23 MOSFETs ROHS

JLCPCB preferred
Category
MOSFETs
Package
SOT-23
Pins
5

Overview

The MDD2302 is a MOSFET made by MDD in a SOT-23 package with 3 pins. -50℃~+150℃ 1 N-channel 1.25W 20V 28mΩ@2.5V 33pF 340pF 4A 5.4nC@10V 500mV SOT-23 MOSFETs ROHS.

PCBKit's library has its KiCad symbol (JLCPCB-Transistors:NMOS,MDD2302, from Cdfer) and its footprint (Package_TO_SOT_SMD:SOT-23, from KiCad's library), ready for a KiCad board. 146,373 are in stock at JLCPCB (part C427390). 2 open-source boards in 2 repositories on GitHub use it.

Symbol

D3G1S2
JLCPCB-Transistors:NMOS,MDD2302From Cdfer

Footprint

123
Package_TO_SOT_SMD:SOT-23From KiCad's library

From the datasheet

10
Drain-source, most
20 V · VDS, absolute maximum · p. 1
Gate-source, most
12 V · VGS, absolute maximum magnitude (±12 V) · p. 1
Drain current, most
4 A · ID, continuous maximum at TA = 25℃ · p. 1
Junction, hottest
150 °C · TJ, absolute maximum · p. 1
Junction to air (SOT-23)
100 K/W · RθJA, rated maximum on 1 in2 FR-4 board with 2oz copper, double sided, still air · p. 1
On resistance
25 mΩ · Typical at VGS = 4.5V, ID = 4A · p. 2
On resistance
28 mΩ · Typical at VGS = 2.5V, ID = 3A · p. 2
Gate threshold
800 mV · Typical at VDS = VGS, ID = 250uA · p. 2
Forward voltage
1.2 V · Body diode maximum at IS = 1A, VGS = 0V · p. 2
Forward current, most
1.6 A · Body diode maximum at TA = 25℃ · p. 2

What it is and has

2
Technology
Advanced trench process technology · p. 1
Cell design
High Density Cell Design For Ultra Low On-Resistance · p. 1

Specifications

25
ParameterConditionsAs printedPage
Drain-Source Voltage VDSTA=25℃max 20 V1
Gate-Source Voltage VGSTA=25℃; ±12 V limitmin -12 · max 12 V1
Continuous Drain Current IDTA=25℃max 4 A1
Pulsed Drain Current (Note 1) IDMTA=25℃; pulse width limited by maximum allowable junction temperaturemax 12 A1
Power Dissipation(Note 2) PDTA=25℃; mounted on 1 in2 FR-4 board with 2oz copper, double sided, still airmax 1.25 W1
Thermal Resistance from Junction to Ambient(Note 2) RθJASOT-23; TA=25℃; mounted on 1 in2 FR-4 board with 2oz copper, double sided, still airmax 100 ℃/W1
Junction Temperature and Storage Temperature TJ,Tstgmin -50 · max 150 ℃1
Drain-Source Breakdown Voltage V(BR)DSSTa = 25℃; VGS=0V, ID=250uAmin 20 V2
Drain-Source Leakage Current IDSSTa = 25℃; VDS=20V, VGS=0Vmax 1 uA2
Gate-Source Leakage Current IGSSTa = 25℃; VGS=±10V, VDS=0V; maximum magnitude ±100 nAmax 100 nA2
Gate Threshold Voltage VGS(TH)Ta = 25℃; VDS=VGS, ID=250uAmin 0.5 · typ 0.8 · max 1.2 V2
Drain-Source On-State Resistance(Note 3) RDS(ON)Ta = 25℃; VGS=4.5V, ID=4A; pulse width≤300us, duty cycle≤2%typ 25 · max 30 mΩ2
Drain-Source On-State Resistance(Note 3) RDS(ON)Ta = 25℃; VGS=2.5V, ID=3A; pulse width≤300us, duty cycle≤2%typ 28 · max 35 mΩ2
Input Capacitance CissTa = 25℃; VDS=10V, VGS=0V, f=1MHztyp 340 pF2
Output Capacitance CossTa = 25℃; VDS=10V, VGS=0V, f=1MHztyp 115 pF2
Reverse Transfer Capacitance CrssTa = 25℃; VDS=10V, VGS=0V, f=1MHztyp 33 pF2
Total Gate Charge QgTa = 25℃; VDS=10V, VGS=4.5V, ID=3Atyp 5.4 nC2
Gate Source Charge QgsTa = 25℃; VDS=10V, VGS=4.5V, ID=3Atyp 0.65 nC2
Gate Drain Charge QgdTa = 25℃; VDS=10V, VGS=4.5V, ID=3Atyp 1.6 nC2
Turn on Delay Time td(on)Ta = 25℃; VDS=10V, VGS=4.5V, ID=3A, RG=6Ω, RL=5.5Ωtyp 12 ns2
Turn on Rise Time trTa = 25℃; VDS=10V, VGS=4.5V, ID=3A, RG=6Ω, RL=5.5Ωtyp 36 ns2
Turn Off Delay Time td(off)Ta = 25℃; VDS=10V, VGS=4.5V, ID=3A, RG=6Ω, RL=5.5Ωtyp 34 ns2
Turn Off Fall Time tfTa = 25℃; VDS=10V, VGS=4.5V, ID=3A, RG=6Ω, RL=5.5Ωtyp 10 ns2
Source drain current(Body Diode) ISDTA=25℃max 1.6 A2
Drain-Source Diode Forward Voltage VSDTa = 25℃; IS=1A, VGS=0Vmax 1.2 V2

Pins, by the datasheet

3
1 Gate
Gate. · p. 1
2 Source
Source. · p. 1
3 Drain
Drain. · p. 1

Parameters

14
Current - Continuous Drain(Id)
4A
Drain to Source Voltage
20V
Forward Current(If)
1.6A
Gate Charge(Qg)
5.4nC@10V
Gate Threshold Voltage (Vgs(th))
800mV
Input Capacitance(Ciss)
340pF
Junction Temperature(Max)
150℃
Number
1 N-channel
Operating Temperature
-50℃~+150℃
Pd - Power Dissipation
1.25W
RDS(on)
28mΩ@2.5V
Reverse Transfer Capacitance (Crss@Vds)
33pF
Thermal Resistance(Junction to Ambient)
100℃/W
Voltage - Forward(Vf)
1.2V

Order codes

2

Pinout

3
The pins of the MDD2302
PinNameType
1GInput
2SPassive
3DPassive

Open-source boards using it

All 2
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    Bccc sao rp2350a

    aerospace-venoms/BCCC_Temperature_SAO

    Source files for reconstructing the Beverage Chilling Contraption Contest badge, released at Defcon 2026

    109 parts1
  • 4 layers52.6 × 40 mmBioSensorBox, the printed circuit board in 3D

    BioSensorBox

    JH2k00/BioSensorBox

    This repository contains the hardware and software for my project in the Advanced Topics in PCB Design lecture at the Technical University of Darmstadt

    56 parts

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Questions

Is there a KiCad symbol and footprint for the MDD2302?

Yes. The symbol is JLCPCB-Transistors:NMOS,MDD2302 and the footprint Package_TO_SOT_SMD:SOT-23, both drawn on this page. PCBKit places them on a board for you when you design with it.

What package is the MDD2302?

SOT-23, with 3 pins. Its footprint is drawn on this page.

Where is the MDD2302 datasheet?

MDD publishes it: the Datasheet link on this page opens it.

Where can I order the MDD2302?

JLCPCB lists it as part C427390, with 146,373 in stock; the sellers' links on this page open their listings.

What can replace the MDD2302?

Parts like it in the library: the AP2300 by ALLPOWER, the AO3400A by Alpha & Omega Semiconductor, the AO3400A by UMW and the AO3401A by UMW. Check their datasheets: a part that fits the footprint may still differ in its ratings.

Which open-source boards use the MDD2302?

2 boards in 2 repositories on GitHub; the most starred are listed on this page, with their KiCad files.

Parts like it

8