Overview
The B09B-PASK is a wire To Board Connector made by JST in a 插件,P=2mm package with 9 pins.
PCBKit's library has its KiCad symbol (Connector_Generic:Conn_01x09, from KiCad's library) and its footprint (EasyEDA_Cloud:CONN-TH_B09B-PASK-LF-SN, from EasyEDA), ready for a KiCad board. JLCPCB lists it (part C20088468).
Symbol
Footprint
Parameters
21- Color
- White
- Colour
- White
- Contact Material
- Copper alloy
- Contact Plating
- Tin
- Current Rating
- 3A
- Flame Retardant Rating
- UL94V-0
- Mounting Style
- Direct Insert
- Mounting Type
- Through Hole
- Number of PINs Per Row
- 9
- Number of Pins
- 9P
- Number of Rows
- 1
- Operating Temperature
- -25℃~+85℃
- Pins Structure
- 1x9P
- Pitch
- 2mm
- Plastic Material
- Glass-Fiber Reinforced PBT
- Reference Series
- PA
- Supplementary Features
- K Pin
- Voltage Rating
- 250V
- X-Length of Bottom Edge on Board (Spacing Line)
- 20mm
- Y-Width of Bottom Edge on Board
- 5.3mm
- Z-Height of the Board
- 7.7mm
Order codes
1- B09B-PASKLCSC C20088468
Pinout
9| Pin | Name | Type |
|---|---|---|
| 1 | Pin_1 | Passive |
| 2 | Pin_2 | Passive |
| 3 | Pin_3 | Passive |
| 4 | Pin_4 | Passive |
| 5 | Pin_5 | Passive |
| 6 | Pin_6 | Passive |
| 7 | Pin_7 | Passive |
| 8 | Pin_8 | Passive |
| 9 | Pin_9 | Passive |
Show this part on your page
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Is there a KiCad symbol and footprint for the B09B-PASK?
Yes. The symbol is Connector_Generic:Conn_01x09 and the footprint EasyEDA_Cloud:CONN-TH_B09B-PASK-LF-SN, both drawn on this page. PCBKit places them on a board for you when you design with it.
What package is the B09B-PASK?
插件,P=2mm, with 9 pins. Its footprint is drawn on this page.
Where is the B09B-PASK datasheet?
JST publishes it: the Datasheet link on this page opens it.
Where can I order the B09B-PASK?
JLCPCB lists it as part C20088468, with 0 in stock; the sellers' links on this page open their listings.
What can replace the B09B-PASK?
Parts like it in the library: the B09B-PASK(LF)(SN) by JST. Check their datasheets: a part that fits the footprint may still differ in its ratings.
