
Overview
The DOD607F is a MOSFET made by DOINGTER in a TO-252-4 package with 5 pins. TO-252-4 MOSFETs ROHS.
PCBKit's library has its KiCad symbol (EasyEDA_Cloud:DOD607F, from EasyEDA) and its footprint (Package_TO_SOT_SMD:TO-252-4, from KiCad's library), ready for a KiCad board. 1,835 are in stock at JLCPCB (part C41416019).
Symbol
Footprint
Parameters
12- Current - Continuous Drain(Id)
- 25A
- Drain to Source Voltage
- 30V
- Gate Charge(Qg)
- 15nC@10V
- Gate Threshold Voltage (Vgs(th))
- 2.5V
- Input Capacitance(Ciss)
- 660pF
- Number
- 1 N-Channel + 1 P-Channel
- Operating Temperature
- -55℃~+150℃
- Output Capacitance(Coss)
- 105pF
- Pd - Power Dissipation
- 30W
- RDS(on)
- 13mΩ@10V
- Reverse Transfer Capacitance (Crss@Vds)
- 95pF
- Type
- N-Channel + P-Channel
Order codes
1- DOD607FLCSC C41416019
Pinout
5| Pin | Name | Type |
|---|---|---|
| 1 | S1 | Unspecified |
| 2 | G1 | Unspecified |
| 3 | D1/D2 | Unspecified |
| 4 | S2 | Unspecified |
| 5 | G2 | Unspecified |
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<iframe src="https://pcbkit.io/embed/parts/doingter/DOD607F" title="DOD607F in PCBKit" width="100%" height="480" style="border:0;border-radius:12px" allow="fullscreen" loading="lazy"></iframe><img src="https://pcbkit.io/embed/parts/doingter/DOD607F.jpg" alt="DOD607F" width="1200" height="900">[](https://pcbkit.io/parts/doingter/DOD607F)Questions
Is there a KiCad symbol and footprint for the DOD607F?
Yes. The symbol is EasyEDA_Cloud:DOD607F and the footprint Package_TO_SOT_SMD:TO-252-4, both drawn on this page. PCBKit places them on a board for you when you design with it.
What package is the DOD607F?
TO-252-4, with 5 pins. Its footprint is drawn on this page.
Where can I order the DOD607F?
JLCPCB lists it as part C41416019, with 1,835 in stock; the sellers' links on this page open their listings.
What can replace the DOD607F?
Parts like it in the library: the CFD609A by CF-Xpower, the P2003ND5G-DO by DOINGTER, the 4012GD-GK by GOODWORK and the XR6030 by XNRUSEMI. Check their datasheets: a part that fits the footprint may still differ in its ratings.
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