
Overview
The 929700-06-08-RK is a pin Header made by 3M in a 插件,P=2.54mm package with 8 pins. -40℃~+105℃ 1 2.54mm 2.5A 8P Black Copper alloy Through Hole Tin 插件,P=2.54mm Pin Headers ROHS.
PCBKit's library has its KiCad symbol (Connector_Generic:Conn_01x08, from KiCad's library) and its footprint (Connector_PinHeader_2.54mm:PinHeader_1x08_P2.54mm_Vertical, from KiCad's library), ready for a KiCad board. JLCPCB lists it (part C7057691).
Symbol
Footprint
Parameters
14- Circluar Pins/Square Pins
- Square pin
- Color
- Black
- Contact Material
- Copper alloy
- Contact Plating
- Tin
- Current Rating
- 2.5A
- Insulation Height
- 2.54mm
- Length of End Connection Pin
- 18.03mm
- Length of Mating Pin
- 8.08mm
- Mounting Type
- Through Hole
- Number of Pins
- 8P
- Number of Rows
- 1
- Operating Temperature
- -40℃~+105℃
- Pin Structure
- 1x8P
- Pitch
- 2.54mm
Order codes
1- 929700-06-08-RKLCSC C7057691
Pinout
8| Pin | Name | Type |
|---|---|---|
| 1 | Pin_1 | Passive |
| 2 | Pin_2 | Passive |
| 3 | Pin_3 | Passive |
| 4 | Pin_4 | Passive |
| 5 | Pin_5 | Passive |
| 6 | Pin_6 | Passive |
| 7 | Pin_7 | Passive |
| 8 | Pin_8 | Passive |
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Is there a KiCad symbol and footprint for the 929700-06-08-RK?
Yes. The symbol is Connector_Generic:Conn_01x08 and the footprint Connector_PinHeader_2.54mm:PinHeader_1x08_P2.54mm_Vertical, both drawn on this page. PCBKit places them on a board for you when you design with it.
What package is the 929700-06-08-RK?
插件,P=2.54mm, with 8 pins. Its footprint is drawn on this page.
Where is the 929700-06-08-RK datasheet?
3M publishes it: the Datasheet link on this page opens it.
Where can I order the 929700-06-08-RK?
JLCPCB lists it as part C7057691, with 0 in stock; the sellers' links on this page open their listings.
What can replace the 929700-06-08-RK?
Parts like it in the library: the PZ254V-11-08P by XFCN, the LAIL-PZ2.54-8P-L by LAILAN, the HB-PH3-25418PB2GOP by Hanbo Electronic and the PZ254R-11-08P by XFCN. Check their datasheets: a part that fits the footprint may still differ in its ratings.
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