2 layers78 × 60 mm
2 layers80 × 60 mm
Handset iface
waynechen16/handset_iface把類比電話話筒（RJ9 / 4P4C）接到電腦的 line out 與 line in，並用中介電路處理阻抗與電平，讓音量不掉。
- Size
- 80 × 60 mm
- Copper layers
- 2
- Thickness
- 1.6 mm
- Parts
- 44
- Nets
- 30
- Pads
- 124
- Tracks, vias
- 687, 111
- Pours
- 8
- Routed
- Yes
- KiCad
- KiCad 7 (file 20221018)
- Created
- 28 Sep 2026
- Updated
- 28 Sep 2026
Overview
Handset iface is an open-source printed circuit board by waynechen16, from the waynechen16/handset_iface repository on GitHub. It is a 2-layer board of 80 × 60 mm with 44 parts on 30 nets, routed with 687 tracks and 111 vias.
It is built around the MCP6022-E/SN. Its parts include 13 capacitors, 12 resistors, 4 connectors and 2 ICs.
Main components
1README
README.mdhandset_iface — RJ9 電話話筒 ↔ PC Line In / Line Out 轉接板
把類比電話話筒（RJ9 / 4P4C）接到電腦的 line out 與 line in，並用中介電路處理阻抗與電平，讓音量不掉。
目前版本：Rev B（新增 J2 話筒腳位選擇跳線 JP1–JP6）
電路概要
| 區塊 | 內容 |
|---|---|
| 路徑 A：PC line out → 聽筒 | J1 → R1/R2（L+R 混成單聲道）→ C1 → RV1 音量 → U1 LM386（Av = 20）→ C5 / R3 → EAR+；R4 + C6 為 Zobel |
| 路徑 B：麥克風 → PC line in | electret 麥克風，R5 提供偏壓 → C8 → U2A MCP6022 前級（Av = 5.5 ~ 51，RV2 調整）→ C11 / R10 → J3 |
| VREF | R11 / R12 分壓 + U2B 緩衝，提供 2.5 V 虛擬地 |
| 電源 | J4 USB-B 取 5 V → FB1 / C14；R6 / C7 濾波後給前級（+5V_FILT） |
| 話筒腳位選擇 | JP1–JP6 焊接跳線，見下節 |
話筒腳位選擇跳線（Rev B）
市面上的類比話筒，聽筒與麥克風的腳位組合不只一種，electret 麥克風也有極性。JP1–JP6 都是三墊式焊接跳線，出廠時 1–2 以銅箔預先短接（預設），要改設定時用刀片切斷 1–2 之間的細銅，再用錫把 2–3 接起來。
| 跳線 | 作用 | 1–2（預設） | 2–3 |
|---|---|---|---|
| JP1–JP4（四個一起改） | 聽筒 / 麥克風對調 | J2.1 = 聽筒 EAR+、J2.4 = 聽筒 GND、J2.2 / J2.3 = 麥克風 | J2.2 = 聽筒 EAR+、J2.3 = 聽筒 GND、J2.1 / J2.4 = 麥克風 |
| JP5–JP6（兩個一起改） | 麥克風極性 | 麥克風對的第一腳（MA）= MIC+，第二腳（MB）= GND | MA = GND，MB = MIC+ |
預設設定（全部 1–2）與 Rev A 的接法相同：J2 pin 1/4 = 聽筒，pin 2 = MIC+，pin 3 = MIC GND。
判斷方式：用三用電表量話筒線，聽筒那一對約 30–300 Ω 且正反向讀值相同；electret 麥克風那一對正反向讀值不同。麥克風極性最可靠的判斷是看膠囊本體：與金屬外殼相連的那一腳是 GND，另一腳是 MIC+。無法拆開時，也可以先用預設值試，沒有聲音或聲音極小再改 JP5–JP6。
PCB
- 80 × 60 mm，兩層板，四角 M3 安裝孔
- 下緣由左到右：J1 LINE OUT、J3 LINE IN、RV1 VOL（Alps RK097，軸伸出板外）、J4 USB-B
- 上緣：J2 RJ9；J2 右側一排為 JP4、JP3、JP2、JP1（PAIR）與 JP5、JP6（MIC POL）
- 被動元件、IC 為 SMT（0805 / 1206 / SOIC-8）；J1–J4 與 RV1 為 THT；JP1–JP6 為 PCB 銅箔，不需零件
- 設計規則：clearance 0.2 mm，訊號線 0.3 mm，電源線 0.5 mm，via 0.6 / 0.3 mm；底層為 GND 平面
檔案
| 檔案 | 說明 |
|---|---|
handset_iface.kicad_pro / .kicad_sch / .kicad_pcb | KiCad 專案 |
handset_iface_sch.pdf | 原理圖 PDF |
pcb_top.png, pcb_bottom.png | PCB 正反面預覽 |
handset_iface_gerber.zip | Gerber + Excellon 鑽孔檔（送板廠） |
handset_iface_pos_top.csv | SMT 座標檔（原點：板子左下角） |
handset_iface_BOM.csv | BOM（跳線為銅箔，不列入） |
scripts/ | 產生原理圖、擺放、自動佈線、預覽所用的 Python 腳本（KiCad 7 pcbnew API；路徑為產生時的環境，需自行調整） |
版本紀錄
- Rev B：新增 J2 腳位選擇跳線 JP1–JP6（聽筒 / 麥克風對調、麥克風極性）
- Rev A：初版原理圖與兩層板 layout
Parts
44| Qty | Value | Footprint | References |
|---|---|---|---|
| 5 | 10k | Resistor_SMD:R_0805_2012Metric | R1, R2, R8, R11, R12 |
| 4 | 10uF | Capacitor_SMD:C_1206_3216Metric | C1, C4, C11, C12 |
| 4 | MountingHole_3.2mm_M3 | MountingHole:MountingHole_3.2mm_M3 | H1, H2, H3, H4 |
| 4 | PAIR | Jumper:SolderJumper-3_P1.3mm_Bridged12_RoundedPad1.0x1.5mm_NumberLabels | JP1, JP2, JP3, JP4 |
| 2 | 100R | Resistor_SMD:R_0805_2012Metric | R6, R10 |
| 2 | 100nF | Capacitor_SMD:C_0805_2012Metric | C2, C13 |
| 2 | 100uF | Capacitor_SMD:CP_Elec_6.3x5.4 | C7, C14 |
| 2 | 2.2k | Resistor_SMD:R_0805_2012Metric | R5, R9 |
| 2 | MIC POL | Jumper:SolderJumper-3_P1.3mm_Bridged12_RoundedPad1.0x1.5mm_NumberLabels | JP5, JP6 |
| 1 | 100k | Resistor_SMD:R_0805_2012Metric | R7 |
| 1 | 100k GAIN | Potentiometer_SMD:Potentiometer_Bourns_3314J_Vertical | RV2 |
| 1 | 10R | Resistor_SMD:R_0805_2012Metric | R4 |
| 1 | 10k VOL | Potentiometer_THT:Potentiometer_Alps_RK097_Single_Horizontal | RV1 |
| 1 | 1uF | Capacitor_SMD:C_0805_2012Metric | C8 |
| 1 | 220uF | Capacitor_SMD:CP_Elec_6.3x7.7 | C5 |
| 1 | 22uF | Capacitor_SMD:C_1206_3216Metric | C10 |
| 1 | 47R | Resistor_SMD:R_0805_2012Metric | R3 |
| 1 | 47nF | Capacitor_SMD:C_0805_2012Metric | C6 |
| 1 | 47pF | Capacitor_SMD:C_0805_2012Metric | C9 |
| 1 | 600R@100MHz | Inductor_SMD:L_0805_2012Metric | FB1 |
| 1 | LINE IN (to PC) | Connector_Audio:Jack_3.5mm_CUI_SJ1-3523N_Horizontal | J3 |
| 1 | LINE OUT (from PC) | Connector_Audio:Jack_3.5mm_CUI_SJ1-3523N_Horizontal | J1 |
| 1 | LM386M (SOIC-8) | Package_SO:SOIC-8_3.9x4.9mm_P1.27mm | U1 |
| 1 | MCP6022-E/SN | Package_SO:SOIC-8_3.9x4.9mm_P1.27mm | U2 |
| 1 | RJ9 HANDSET | Connector_RJ:RJ9_Evercom_5301-440xxx_Horizontal | J2 |
| 1 | USB-B (5V only) | Connector_USB:USB_B_Lumberg_2411_02_Horizontal | J4 |
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Questions
How big is the Handset iface PCB?
It measures 80 × 60 mm and has 2 copper layers, 1.6 mm thick.
What parts does the Handset iface use?
44 parts, built around the MCP6022-E/SN. The full list of its parts is on this page, with links to each part's symbol and footprint where PCBKit's library has them.
Where can I download the Handset iface KiCad files?
From the waynechen16/handset_iface repository on GitHub, at the commit this page was made from: the board is handset_iface.kicad_pcb and its schematic handset_iface.kicad_sch. PCBKit opens the board in the browser, with nothing to install.
Can I use the Handset iface design in my own project?
Its repository states no licence, so its author keeps all rights: ask waynechen16 before reusing the design.