

Cactuscon badge-2017
Badge for CactusCon, based on ESP-32
- Size
- 88.9 × 94.6 mm
- Copper layers
- 2
- Thickness
- 1.6 mm
- Parts
- 20
- Nets
- 17
- Pads
- 159
- Tracks, vias
- 214, 1
- Routed
- Yes
- KiCad
- KiCad 4
- Created
- 7 Sep 2017
- Updated
- 13 Sep 2017
Overview
Cactuscon badge-2017 is an open-source printed circuit board by thatch, from the thatch/cactuscon-badge-2017 repository on GitHub, published under the CC-BY-4.0 licence. It is a 2-layer board of 88.9 × 94.6 mm with 20 parts on 17 nets, routed with 214 tracks and 1 via.
Its parts include 14 connectors and 5 switches. It belongs with the lEDs and displays boards of this library.
README
README.mdCactusCon Badge 2017

Parts
20| Qty | Value | Footprint | References |
|---|---|---|---|
| 9 | CONN_01X10 | CactusCon:10Pin_NoSilk | J2, J3, J4, J6, J7, J8, J9, J10, J11 |
| 5 | SW_Push | Buttons_Switches_THT:SW_PUSH_6mm | SW1, SW2, SW3, SW4, SW5 |
| 1 | CONN_01X01 | Mounting_Holes:MountingHole_5mm_Pad_Via | J1 |
| 1 | CONN_01X04 | CactusCon:SMALL_OLED | J5 |
| 1 | Graphic | CactusCon:CactusCon_Full_Badge | J12 |
| 1 | LOLIN32 | CactusCon:LOLIN32 | M1 |
| 1 | OSHW | Symbols:OSHW-Logo2_9.8x8mm_SilkScreen | J14 |
| 1 | Partners | CactusCon:Partner_Logos | J13 |
Questions
How big is the Cactuscon badge-2017 PCB?
It measures 88.9 × 94.6 mm and has 2 copper layers, 1.6 mm thick.
What parts does the Cactuscon badge-2017 use?
20 parts. The full list of its parts is on this page, with links to each part's symbol and footprint where PCBKit's library has them.
Where can I download the Cactuscon badge-2017 KiCad files?
From the thatch/cactuscon-badge-2017 repository on GitHub, at the commit this page was made from: the board is hardware/cactuscon_badge_2017.kicad_pcb. PCBKit opens the board in the browser, with nothing to install.
Can I use the Cactuscon badge-2017 design in my own project?
Its repository publishes it under the CC-BY-4.0 licence: you may reuse it on that licence's terms (keep the author's notice, and for a copyleft licence share your changes alike).
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