Layr hw kit ulx3s

With the LAYR Open Chip Challenge, we are creating a platform on which students themselves become drivers of innovation: We are looking for creative open-source chip designs that grow technically in several stages of the competition, address real security aspects, and are accompanied through to physical tape-out. The focus is not only on technical skills, but also on active participation in digital value chains and sovereignty - from the idea to the functional silicon solution.

The challenge

Link to LAYR 25/26: The Challenge

The LAYR challenge contains the tasks and informations to enter LAYR. Please start with reading the challenge.

The hardware kit

Link to LAYR 25/26: The hardware kit

All teams will get a LAYR 25/26 hardware kit. The kits will be distributed by the teams supervisors. The link takes you to the description of the hardware kit and some additional informations about the content and the components.

IMPORTANT: The IDs and KEYS on the Javacards (NFC-cards) are pre-programmed by the LAYR team. A list of the cards, IDs and keys is provided with the descriptions.

The demonstrator

Link to LAYR 25/26: The demonstrator

Teams submissions

Link to LAYR 25/26: List of submissions

Six teams created submissions for LAYR 25/26. All of them got into production at IHP at the Tapeout in March 2026. Some of these chip designs are available in public repositories. Find them with the Link above.

Events

Link to LAYR 25/26: Events

LAYR hosts a series of events. A list of the past events with documents and materials regarding the events can be found at the link above.

License

Shield:

This work is licensed under a Creative Commons Attribution 4.0 International License.