Skip to the content
6 layers132.1 × 107.9 mmZx50 MemoryCard RevC1, the printed circuit board in 3D

Zx50 MemoryCard RevC1

mmosko/Zx50

This is the primary CPU board for the Zx50 8-slot passive backplane system. It hosts the Z80 microprocessor (running at 5 MHz to 10 MHz) and acts as the master controller for the primary bus.

Size
132.1 × 107.9 mm
Copper layers
6
Thickness
1.6 mm
Parts
235
Nets
552
Pads
1,445
Tracks, vias
3,594, 632
Pours
2,205
Routed
Yes
KiCad
KiCad 9.0 (file 20241229)
Created
1 Mar 2026
Updated
12 Oct 2026

Overview

Zx50 MemoryCard RevC1 is an open-source printed circuit board by mmosko, from the mmosko/Zx50 repository on GitHub. It is a 6-layer board of 132.1 × 107.9 mm with 235 parts on 552 nets, routed with 3,594 tracks and 632 vias.

It is built around the LCMXO3LF-6900C-5BG400C, 74LVC245AD and 74LVC3G07DC, with the IS25LP080D-JNLE-TR, SN74LVC1G17DBVR and AMS1117-2.5 among its other parts. Its parts include 96 resistors, 75 capacitors, 24 ICs, 20 diodes and 12 connectors. It belongs with the FPGA and CPLD boards of this library.

Main components

7

README

boards/legacy/Zx50_Cpu_RevC1/README.md

Zx50 CPU Card (Rev C1)

1. Overview

This is the primary CPU board for the Zx50 8-slot passive backplane system. It hosts the Z80 microprocessor (running at 5 MHz to 10 MHz) and acts as the master controller for the primary bus.

Revision C1 updates the design to a 6-layer stackup, integrating a high-performance Math and Stack Coprocessor Cluster mounted on the bottom side beneath the clock mezzanine shield, along with a dedicated hardware Wait-State Generator (wait_gen).

Crucially, this board coexists with the Zx50 Shadow Bus architecture. It features a hardware-level "firewall" that allows a secondary master (like a Pi Pico on the Bus Probe or Front Panel card) to request the bus via ~BUSRQ. When the Z80 yields (~BUSAK), the CPU card instantly severs itself from the backplane, allowing the secondary master to perform high-speed 40 MHz DMA transfers without electrical contention.


2. Core Architecture & Logic Families

The CPU

  • Z80 Microprocessor (U4): Zilog Z84C00xxP CMOS variant in a 40-pin DIP package (socketed).

The Transceiver Firewall (SN74ABT245BN)

To drive the heavy capacitance of the 8-slot backplane, this board uses four SN74ABT245BN octal bus transceivers (U2, U3, U5, U7) with high-drive capability. A unified BOM of four '245s optimizes PCB trace routing across all 32 backplane lines.

  • Convention: "A-Ports" face the Z80; "B-Ports" face the Backplane.
  • Address Bus (U2, U3): Direction (DIR) is hardwired to +5V (A $\rightarrow$ B only).
  • Control Bus (U7): Direction (DIR) is hardwired to +5V (A $\rightarrow$ B only). (Unused input A8 is tied to GND via a 10k$\Omega$ resistor R2 to prevent CMOS floating-gate oscillation).
  • Data Bus (U5): Direction (DIR) is dynamically controlled by read/acknowledge steering logic (D_DIR driven by U8 / R8). This switches the transceiver to an input state (B $\rightarrow$ A) during standard memory/IO reads or Interrupt Acknowledge (INTA) cycles.
  • Isolation (~OE): The ~OE pins of all four transceivers are driven by inverted ~BUSAK (/BUSAK from U1 pin 4).

Glue Logic & Bus Coordination

Discrete "Little Logic" and micro-logic ICs handle high-speed signal translation:

  • 74AHC1G14 (U1 - Schmitt Inverter): Inverts the Z80's active-low ~BUSAK signal to drive the active-low ~OE pins of the transceiver wall.
  • 74AHCT74 (U9 - Dual D Flip-Flop): Latches timing states for wait-state generation.
  • 74AHCT132 (U10 - Quad Schmitt NAND): Handles pulse shaping and step-logic gating for debugging.
  • 74LVC1G3208 (U8 - 3-Input OR-AND Combo): Manages direction and enable logic for auxiliary bus controls.

3. Hardware Wait-State Generator (wait_gen) Subsystem

The board incorporates a dedicated hardware wait-state generator to support single-step debugging and cycle stretching during fast coprocessor or backplane operations:

  • Dual D Flip-Flop (SN74AHCT74DRG4 / U9): Latches bus cycle transitions relative to ZCLK and ~M1/~IORQ/~MREQ edges.
  • Quad Schmitt-Trigger NAND (74AHCT132 / U10): Provides noise-tolerant pulse shaping and single-step gate logic.
  • Open-Drain Output (2N7002-7-F N-Channel MOSFET / Q2): Drives the active-low ~WAIT line without contention, allowing other cards or the CPLD to safely assert ~WAIT.
  • Modes Supported:
    1. Single-Step Execution: Holds ~WAIT low at $T_2$/$T_3$ until a manual step pulse is received from the Clock Mezzanine (J3) or Front Panel (J4).
    2. Programmable Cycle Stretching: Generates accurate 1-cycle hold states for memory or I/O windows.

4. Integrated Math & Stack Coprocessor Cluster (Bottom Layer)

Mounted entirely on the back side of the board beneath the Clock Mezzanine copper shield, a high-performance CPLD cluster operates on a dedicated private memory bus.

text
                  +-----------------------------------+
                  |   ATF1508AS CPLD (PLCC-84 / U11)  |
                  |   Dual Clocks: 20MHz MCLK / 5MHz ZCLK|
                  +-----+-----------------------+-----+
                        |                       |
           CA0-CA13     |                       |  CD0-CD7
         Private Address|                       |  Private Data
                        v                       v
            +-----------+-----------------------+-----------+
            |                                               |
            |   +-------------------+   +---------------+   |
            |   | SST39SF040 Flash  |   | IS61C5128AS   |   |
            |   | 16KB Active (55ns)|   | 16KB Active   |   |
            |   | PLCC-32 (U13)     |   | SRAM 32-SOP   |   |
            |   +---------+---------+   +-------+-------+   |
            |             |                     |           |
            |             | ~F_CE / ~F_OE / ~F_WE| ~M_CE / ~M_OE / ~M_WE
            +-------------+---------------------+-----------+

1. Central Controller (ATF1508ASx-xxJx84 / U11)

  • Package: 128-macrocell CPLD in an 84-pin PLCC surface-mount socket.
  • Dual Clock Architecture: Driven by both 20/40 MHz MCLK (GCLK1, Pin 83) and 5/10 MHz ZCLK (CLK, Pin 2) from the clock mezzanine (J3). The internal state machine executes at MCLK speed, enabling sub-cycle arithmetic and table lookups before the Z80 samples data.
  • Features: Hardware multiplication (Quarter-Square algorithm), fast division seed generation, 16.16 fixed-point ALU, trigonometric LUT queries, and custom DMA/stack frame acceleration.

2. Private Memory Architecture (Zero ~BUSREQ Contention)

The CPLD manages its own dedicated private address (CA0–CA13) and data (CD0–CD7) buses, isolating coprocessor memory operations from the primary Z80 system bus:

  • Private Address Space (16 KB): A 14-bit address bus (CA0–CA13) provides 16 KB of addressable private memory space. Upper address lines (A14–A18) on both memory ICs are tied directly to GND to guarantee static CMOS levels and prevent floating pin oscillations.
  • Private Flash/EEPROM (SST39SF040 / U13): 16 KB active window (55 ns NOR Flash) in a 32-pin PLCC socket. Stores non-volatile lookup tables (Quarter-Square $f(n)=\lfloor n^2/4 \rfloor$, sine/cosine maps, logarithmic tables, reciprocal seeds).
  • Private SRAM (IS61C5128AS-25QLI / U12): 16 KB active window (25 ns High-Speed Static RAM) in a 32-pin SOP footprint. Serves as private scratchpad, hardware stack frame storage, or modifiable shadow RAM.
  • Pull-up Protection: ~M_CE and ~F_CE lines are fitted with $10\text{ k}\Omega$ pull-up resistors (R7, R10) to $+5\text{V}$ to keep both memory chips deselected and High-Z during power-up or CPLD JTAG re-programming.

3. Private Memory Access Speed Selector (J8 - MEM SPD)

To support both 20 MHz and 40 MHz MCLK speeds without requiring CPLD bitstream re-flashing:

  • Header (J8): 2-pin (1x2) 2.54mm pin header connected to CPLD Pin 81 (I/O/GCLK3) with a $10\text{ k}\Omega$ pull-up resistor (R5) to $+5\text{V}$.
  • Jumper Open (High / Default): Selects 2-cycle private access pipeline (safe access window for 40 MHz MCLK with 25 ns SRAM).
  • Jumper Shorted to GND (Low): Selects 1-cycle private access pipeline (fast mode for 20 MHz MCLK).

4. JTAG In-System Programming

  • Header (J7): 6-pin (1x6) 2.54mm male header.
  • Pinout: $+5\text{V}$ (Pin 1), GND (Pin 2), TMS (Pin 3), TDO (Pin 4), TDI (Pin 5), TCLK (Pin 6). Compatible with Waveshare USB-JTAG converters and OpenOCD.
  • Offline Option: The PLCC-32 Flash chip can be extracted and programmed offline using a T48 / TL866-3G universal programmer.

5. Power-On Reset (POR) Subsystem

Handled by a Microchip MCP1316MT-46LE/OT Supervisor IC (SOT-23-5, U6).

  • Boot Delay: Imposes a ~200 ms delay on power-up to allow bulk capacitors ($100,\mu\text{F}$ C9) to charge and peripheral clock sources/Picos to initialize before releasing ~RESET.
  • Threshold: 4.6V trip point for brown-out protection.
  • Open-Drain Output: Safely drives the shared ~RESET rail (Pin 1).
  • Manual Reset (SW1): Tactile button connected to ~MR (Pin 3) for debounced hardware reset during bench testing.

6. 6-Layer Stackup & PCB Routing Strategy

Revision C1 uses a 6-layer stackup to accommodate the high-density coprocessor cluster beneath the top-side clock shield without interfering with front-side copper:

LayerTypeDedicated Function
Layer 1 (Top)Signal / PlanePrimary Z80 component traces, Clock Mezzanine RF shield copper ground pour
Layer 2 (GND)Power PlaneContinuous $GND$ reference plane
Layer 3 (Inner 1)SignalPrivate Coprocessor Bus: CA0–CA13, CD0–CD7, and private control lines (~M_CE, ~M_OE, ~M_WE, ~F_CE, ~F_OE, ~F_WE)
Layer 4 (Inner 2)SignalZ80 Bus Ingest: Taps A0–A15, D0–D7, and control lines from U4 to the CPLD
Layer 5 (VCC)Power PlaneContinuous $+5\text{V}$ power distribution plane
Layer 6 (Bottom)Signal / SMTBottom-mounted SMT footprints: ATF1508AS PLCC-84 (U11), SST39SF040 PLCC-32 (U13), IS61C5128AS SOP-32 (U12)

7. Interfaces & Connectors

ConnectorTypeDescription
J1 - Backplane80-Pin Edge ConnectorStandard Zx50 2.54mm bus interface.
J2 - Bus Connect / Step Tap2x2 Pin SocketTap for AUX (Pin 80), GPIO15, ~STEP, and ~RUN signals.
J3 - Clock Mezzanine2x5 Socket (2.54mm)Ingests MCLK (20/40 MHz), CLK (5/10 MHz ZCLK), and ~STEP signals.
J4 - Front Panel2x5 Right-Angle IDCInterfaces status LEDs (RUN, HALT), ~RESET, ~STEP, and power lines.
J5 - TP_D_DIR Debug1x2 Header (2.54mm)Hardware tap for Data Bus Direction monitoring and GND test point.
J6 - TP_BUSAK Debug1x2 Header (2.54mm)Hardware tap for ~BUSAK signal observation.
J7 - Coprocessor JTAG1x6 Header (2.54mm)In-System Programming header for the ATF1508AS CPLD (+5V, GND, TMS, TDO, TDI, TCLK).
J8 - MEM SPD Jumper1x2 Header (2.54mm)Hardware jumper for 1-cycle vs 2-cycle private memory access speed selection (Pin 81 / R5).

8. Estimated Power Consumption Analysis

Operating at $5\text{V}$, the Rev C1 CPU card draws a typical active current of ~170 mA (~0.85 W) and a worst-case peak switching current of ~280 mA (~1.40 W). The power load is split between the primary Z80 CPU subsystem and the high-speed coprocessor cluster.

A. Primary CPU & Bus Interface Subsystem

ComponentPart NumberQtyTyp. CurrentMax CurrentNotes
Z80 CPU (10 MHz)Z84C00xxP110 mA20 mACMOS low-power core
Bus TransceiversSN74ABT245BN415 mA40 mADrives 8-slot backplane capacitance
Wait-State Logic74AHCT74 / 13228 mA15 mADual D-FF & Schmitt NAND gates
Glue Logic & Supervisor74AHC1Gxx / MCP131653 mA5 mASOT-23 micro-logic & reset controller
Status LEDs & Pull-upsPWR, HALT LEDs28 mA10 mA~$470\Omega$ current limiting
Subtotal (CPU Side)~44 mA~90 mA~0.22 W Typ / 0.45 W Max

B. Coprocessor Cluster Subsystem (Bottom Layer)

ComponentPart NumberQtyTyp. CurrentMax CurrentNotes
CPLD (20/40 MHz MCLK)ATF1508ASx-xxJx84165 mA100 mADynamic $I_{CC}$ scales with MCLK frequency
Private SRAM (25 ns)IS61C5128AS-25QLI115 mA30 mAActive read/write state
Private Flash (55 ns)SST39SF040115 mA30 mAActive table read state
Subtotal (Coprocessor)~95 mA~160 mA~0.48 W Typ / 0.80 W Max

C. Total Card Power Summary

  • Typical Active Load: 139 mA – 170 mA (~0.70 W – 0.85 W @ 5V)
  • Maximum Peak Load: 250 mA – 280 mA (~1.25 W – 1.40 W @ 5V)

Parts

235
QtyValueFootprintReferences
53100nCapacitor_SMD:C_0402_1005MetricC10, C11, C12, C13, C14, C15, C16, C17, C18, C22, C23, C24, C28, C29, C30, C31 +37
2510kResistor_SMD:R_0402_1005MetricR23, R28, R30, R32, R102, R107, R108, R113, R118, R119, R120, R121, R122, R123, R124, R125 +9
12330Resistor_SMD:R_0805_2012MetricR7, R8, R9, R10, R11, R12, R13, R14, R19, R20, R21, R22
1133Resistor_SMD:R_0402_1005MetricR78, R92, R93, R94, R95, R96, R97, R98, R99, R100, R101
1010kResistor_SMD:R_0805_2012MetricR1, R2, R3, R68, R69, R70, R71, R72, R73, R76
1010uCapacitor_SMD:C_1206_3216MetricC1, C2, C3, C6, C8, C77, C78, C79, C80, C85
974LVC245Package_SO:TSSOP-20_4.4x6.5mm_P0.65mmU3, U4, U5, U6, U9, U11, U21, U23, U24
81KResistor_SMD:R_0402_1005MetricR48, R49, R50, R51, R58, R59, R60, R61
8220nFCapacitor_SMD:C_0402_1005MetricC44, C45, C46, C47, C50, C51, C52, C53
849R9Resistor_SMD:R_0402_1005MetricR44, R45, R46, R47, R54, R55, R56, R57
84k7Resistor_SMD:R_0402_1005MetricR24, R25, R26, R27, R29, R31, R34, R37
775Resistor_SMD:R_0603_1608MetricR33, R36, R52, R53, R62, R63, R67
5YLWLED_SMD:LED_0805_2012MetricD3, D4, D5, D6, D13
4BLUELED_SMD:LED_0805_2012MetricD15, D16, D17, D18
4IS61WV10248EDBLLzx50_footprints:TSOP-44_11P9X18P5_ISIU15, U16, U17, U18
333RResistor_SMD:R_Array_Convex_8x0602RN2, RN3, RN4
3GRNLED_SMD:LED_0805_2012MetricD1, D19, D20
21MResistor_SMD:R_0805_2012MetricR64, R65
21N5819Diode_SMD:D_SOD-323D8, D9
21n 2kVCapacitor_SMD:C_1206_3216MetricC56, C57
233RResistor_SMD:R_0603_1608MetricR4, R5
2470RResistor_SMD:R_0805_2012MetricR38, R39
274LVC1G17digikey-footprints:SOT-753U7, U8
2GNDConnector_PinHeader_2.54mm:PinHeader_1x01_P2.54mm_VerticalJ6, J7
2IS25LP080D-JNLE-TRzx50_footprints:SOIC127P600X88-8NU19, U20
2REDLED_SMD:LED_0805_2012MetricD2, D14
2RJ45_RB1-125B8G1Azx50_footprints:HANRUN_HR911130AJ11, J12
1100Resistor_SMD:R_0805_2012MetricR6
110KResistor_THT:R_Array_SIP6RN1
11uFCapacitor_SMD:C_0402_1005MetricC69
12.5VConnector_PinHeader_2.54mm:PinHeader_1x01_P2.54mm_VerticalJ1
1200nCapacitor_SMD:C_0402_1005MetricC55
125 MHzCrystal:Crystal_SMD_3225-4Pin_3.2x2.5mmY1
13.3VConnector_PinHeader_2.54mm:PinHeader_1x01_P2.54mm_VerticalJ2
1600Rdigikey-footprints:0805FB1
174LVC3G07Package_SO:VSSOP-8_2.3x2mm_P0.5mmU10
1AMS1117-2.5Package_TO_SOT_SMD:SOT-223-3_TabPin2U1
1AMS1117-3.3Package_TO_SOT_SMD:SOT-223-3_TabPin2U2
1DEBUGConnector_IDC:IDC-Header_2x09_P2.54mm_VerticalJ8
1DONELED_THT:LED_D3.0mmD10
1INITLED_THT:LED_D3.0mmD7
1JTAG 5VConnector_IDC:IDC-Header_2x06_P2.54mm_HorizontalJ9
1JTAG ACTLED_THT:LED_D3.0mmD11
1LCMXO3LF-6900C-5BG400Czx50_footprints:CABGA400_LATU12
1RESETButton_Switch_THT:SW_PUSH_6mm_H7.3mmSW2
1RS232 5VConnector_IDC:IDC-Header_2x03_P2.54mm_HorizontalJ10
1RS232 ACTLED_THT:LED_D3.0mmD12
1SN74LVC1G17DBVRdigikey-footprints:SOT-753U22
1SW_DIP_x05Button_Switch_THT:SW_DIP_SPSTx05_Slide_9.78x14.88mm_W7.62mm_P2.54mmSW1
1TP_CLKConnector_PinHeader_2.54mm:PinHeader_1x01_P2.54mm_VerticalJ4
1TP_MCLKConnector_PinHeader_2.54mm:PinHeader_1x01_P2.54mm_VerticalJ5
1TXU0204PWRzx50_footprints:TSSOP14_PW_TEXU13
1TXU0304PWRzx50_footprints:TSSOP14_PW_TEXU14
1Zx50_EdgeConnectorzx50_footprints:PinSocket_2x40_P2.54mm_Horizontal_EdgeJ3

More from mmosko/Zx50

12
  • 6 layers133.5 × 100.3 mmZx50 Cpu RevC3, the printed circuit board in 3D

    Zx50 Cpu RevC3

    mmosko/Zx50

    This is the primary CPU board for the Zx50 8-slot passive backplane system. It hosts the Z80 microprocessor (running at 5 MHz to 10 MHz) and acts as the master controller for the primary bus.

    87 parts
  • 4 layers145.9 × 147.3 mmZx50 Bus Probe RevB, the printed circuit board in 3D

    Zx50 Bus Probe RevB

    mmosko/Zx50

    This is the primary CPU board for the Zx50 8-slot passive backplane system. It hosts the Z80 microprocessor (running at 5 MHz to 10 MHz) and acts as the master controller for the primary bus.

    80 parts
  • 4 layers210.8 × 137.2 mmZx50 Backplane RevD, the printed circuit board in 3D

    Zx50 Backplane RevD

    mmosko/Zx50

    This is the primary CPU board for the Zx50 8-slot passive backplane system. It hosts the Z80 microprocessor (running at 5 MHz to 10 MHz) and acts as the master controller for the primary bus.

    75 parts
  • 4 layers222.1 × 158.1 mmZx50 Bus Probe RevA, the printed circuit board in 3D

    Zx50 Bus Probe RevA

    mmosko/Zx50

    This is the primary CPU board for the Zx50 8-slot passive backplane system. It hosts the Z80 microprocessor (running at 5 MHz to 10 MHz) and acts as the master controller for the primary bus.

    72 parts
  • 6 layers133.5 × 100.3 mmZx50 Cpu RevC1, the printed circuit board in 3D

    Zx50 Cpu RevC1

    mmosko/Zx50

    This is the primary CPU board for the Zx50 8-slot passive backplane system. It hosts the Z80 microprocessor (running at 5 MHz to 10 MHz) and acts as the master controller for the primary bus.

    59 parts
  • 4 layers123.4 × 129.8 mmZx50 MemoryCard RevA, the printed circuit board in 3D

    Zx50 MemoryCard RevA

    mmosko/Zx50

    This is the primary CPU board for the Zx50 8-slot passive backplane system. It hosts the Z80 microprocessor (running at 5 MHz to 10 MHz) and acts as the master controller for the primary bus.

    53 parts
  • 2 layers218.4 × 137.2 mmZ80home RevC, the printed circuit board in 3D

    Z80home RevC

    mmosko/Zx50

    This is the primary CPU board for the Zx50 8-slot passive backplane system. It hosts the Z80 microprocessor (running at 5 MHz to 10 MHz) and acts as the master controller for the primary bus.

    42 parts
  • 4 layers50.2 × 69.8 mmZx50 Clock Mezzanine RevC, the printed circuit board in 3D

    Zx50 Clock Mezzanine RevC

    mmosko/Zx50

    This is the primary CPU board for the Zx50 8-slot passive backplane system. It hosts the Z80 microprocessor (running at 5 MHz to 10 MHz) and acts as the master controller for the primary bus.

    40 parts
  • 2 layers152.4 × 114.3 mmZx50 FrontPanelDisplay, the printed circuit board in 3D

    Zx50 FrontPanelDisplay

    mmosko/Zx50

    This is the primary CPU board for the Zx50 8-slot passive backplane system. It hosts the Z80 microprocessor (running at 5 MHz to 10 MHz) and acts as the master controller for the primary bus.

    39 parts
  • 4 layers133.5 × 100.3 mmZx50 Cpu RevB, the printed circuit board in 3D

    Zx50 Cpu RevB

    mmosko/Zx50

    This is the primary CPU board for the Zx50 8-slot passive backplane system. It hosts the Z80 microprocessor (running at 5 MHz to 10 MHz) and acts as the master controller for the primary bus.

    38 parts
  • 4 layers133.5 × 100.3 mmZx50 Cpu, the printed circuit board in 3D

    Zx50 Cpu

    mmosko/Zx50

    This is the primary CPU board for the Zx50 8-slot passive backplane system. It hosts the Z80 microprocessor (running at 5 MHz to 10 MHz) and acts as the master controller for the primary bus.

    26 parts
  • 4 layers132.1 × 81.9 mmZx50 Serial, the printed circuit board in 3D

    Zx50 Serial

    mmosko/Zx50

    This is the primary CPU board for the Zx50 8-slot passive backplane system. It hosts the Z80 microprocessor (running at 5 MHz to 10 MHz) and acts as the master controller for the primary bus.

    25 parts

Similar boards

  • 2 layersDSP V0 1, the printed circuit board in 3D

    DSP V0 1

    CoderCallender/DSP_Projects

    Digital Signal Processing Hardware and Firmware

    170 parts
  • 2 layersBLE node, the printed circuit board in 3D

    BLE node

    ldab/BLE-node-u-blox

    u-blox NINA-B3 BLE node, based on nRF52840 and SHTC3

    19 parts2MIT
  • 2 layers65 × 30.8 mmRadio, the printed circuit board in 3D

    Radio

    SSL-A-Team/electrical

    circuit board design files, gerbers, and circuit analysis

    32 parts6MIT
  • 2 layers101.6 × 147.3 mmKarabas pro revER, the printed circuit board in 3D

    Karabas pro revER

    andykarpov/karabas-pro

    FPGA based retrocomputer with FDD and HDD controllers

    223 parts37MIT
  • 4 layers120 × 92 mmKehvm, the printed circuit board in 3D

    Kehvm

    knewter/kvm-board

    An open-source KVM-over-IP device built with a Milk-V Duo S (RISC-V) and ESP32-S3. Remotely control any computer's keyboard, video, and mouse over your network — at the hardware level, independent of the target's OS.

    70 parts2
  • 4 layers52 × 72 mmRISCV SoC Board, the printed circuit board in 3D

    RISCV SoC Board

    Umer-Haseeb/RISCV_SoC_Board_PCB

    91 parts
  • 2 layers95 × 55 mmDolbyDecoder, the printed circuit board in 3D

    DolbyDecoder

    duanestorey/hifi-amplifier

    A Custom 5.1 LM3886 Based Custom Amplifier

    134 parts3

Questions

How big is the Zx50 MemoryCard RevC1 PCB?

It measures 132.1 × 107.9 mm and has 6 copper layers, 1.6 mm thick.

What parts does the Zx50 MemoryCard RevC1 use?

235 parts, built around the LCMXO3LF-6900C-5BG400C, 74LVC245AD, 74LVC3G07DC and IS25LP080D-JNLE-TR. The full list of its parts is on this page, with links to each part's symbol and footprint where PCBKit's library has them.

Where can I download the Zx50 MemoryCard RevC1 KiCad files?

From the mmosko/Zx50 repository on GitHub, at the commit this page was made from: the board is boards/Zx50_MemoryCard_RevC1/Zx50_MemoryCard_RevC1.kicad_pcb. PCBKit opens the board in the browser, with nothing to install.

Can I use the Zx50 MemoryCard RevC1 design in my own project?

Its repository states no licence, so its author keeps all rights: ask mmosko before reusing the design.