
Bluetooth Channel Sounding Tag
Compact nRF54L15 Bluetooth Channel Sounding tag with dual PCB antennas, motion sensing, and rechargeable power management. Designed in KiCad 10.
- Size
- 35 × 42.5 mm
- Copper layers
- 4
- Thickness
- 1.58 mm
- Parts
- 71
- Nets
- 81
- Pads
- 255
- Tracks, vias
- 618, 106
- Pours
- 5
- Routed
- Yes
- KiCad
- KiCad 10.0 (file 20260206)
- Created
- 26 Oct 2026
- Updated
- 26 Oct 2026
Overview
Bluetooth Channel Sounding Tag is an open-source printed circuit board by JaphD, from the JaphD/Phasetag repository on GitHub. It is a 4-layer board of 35 × 42.5 mm with 71 parts on 81 nets, routed with 618 tracks and 106 vias.
It is built around the NRF54L15-QFAA-R, LIS2DW12TR-MS and NPM1300-QEAA-R7, with the 0201WMF0000TEE, LQP03HQ3N5B02D and CL05B104KB54PNC among its other parts. Its parts include 30 capacitors, 10 resistors, 6 inductors, 4 ICs and 3 transistors. It belongs with the radio and wireless boards and the nRF52 and nRF5x boards of this library.
Main components
12NRF54L15-QFAA-R
QFN-48(6x6)Power-on reset (POR)、Undervoltage detection (BOR/LVD/LVR/LVI)、Watchdog reset、Software reset、External pin reset (NRST)、Built-in general-purpose timer、Calendar function、Built-in temperature sensor QFN-48(6x6) Microcontrollers (MCU/MPU/SOC) ROHSNordic SemiconMicrocontrollers (MCU/MPU/SOC)LIS2DW12TR-MS
LGA-12(2x2)-40℃~+85℃ 1.71V~3.6V 12bit 500nA Accelerometer SPI、I2C X,Y,Z ±16g LGA-12(2x2) Accelerometers ROHSMSKSEMIAccelerometersNPM1300-QEAA-R7
QFN-32-EP(5x5)Adjustable current limiting、Light-load high efficiency mode、Output discharge QFN-32-EP(5x5) Power Management - Specialized ROHSNordic SemiconPower Management - Specialized0201WMF0000TEE
0201-55℃~+155℃ 0Ω 25V 50mW Thick Film Resistor ±1% 0201 Chip Resistor - Surface Mount ROHSUNI-ROYALChip Resistor - Surface MountLQP03HQ3N5B02D
0201170mΩ 20@500MHz 3.5nH 500mA 7GHz Thick Film Inductor 0201 Inductors (SMD) ROHSMurataInductors (SMD)CL05B104KB54PNC
0402100nF 50V X7R ±10% 0402 Multilayer Ceramic Capacitors MLCC - SMD/SMT ROHSSamsung Electro-MechanicsMultilayer Ceramic Capacitors MLCC - SMD/SMTCC0201KRX7R7BB103
020110nF 16V X7R ±10% 0201 Multilayer Ceramic Capacitors MLCC - SMD/SMT ROHSYAGEOMultilayer Ceramic Capacitors MLCC - SMD/SMT0201WMF1001TEE
0201-55℃~+155℃ 1kΩ 25V 50mW Thick Film Resistor ±1% ±200ppm/℃ 0201 Chip Resistor - Surface Mount ROHSUNI-ROYALChip Resistor - Surface Mount0201B222K160NT
020116V 2.2nF X7R ±10% 0201 Multilayer Ceramic Capacitors MLCC - SMD/SMT ROHSGuangdong Fenghua Advanced Tech (FH)Multilayer Ceramic Capacitors MLCC - SMD/SMTMLP2012S2R2MT0S1
08052.2uH 299mΩ 800mA Multilayer inductor ±20% 0805 Inductors (SMD) ROHSTDKInductors (SMD)LQP03HQ2N7B02D
0201120mΩ 2.7nH 20@500MHz 600mA 9GHz Thick Film Inductor 0201 Inductors (SMD) ROHSMurataInductors (SMD)TCC0201COG3R9C500ZT
02013.9pF 50V C0G 0201 Multilayer Ceramic Capacitors MLCC - SMD/SMT ROHSCCTCMultilayer Ceramic Capacitors MLCC - SMD/SMT
README
README.mdPhaseTag
PhaseTag is a compact, rechargeable Bluetooth Channel Sounding tag designed around the Nordic nRF54L15. It brings together two selectable PCB antennas, motion sensing and USB-C charging on a 35 x 42.5 mm, four-layer PCB designed with JLCPCB manufacturing and assembly in mind.
The aim is to explore wireless distance estimation with a compatible Channel Sounding peer and report results over BLE to a suitable host application. Motion sensing provides a basis for activity detection and low-power operation.
Rev A is a hardware portfolio design. Firmware, physical bring-up, antenna tuning, ranging accuracy and battery life have not been validated. The images below are KiCad renders and a PCB editor view.
Board preview
| Top view | Bottom view |
|---|---|
![]() | ![]() |
PCB layout

Main hardware
| Block | Implementation |
|---|---|
| MCU and radio | Nordic nRF54L15-QFAA with 32 MHz and 32.768 kHz crystals |
| Power management | Nordic nPM1300 for single-cell LiPo charging, USB/battery power-path management and the 1.8 V rail |
| RF path | Nordic matching network, BGS12WN6 antenna switch and two perpendicular TI AN043 PCB inverted-F antennas |
| Motion sensing | ST LIS2DW12 accelerometer with an interrupt connection to the MCU |
| Power inputs | Power-only USB-C with VBUS ESD protection; 2 mm JST-PH battery connector with reverse-polarity protection |
| User interface | PMIC-controlled status LED and SHPHLD wake/recovery button |
| Programming | Six-pad Tag-Connect SWD/SWO interface, reset and target-voltage reference |
| Test access | Ground, battery, VSYS, 1.8 V, SDA and SCL test pads |
Design choices
Power and battery
BUCK1 supplies the 1.8 V MCU and peripheral rail. BUCK2 and both load-switch/LDO outputs are unused to keep the power circuit small. The nPM1300 allows USB to power the system while charging the battery, subject to the available input-current and power budgets. The PMIC and accelerometer share a 1.8 V I2C bus with one pair of 4.7 kohm pull-ups.
The battery sits separately from the PCB. A PKCELL LP402535, 3.7 V, 330 mAh LiPo is a candidate rather than a fixed requirement. The reverse-polarity circuit follows the approach in Analog Devices AN171, Figure 4, accommodating charging and discharge current. Battery polarity and charging limits must match the chosen pack.
Battery NTC sensing is omitted in this revision. Firmware must configure the PMIC accordingly and set the charging current, termination voltage and USB input-current limit. PMIC measurements support battery monitoring; a useful remaining-capacity estimate also requires appropriate firmware and battery characterization.
RF and antenna selection
The MCU supply, oscillator and matching circuitry use the Nordic nRF54L15-QFAA Configuration 1 reference as their baseline. The RF switch selects one antenna at a time. The perpendicular antennas provide different orientations for evaluation; they do not operate as a combined antenna array.
Both antenna paths retain pi-matching footprints. R9 and R10 are fitted as 0-ohm links, while C27 through C30 are unpopulated. These footprints preserve tuning options for a future prototype. The TI antenna geometry is a reference starting point; copying its shape does not establish the final board's RF performance.
The nominal 50-ohm top-layer feed width retained in the design is 0.18379 mm, referenced to the adjacent inner ground layer. This target depends on the selected stackup and surrounding copper. It has not been verified by measurement.
Compact construction and access
All components are populated on the top side. Tag-Connect programming pads avoid a fitted debug header, and the separate battery helps minimize the board area. One M2 mounting hole is provided, with a future enclosure expected to provide a second support and prevent rotation.
USB-C carries power only. Bluetooth is the intended application-data interface. Channel Sounding needs a compatible peer; ordinary BLE support alone does not make a phone suitable for ranging. Bluetooth Mesh remains a possible future firmware application.
JLCPCB manufacturing and assembly
The fabrication target is nominal 1.6 mm, four-layer FR-4, based on the JLC04161H-3313 stackup:
| Layer | Purpose |
|---|---|
| F.Cu | Components, RF paths and signal/power routing |
| In1.Cu | Main ground reference |
| In2.Cu | Limited power routing and ground fill |
| B.Cu | Remaining signals and ground fill |
- Component selection uses JLCPCB/LCSC part numbers. Small packages, including 0201 passives, and Extended parts are accepted design tradeoffs. Stock, substitutes and assembly-service eligibility need checking when ordering.
- The 16 vias beneath the nRF exposed pad require epoxy filling and copper capping. Identify these vias explicitly in the fabrication order; the KiCad protection settings alone are insufficient manufacturing instructions.
- Preserve the antenna keepouts and RF ground arrangement. A change in stackup requires the feed geometry to be checked again.
- Manufacturing outputs comprise Gerbers, drills, a BOM and a CPL/position file. Verify package, polarity, rotation and matching designators. Exclude DNP parts, PCB antennas, test pads, the mounting hole and logo from fitted-component data.
The reference basis also includes Nordic's nPM1300 Configuration 2 circuit, adapted for the selected power architecture, and the ST LIS2DW12 datasheet. These references inform the design; they do not replace prototype validation.
Opening the project
Open Bluetooth_Channel_Sounding_Tag.kicad_pro in KiCad 10.
- The project files contain the schematic, board and design rules.
Lib/contains the imported symbols, footprints and 3D models, referenced through the project library tables. Imported absolute 3D-model paths may need remapping to this directory on another computer.logo/contains the PhaseTag logo artwork and footprint.images/contains the board renders and layout screenshot used above.
Designed by Yafet Daniel.
Parts
71| Qty | Value | Footprint | References |
|---|---|---|---|
| 8 | 100nF | BCS:C0201 | C7, C10, C11, C12, C13, C22, C25, C26 |
| 4 | 10uF | BCS:C0603 | C2, C3, C6, C24 |
| 4 | Tune | BCS:C0201 | C27, C28, C29, C30 |
| 3 | 100K | BCS:R0201 | R5, R6, R8 |
| 2 | 0 | BCS:R0201 | R9, R10 |
| 2 | 1uF | BCS:C0603 | C1, C4 |
| 2 | 2.2uF | BCS:C0201 | C14, C15 |
| 2 | 3.5nH | BCS:L0201 | L5, L6 |
| 2 | 4.7K | BCS:R0201 | R2, R3 |
| 1 | 0.3pF | BCS:C0201 | C21 |
| 1 | 1.5pF | BCS:C0201 | C19 |
| 1 | 100nF | BCS:C0402 | C8 |
| 1 | 10nF | BCS:C0201 | C16 |
| 1 | 10uF | BCS:C0402 | C9 |
| 1 | 1K | BCS:R0201 | R7 |
| 1 | 2.2nF | BCS:C0201 | C17 |
| 1 | 2.2uF | BCS:C0603 | C5 |
| 1 | 2.2uH | BCS:L0805 | L1 |
| 1 | 2.7nH | BCS:L0201 | L4 |
| 1 | 22K | BCS:R0201 | R4 |
| 1 | 2pF | BCS:C0201 | C20 |
| 1 | 3.9pF | BCS:C0201 | C18 |
| 1 | 32.768KHz | BCS:CRYSTAL-SMD_L2.0-W1.2 | X2 |
| 1 | 32MHz | BCS:CRYSTAL-SMD_4P-L2.0-W1.6-BL | X1 |
| 1 | 4.7uH | BCS:L0603 | L2 |
| 1 | 47K | BCS:R0201 | R1 |
| 1 | 47pF | BCS:C0201 | C23 |
| 1 | AO3401A | BCS:SOT-23_L2.9-W1.3-P1.90-LS2.4-BR | Q2 |
| 1 | APG0603CGC-TT | BCS:LED-SMD_L0.7-W0.4-RD_GREEN-1 | LED1 |
| 1 | BGS 12WN6 E6327 | BCS:TSNP-6_L1.1-W0.7-P0.40-BL | U3 |
| 1 | BLM03AG121SN1D | BCS:L0201 | L3 |
| 1 | Conn_02x03_Odd_Even | Connector:Tag-Connect_TC2030-IDC-NL_2x03_P1.27mm_Vertical | J1 |
| 1 | DMN2056U-7 | BCS:SOT-23-3_L2.9-W1.6-P1.90-LS2.8-BR | Q3 |
| 1 | ESD441DPLR | BCS:X2SON-2_L0.6-W0.3-P0.35 | D1 |
| 1 | GND | TestPoint:TestPoint_Pad_D1.0mm | TP1 |
| 1 | LIS2DW12TR | BCS:LGA-12_L2.0-W2.0-P0.50-BL | U4 |
| 1 | LOGO | BCS:PhaseTag_Logo | G*** |
| 1 | MMBT3904-C20526 | BCS:SOT-23-3_L2.9-W1.3-P1.90-LS2.4-BR | Q1 |
| 1 | MountingHole_2.2mm_M2 | MountingHole:MountingHole_2.2mm_M2 | H1 |
| 1 | NPM1300-QEAA-R7 | BCS:QFN-32_L5.0-W5.0-P0.50-TL-EP3.5 | U1 |
| 1 | NRF54L15-QFAA-R | BCS:QFN-48_L6.0-W6.0-P0.40-TL-EP4.6 | U2 |
| 1 | S2B-PH-SM4-TB | BCS:CONN-SMD_P2.00_S2B-PH-SM4-TB-LF-SN | CN1 |
| 1 | SCL | TestPoint:TestPoint_Pad_D1.0mm | TP5 |
| 1 | SDA | TestPoint:TestPoint_Pad_D1.0mm | TP6 |
| 1 | TI_AN043_IFA | RF_Antenna:Texas_SWRA117D_2.4GHz_Right | AE2 |
| 1 | TI_AN043_IFA | RF_Antenna:Texas_SWRA117D_2.4GHz_Left | AE1 |
| 1 | TS-1088-AR02016 | BCS:SW-SMD_L3.9-W3.0-P4.45 | SW1 |
| 1 | USB4105-GF-A-060 | BCS:USB-C-SMD_GT-USB-7010E-1 | USB1 |
| 1 | VBAT | TestPoint:TestPoint_Pad_D1.0mm | TP2 |
| 1 | VOUT1 | TestPoint:TestPoint_Pad_D1.0mm | TP4 |
| 1 | VSYS | TestPoint:TestPoint_Pad_D1.0mm | TP3 |
Questions
How big is the Bluetooth Channel Sounding Tag PCB?
It measures 35 × 42.5 mm and has 4 copper layers, 1.58 mm thick.
What parts does the Bluetooth Channel Sounding Tag use?
71 parts, built around the NRF54L15-QFAA-R, LIS2DW12TR-MS, NPM1300-QEAA-R7 and 0201WMF0000TEE. The full list of its parts is on this page, with links to each part's symbol and footprint where PCBKit's library has them.
Where can I download the Bluetooth Channel Sounding Tag KiCad files?
From the JaphD/Phasetag repository on GitHub, at the commit this page was made from: the board is Bluetooth_Channel_Sounding_Tag.kicad_pcb and its schematic Bluetooth_Channel_Sounding_Tag.kicad_sch. PCBKit opens the board in the browser, with nothing to install.
Can I use the Bluetooth Channel Sounding Tag design in my own project?
Its repository states no licence, so its author keeps all rights: ask JaphD before reusing the design.
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