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2 layers70 × 100 mmBREAD Slice, the printed circuit board in 3D

BREAD Slice

FHafting/BREAD5

This project is fully documented in the paper: Shane Oberloier, Nicholas G. Whisman, Finn Hafting, Joshua M. Pearce, Open Source Framework for a Broadly Expandable and Reconfigurable Data Acquisition and Automation Device (BREAD), ''HardwareX'', 2023, e00467, https://doi.org/10.1016/j.ohx.2023.e00467.

Size
70 × 100 mm
Copper layers
2
Thickness
1.67 mm
Parts
48
Nets
53
Pads
161
Tracks, vias
284, 23
Pours
1
Routed
Yes
KiCad
KiCad 7 (file 20221018)
Created
13 Feb 2024
Updated
28 Jun 2024

Overview

BREAD Slice is an open-source printed circuit board by FHafting, from the FHafting/BREAD repository on GitHub. It is a 2-layer board of 70 × 100 mm with 48 parts on 53 nets, routed with 284 tracks and 23 vias.

It is built around the MAX6675ISA+, TCMT1100 and WS2812B-5050RGB. Its parts include 18 connectors, 6 capacitors, 5 ICs, 3 diodes and 2 switches. It belongs with the AVR (ATmega, ATtiny) boards of this library.

Main components

3

README

README.md

BREAD

This project is fully documented in the paper: Shane Oberloier, Nicholas G. Whisman, Finn Hafting, Joshua M. Pearce, Open Source Framework for a Broadly Expandable and Reconfigurable Data Acquisition and Automation Device (BREAD), ''HardwareX'', 2023, e00467, https://doi.org/10.1016/j.ohx.2023.e00467.

All case designs can be found on Onshape: https://cad.onshape.com/documents/f4c13a5c0b1f8d88ed1f5752/w/29d0c0346ddaeb06e16ff42f/e/1077373224ada363d171e3fe?renderMode=0&uiState=65d3aad45b82c32cb51ae4c9

Parts

48
QtyValueFootprintReferences
11Term_PressFit_Phoenix_ContactSparkFun-Connector:Term_PressFit_5mm_H_PC_HVRELAYJ6, J7, J8, J9, J10, J13, J14, J15, J16, J17, J18
4Ferrite_Bead_SmallResistor_SMD:R_1206_3216MetricFB1, FB2, FB3, FB4
4MountingHoleMountingHole:MountingHole_5mmH1, H2, H3, H4
322uFCapacitor_SMD:C_1206_3216MetricC1, C3, C4
3Term_PressFit_Phoenix_ContactSparkFun-Connector:Term_PressFit_3.5mm_H_PCJ3, J11, J12
20.01 uFCapacitor_SMD:C_1206_3216MetricC5, C6
210ASparkFun-Fuse:Glass Fuse Clip 5x20MMF1, F2
2G5Q-1Relay_THT:Relay_SPDT_Omron-G5Q-1K1, K2
2General_Purpose_DiodeDiode_THT:D_DO-35_SOD27_P7.62mm_HorizontalD2, D3
2MAX6675ISA+MAX6675ISA_:SOIC127P600X175-8NU3, U4
2TCMT1100Package_SO:SOP-4_4.4x2.6mm_P1.27mmU2, U5
1100nFCapacitor_SMD:C_1206_3216MetricC2
14.7uHInductor_SMD:L_1210_3225MetricL1
1Arduino_Nano_v3.xModule:Arduino_NanoA1
1Conn_01x10_FemaleConnector_PinSocket_2.54mm:PinSocket_1x10_P2.54mm_HorizontalJ1
1Heatsink_PadSparkFun-Fuse:Thermal PadHS1
1I2C_01x04Connector_JST:JST_SH_SM04B-SRSS-TB_1x04-1MP_P1.00mm_HorizontalJ2
1Logo_Open_Hardware_SmallSymbol:OSHW-Symbol_6.7x6mm_SilkScreenLogo1
1Term_PressFit_Phoenix_ContactSparkFun-Connector:Term_PressFit_5mm_H_ENDCAP_PC_HVRELAYJ5
1Term_PressFit_Phoenix_ContactSparkFun-Connector:Term_PressFit_3.5mm_H_ENDCAP_PCJ4
1WS2812B_5050SparkFun-LED:WS2812-5050-4PIND1
1~Package_TO_SOT_SMD:TSOT-23-6U1

Questions

How big is the BREAD Slice PCB?

It measures 70 × 100 mm and has 2 copper layers, 1.67 mm thick.

What parts does the BREAD Slice use?

48 parts, built around the MAX6675ISA+, TCMT1100 and WS2812B-5050RGB. The full list of its parts is on this page, with links to each part's symbol and footprint where PCBKit's library has them.

Where can I download the BREAD Slice KiCad files?

From the FHafting/BREAD repository on GitHub, at the commit this page was made from: the board is [SLC_RLHT] Relay Heating Element Controller/Hardware/BREAD_Slice.kicad_pcb and its schematic [LOAF_ESPTP] ESP32 Thing Plus Controller/Hardware/BREAD_Loaf.kicad_sch. PCBKit opens the board in the browser, with nothing to install.

Can I use the BREAD Slice design in my own project?

Its repository states no licence, so its author keeps all rights: ask FHafting before reusing the design.

More from FHafting/BREAD

3
  • 2 layers70 × 100 mmBREAD Slice, the printed circuit board in 3D

    BREAD Slice

    FHafting/BREAD

    This project is fully documented in the paper: Shane Oberloier, Nicholas G. Whisman, Finn Hafting, Joshua M. Pearce, Open Source Framework for a Broadly Expandable and Reconfigurable Data Acquisition and Automation…

    46 parts5
  • 2 layers35.4 × 50.7 mmBREAD Loaf, the printed circuit board in 3D

    BREAD Loaf

    FHafting/BREAD

    This project is fully documented in the paper: Shane Oberloier, Nicholas G. Whisman, Finn Hafting, Joshua M. Pearce, Open Source Framework for a Broadly Expandable and Reconfigurable Data Acquisition and Automation…

    33 parts5
  • 2 layers121.2 × 50 mmBREAD Loaf, the printed circuit board in 3D

    BREAD Loaf

    FHafting/BREAD

    This project is fully documented in the paper: Shane Oberloier, Nicholas G. Whisman, Finn Hafting, Joshua M. Pearce, Open Source Framework for a Broadly Expandable and Reconfigurable Data Acquisition and Automation…

    8 parts5

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