Rixard86/shot-trackerA Ø40 × 10.4 mm puck that bolts onto the free face of an Avalon riser weight (the weight's own 5/16-24 bolt, one size longer, goes through its centre), detects each shot with a 6-axis IMU, records the bow's motion…
Shotpuck panel is an open-source printed circuit board by Rixard86, from the Rixard86/shot-tracker repository on GitHub. It is a 2-layer board of 91 × 70 mm with 221 parts on 152 nets, routed with 598 tracks and 118 vias.
It is built around the BMD-340-A-R, MCP73831T-2ACI/OT-HXY and BAT54J, with the DMN2004DWK, DMN63D8LDW and SMF5.0CA among its other parts. Its parts include 18 resistors, 16 capacitors, 8 ICs, 8 diodes and 4 transistors.
A Ø40 × 10.4 mm puck that bolts onto the free face of an Avalon riser weight (the weight's own 5/16-24 bolt, one size longer, goes through its centre), detects each shot with a 6-axis IMU, records the bow's motion around it (accelerometer + gyroscope, 1.0 s before to 0.5 s after release), and reports both over BLE to the scoring app.
| Size / mass | Ø40 mm (= the Avalon barebow weight's diameter), 10.43 mm above the weight face (2.0 mm flat aluminium plate; the 1.2 mm PCB on 3 mm standoffs, the cell in a notch in the PCB), 17.1 g, centre of mass 0.5 mm off axis (no trim weight); 1.6 mm free space above the cell |
| Radio / MCU | u-blox BMD-340 (nRF52840, 1 MB flash / 256 KB RAM, PCB antenna), BLE 5 |
| Sensor | ST LSM6DSV32X IMU: 480 Hz, ±32 g accelerometer + ±2000 dps gyroscope while active; accelerometer only, 15 Hz wake-on-motion, while idle |
| Battery | LIR1254 Li-ion coin, 45–65 mAh, plain (no tabs) on spring contacts, protected by TI BQ29700 + DMN2004DWK; charged through a waterproof (IPX8) side-entry USB-C port, power only (21 mA, temperature-gated) |
| Firmware | Zephyr 4.1, custom board shotpuck/nrf52840, MCUboot 28 KB + signed app 196 KB (452 KB slot) / 95 KB RAM (51 KB of it capture buffers) |
| Updates | Over the air: MCUboot with ECDSA-P256 signed images and automatic rollback, MCUmgr/SMP over BLE for paired phones, 10 s watchdog |
| Security / sync | Pairing required (LE Secure Connections); new phones only within 60 s of attaching the charger. Last ~900 shots kept in flash for replay. |
layout.json shared geometry: CAD and PCB both read it
firmware/ Zephyr app (src/, boards/shotpuck/, prj.conf, debug.conf)
firmware/sim/ Monte Carlo validation of src/shot_detect.c, unit tests of capture.c, evlog.c, chg_led.c and recovery.c (+ results.txt)
firmware/VERSION firmware version (signed into the OTA image, shown in DIS and STATUS)
firmware/sysbuild.* MCUboot + signing setup (refuses MCUboot's public dev key)
firmware/shotpuck_full.hex MCUboot + signed app, for the first flash via the SWD test pads
firmware/shotpuck_update.bin signed app image for OTA updates
hardware/design.py the circuit (single source of truth)
hardware/design_mini.py ShotPuck mini circuit: 33 x 33 mm square board for a Picatinny-rail case, CR2450 on the back
hardware/gen_sch.py -> kicad/shotpuck.kicad_sch (`gen_sch.py design_mini` -> kicad/shotpuck-mini.kicad_sch)
hardware/check_netlist.py KiCad netlist vs design.py (`check_netlist.py design_mini` for the mini)
hardware/gen_pcb.py -> kicad/shotpuck.kicad_pcb (place, keep-outs, route, DRC)
hardware/gen_mini_pcb.py -> kicad/shotpuck-mini.kicad_pcb (outline, CR2450 clip footprint, parts placed,
antenna keep-out, GND pours; unrouted, routed by hand, never overwritten)
hardware/board_shape.py board outline, cell notch, bolt hole and antenna zone (shapely, from layout.json)
hardware/islands.py post-fill GND island bridging used by gen_pcb.py
hardware/gen_bom.py -> kicad/fab/shotpuck-bom.csv
hardware/gen_panel.py -> kicad/panel/shotpuck-panel.kicad_pcb (1x2 KiKit panel for JLCPCB)
hardware/gen_jlc.py -> kicad/fab/jlc/ (JLCPCB assembly BOM + CPL with LCSC part numbers, rotated/shifted to JLC's footprints)
hardware/bmd340.py u-blox BMD-340 footprint, 3D model placement and schematic symbol (from its data sheet)
hardware/hotplug_sim.py USB-C hot-plug simulation of the charge input, 324-case sweep (`--rev-0a`: R9 fed from VIN)
hardware/kicad/ KiCad project, ShotPuck.pretty/.kicad_sym/.3dshapes, schematic PDF, fab/ (gerbers, drill, pos, BOM)
mechanical/puck.py CadQuery model + mass/balance -> out/ (STEP, STL, mass_report.txt);
geometry.py, puck_parts.py, puck_report.py hold its constants, parts and output| # | Decision | Why | Alternative |
|---|---|---|---|
| D1 | Cell beside the module, no trim weight | Module at the upper right, bolt in the middle, cell in a notch at the bottom. The centre of mass is 0.5 mm off axis (≈ 0.01 mm on a 2 kg bow); Richard dropped the optional brass pin when the PCB went up on standoffs | Two LIR1254 side by side (studied: they cut the board in two); a brass trim pin |
| D2 | Flat 6061 plate (2.0 mm) + polycarbonate cap, bolted on through a steel sleeve | Richard: the v0.2 stud could not be fitted to the bow (it needs a bolt from above), and a flat plate is cheaper (laser or waterjet, no turning). The sleeve carries the bolt's clamp load to the plate; on the prototype the PC cap top sits between the bolt head and the sleeve (D21) | Turned 7075 base with an integral stud (v0.2) |
| D3 | nRF52840 in high-voltage mode (cell → VDDH, REG0 = 3.0 V) | No regulator, no battery divider (internal VDDH/5), fewer leaks | External LDO |
| D4 | MCP73831 + firmware temperature gate (nRF die temperature, <1 °C / >44 °C) | MCP73831 programs down to 15 mA; the TS-pin chargers found start at 100 mA. Default is charging allowed if the MCU is dead, so a flat cell always recovers. | Charger with an NTC input and a thermistor at the cell |
| D5 | 32 kHz from internal RC, REG0/REG1 in LDO mode | The BMD-340 has no 32.768 kHz crystal; LDO is the tested default | Enable DC/DC on REG0/REG1 (the BMD-340 has the inductors; about half the radio current) |
| D6 | Plain LIR1254 (no tabs) on contacts: a + spring against the can side and a − strap over the top cap, soldered to two SMD pads left of the notch; the cap's foam pad clamps the cell and the strap | Richard's choice: no tab variant to source, no soldering on the cell, swappable | Tabbed LIR1254 soldered to pads; 601015 pouch (closed-ring board, ~9.9 mm) |
| D7 | Pairing required; new pairings only within 60 s of attaching the charger (LE Secure Connections Just Works, up to 4 phones, FORGET_BONDS to reset) | Several pucks and shooters at one club: other apps must not read, reconfigure or reset your puck. The charger gesture proves physical possession. | Open access (v1), or a PIN shown by LED blinks |
| D8 | Detector thresholds are defaults, tunable over BLE; every candidate is reported | Real release-shock data is unknown until you shoot | – |
| D9 | IMU rotated 270°, reference designators on F.Fab only | Routability; board too dense for silkscreen text | – |
| D10 | LSM6DSV32X IMU (LSM6DSV32XTR, C22461202, since 2026-10-01; v0.2 used the LSM6DSO32, which replaced the LIS2DE12 accelerometer). Same LGA-14 pinout and land pattern as the LSM6DSO32, so the board is unchanged; JLC's footprint lands within 0.013 mm of ours at 0°. Pinout, pin states and register values checked against datasheet DS13511 Rev 2 and ST's lsm6dsv32x_reg.h. It has no separate I3C disable, so the I²C anti-spike filter is forced on at init (IF_CFG.ASF_CTRL), as the datasheet describes for I²C-only use. It has no 416 Hz rate: ACTIVE runs at 480 Hz | Gyroscope for bow rotation; ±32 g clips the release shock less; 2.75× lower accelerometer noise than the LSM6DSO32 at ±32 g (80 against 220 µg/√Hz) and lower gyroscope noise (2.8 against 3.8 mdps/√Hz); ±4000 dps available; 5,864 in JLC stock against 177 | LSM6DSO32XTR (C3663738): 416 Hz, twice the FIFO (3 KB uncompressed), 0.1 mA less while active |
| D11 | Raw 6-axis capture per accepted shot (−1.0 s to +0.5 s, 720 samples, 8.6 KB), analysed in the app | Which bow-movement metrics matter is unknown until real shots are recorded | On-device metrics (cant, steadiness, post-release rotation) in the EVENT |
| D12 | Identity from the chip's factory ID: name ShotPuck-XXXX, DIS serial number = device_id | Tell pucks apart at a club; one stable ID across phones for PowerSync | App-assigned IDs |
| D13 | Accepted shots in a 32 KB flash ring (~900 shots), rejected candidates in RAM; app-driven REPLAY, sent paced in the background | Shots survive dropouts and resets without per-phone sync state on the puck | Device push with ACK (rejected: shared state, first phone drains the backlog); captures in flash too |
| D14 | u-blox BMD-340-A-R (nRF52840) instead of the Raytac MDBT50Q-1MV2: 15.0 × 10.2 × 1.9 mm LGA-68, PCB antenna, VCCH input for high-voltage mode, FCC/CE/Bluetooth certified. Footprint ShotPuck:u-blox_BMD-340 from data sheet UBX-19033353 (Figure 12), checked pad for pad against two built open-source footprints | Richard: replace parts JLCPCB does not stock. On 2026-09-29 JLCPCB had 0 MDBT50Q-1MV2 and 227–393 BMD-340 (C5456944, $8.73 vs $18.93). nRF52840 kept for the two OTA slots (2 × 460 KB). Only type BMD-340-A-R-10 is usable: -00 (nRF52840 rev 1) has a non-functional high-voltage mode, so confirm the type with JLCPCB before ordering | MDBT50Q-1MV2 via global sourcing or consignment; u-blox NINA-B306 ($20, 59 in stock) |
| D16 | Cell protection (PCM): TI BQ29700 + Diodes DMN2004DWK in the cell's negative lead (OVP 4.275 V, UVP 2.80 V, ±0.1 A over-current, short-circuit) | LIR cells have no protection of their own; kept from the CP1654 design (BQ29700 was on Varta's list). Costs 4 µA standby | – |
| D17 | 1.6 mm free space above the cell (7.0 mm from the Kapton to the ceiling) | No swell spec for LIR cells. It was 1.2 mm (set on the magnetic board so its connector was flush with the cap top, D25) until the PCB went to 1.2 mm (D30): the ceiling rose 0.4 mm with the board, so the free space is now above Varta's 1.5 mm. The foam pad fills it | 1.2 mm with 2.6 mm standoffs (non-stock) |
| D19 | Board Ø36 mm; 4× M2×8 cheese head (Torx) screws from above, all at r = 16.5 mm: H1 100.6°, H2 164.5°, H3 305°, H4 226°, through the cap, PCB and standoffs into the tapped plate | Puck Ø40 mm is fixed by the Avalon weight; 36 leaves 0.5 mm fit clearance. The screws sit clear of the module, the cell notch and the port. H1 and H2 sit either side of the USB-C port, far enough apart that the ground pour reaches J1's wing tabs; H4 holds the left arm (D29). The 1.3 mm head lets an M2×8 end 0.1 mm inside the plate (a socket head would need the non-standard M2×7). Since 2026-10-12 the screws are M2×5 into brass male-female standoffs screwed into the plate; the cap keeps the M2×8 counterbore | – |
| D20 | Cell in a notch in the PCB, open to the rim (Ø13.0 mm round end), on the Kapton over the plate | Saves the 0.8 mm board in height. Richard preferred the notch to a closed hole | Closed hole (holds the cell all round, leaves a thin strip at the rim) |
| D18 | Waterproof (IPX8) side-entry USB-C, SHOU HAN TYPE-C 6PFS 2JCB1.6-H6.7 IPX8 (6-pin, power only, LCSC C3020041, JLC-assembled) at 132.58° on the left rim, recessed in a notch in the board edge, plug axis radial through the cap wall; R10/R11 5.1k pull CC1/CC2 down | Richard (2026-09-30). Any USB-C charger and cable fits, JLC places the part (the magnetic one was hand-soldered), and its own silicone ring seals it in the cap wall. The CC pull-downs make USB-C chargers switch on 5 V | Samzo PR5L4015 magnetic receptacle flush with the cap top (the magnetic board, last at commit 01f2e00) |
| D15 | OTA = MCUboot swap-using-move + MCUmgr SMP over BLE, ECDSA-P256 signed, encrypted link (paired phones) only. A new image runs on trial and confirms itself once a paired phone has connected over an encrypted link and it has run 10 s (so an image that runs but cannot talk BLE rolls back); a 10 s hardware watchdog turns a hang into a reset, and MCUboot then rolls back | Standard Nordic/Zephyr path; the Flutter app can use Nordic's mcumgr_flutter | Firmware-loader mode (single slot); no rollback |
| D21 | One loose steel tube from the plate through the PCB to the underside of the cap top, located by a lip under the cap (Richard, prototype) carries the bolt load from the cap top to the plate; the PCB hole (Ø10.4: 0.2 mm clearance covers JLCPCB's ±0.2 mm outline tolerance) is merged into the cell notch | Richard: the tube must not get lost while the puck is off the bow. Bonded into the cap and standing 0.1 mm proud, it was held by 1.2 mm of glue that the stack tolerance between cap and plate (±0.15–0.3 mm) and the bolt's squeeze would break at the first bolt-up, and then it could slide out through the top. Trapped between the plate and the cap it cannot fall out and needs no glue. Known risk, tested on the prototype: the bolt clamps the 1.33 mm PC cap top onto the tube end. At 3 N·m (~2 kN) that is 80–110 MPa on the tube end, at PC's compressive yield, so the cap top may creep and the bolt lose preload (VALIDATION §2). Everything right of the merged hole is copper-free (D22), so no signal has to cross it. No stock insulating tube fits (glass-epoxy 10 × 8 mm grips a 5/16 bolt, plastics creep), so it is steel, with Kapton tape all round it because it can turn | Tube bonded into the cap, 0.1 mm proud (glue breaks, tube can fall out); turned sleeve with a collar in a recess under the cap top (steel-only clamp path, custom part); tube bonded into the plate; sleeve on the PCB with a spacer below (PCB in the clamp path) |
| D22 | On-board PCB antenna (BMD-340), module at the upper right with its antenna end pointing 45° below +x; the antenna zone (from 4.4 mm inside the module's end) and everything right of the tube are copper-free (board_shape.rf_keepout) | Richard's choice over moving the antenna out into the cap. The module slid 45° around the tube so the USB-C port fits on the left | Module with a u.FL connector and an antenna in the cap |
| D23 | SWD on 4 bottom test pads (VDD, SWDIO, SWDCLK, GND, 2.54 mm pitch, under the module) for a pogo-pin jig | Frees top-side space for 2-layer routing; the SWD escape vias are pre-placed | Tag-Connect TC2030-CTX-NL (v0.2) |
| D24 | I2C on internal pull-ups only; SCL = P0.07, SDA = P0.05 (BMD-340 pads 23 and 21, facing the IMU) | The 4.7k DNP pads (R5/R6) were never fitted and cost routing space; the swap stops the IMU lines crossing on 2 layers | Keep R5/R6 as DNP pads for a stronger pull-up |
| D25 | PCB on 3 mm standoffs; puck 10.43 mm | Set on the magnetic board so its connector sat flush with the cap top, and kept. The cap top went from 1.2 to 1.33 mm (2026-09-30, Richard) so 0.80 mm of it is left over the USB-C body, JLC3DP's minimum SLA wall for a ~10 mm feature. The cell sets the ceiling, so the raised board costs no height, and it keeps the antenna 3 mm further from the plate | Board on the plate |
| D26 | Button head bolt (5/16-24, dome head Ø16.7 × 4.4 mm, ISO 7380 style), no washer | Richard: lower head than a socket head (7.9 mm). The head bears directly on the PC cap top (163 mm², ~12 MPa at 2 kN) and clamps it onto the sleeve (D21) | Socket head cap screw |
| D27 | Charge-input protection: SMF5.0CA bidirectional TVS (D3) at the connector + R9 1k / C9 100n in front of the nRF VBUS pin | The port is exposed (ESD) and plugging in makes and breaks contact (hot-plug spikes); the TVS is bidirectional and sits before D1. The SMF5.0CA starts clamping at 6.4–7.0 V (200 W) against the MCP73831's 7 V absolute maximum. No 5 V TVS can hold the nRF52840 VBUS pin under its 5.8 V absolute maximum; it is used only to detect the charger (~24 µA), so the RC limits current into it and smooths spikes. R9 is fed from VIN_RAW, before D1 (rev 0B, since 2026-10-12; rev 0A boards feed it from VIN): fed from VIN, D1 and C1 hold a plug-in overshoot for milliseconds and the RC passes it on (hot-plug simulation: VBUS_SNS up to 6.36 V, against ≤ 5.47 V fed from VIN_RAW). It sat on VIN because the magnetic board's hand-wired lead could be reversed; a USB-C plug cannot reverse VBUS | PESD5V0S1BB (a signal-line ESD diode, clamps only from 5.5–9.5 V); unidirectional flat-clamp TVS after D1 (TI TVS0500); an overvoltage switch (needed only if 9–12 V adapters are a risk) |
| D28 | Routing aids for 2 layers (BMD-340): module pins chosen so its second pad column escapes through the outer column's gaps towards the IMU; links and vias locked before Freerouting (PRE_LINKS, PAD_BRIDGES, PRE_VIAS rotated with the module, PRE_ROUTED in gen_pcb.py) | The LGA module's inner pads need planned escapes. Everything right of the tube is copper-free (D22), so no VIN loop or passage is needed (VIN_ESCAPE = None). The board routes with 0 DRC / 0 unconnected; J1's notch and a few fixes are hand edits (Build & flash) | 4 layers |
| D29 | Shot shock: 4th screw H4 on the left arm; BMD-340 and C2 corner-staked (Richard) | The slot for the cell and the tube makes the board a horseshoe. Its left arm (PCM, both cell contact pads) had no screw below H2. The model below is of the magnetic board (H1 then at (9.2, 1.2)) and was not re-run for the USB-C layout, whose board is also clamped through rubber O-rings. A plate model of the board (Kirchhoff plate FE, 100 g along the puck axis, component masses, module 1–5× stiffer than the board) gives, at 0.8 mm: first mode 1.1–1.2 kHz → 1.7–2.0 kHz; worst strain 320–340 → 160–180 µε (bare board next to a screw; ≤ 70 µε at any part); the − cell pad moved 13–15 µm against the cell per 100 g, now ~0. At 1.2 mm with 4 screws (the board now, D30): 2.7–3.2 kHz, ~100 µε | Foam pad under the board (damping, no layout change); thicker PCB alone (1.2 mm, 3 screws: 1.7–1.8 kHz) |
| D30 | PCB 1.2 mm (was 0.8), stock 3 mm standoffs, puck 0.4 mm taller (10.43 mm) | Richard (2026-09-30): a stiffer board under shot shock (D29: first mode 1.7–2.0 → 2.7–3.2 kHz, strain about halved). Everything on the board rose 0.4 mm, so the cell ceiling (cell.swell_h 6.6 → 7.0) and the cap rose with it and every cap, lip and port clearance is unchanged; the tube is 7.1 mm | 0.8 mm board (puck 10.03 mm); 1.2 mm on 2.6 mm standoffs (non-stock) to keep 10.03 mm |
layout.json, and re-run puck.py for the mass report.%USERPROFILE%\.shotpuck\ota-signing-key.pem (password manager or offline copy). Pucks accept only images signed with it: if it is lost, updates need a cable (SWD); if it leaks, anyone who can pair could install their firmware. It is never committed (*.pem is git-ignored).seal.ledge_od/squeeze in layout.json.firmware/sim/results.txt, seed 2026)| Set | Shots | Recall | Precision | Notes |
|---|---|---|---|---|
| Nominal sessions | 437 | 99.1 % | 99.8 % | walking knocks, set-downs, stand knocks, nock taps, drops, let-downs (1 FP: stand knock) |
| Hard cases | 479 | 99.6 % | 99.4 % | + taps while aiming, hard grabs off the stand (2 grabs, 1 stand knock) |
| Weak bow (info) | 253 | 80.2 % | 99.5 % | 4–12 g shock, 5–30° rotation: thresholds must be tuned on real shots |
The detector needs three things together: a high-frequency shock (6 g sample-to-sample), ≥ 0.5 s of stillness before it (aiming), and ≥ 250 mg of low-frequency bow motion 0.1–0.6 s after it (bow jump into the sling). See firmware/src/shot_detect.h. It uses the accelerometer only; the gyroscope feeds the capture.
The idle draw is roughly 14 µA (LSM6DSV32X accelerometer in low-power mode 1 at 15 Hz, about 7 µA by interpolating the datasheet's 4.0 µA at 1.875 Hz and 17 µA at 60 Hz; BQ29700 protection 4 µA; nRF System ON + RC). While active it is roughly 0.8–0.9 mA: the accelerometer and gyroscope together are about 0.65 mA, plus 480 Hz FIFO reads and the BLE link. At 2 h of training per day that is ≈ 2.0 mAh/day, so roughly 3–4.5 weeks per charge from a 45–65 mAh LIR1254 (a little less, as the 3.3 V cut-off leaves some capacity unused). A full charge at 21 mA takes about 2.5–3.5 h. The low-battery cut-off (3.3 V) puts the puck into System OFF until the charger is attached.
Native Windows toolchain (what v0.2 was built and verified with):
| Tool | Where | Used for |
|---|---|---|
| KiCad 10.0 | C:\Program Files\KiCad\10.0 (its python.exe has pcbnew) | schematic, PCB, ERC, DRC, fab exports |
| Freerouting 2.1.0 + Java 21 | %USERPROFILE%\tools\freerouting-2.1.0.jar, %USERPROFILE%\tools\jre21 (or set FREEROUTING_JAR, JAVA) | PCB routing |
| Zephyr v4.1.0 workspace + SDK 0.17.0 | C:\zp (west, modules cmsis, cmsis_6, hal_nordic, segger, hal_st, mbedtls for pairing crypto, mcuboot + zcbor for OTA) | firmware |
| CMake 3.31 + Ninja | %USERPROFILE%\tools\cmake3, %USERPROFILE%\tools\ninja (Zephyr 4.1 fails with CMake 4.x) | firmware |
| w64devkit gcc | %USERPROFILE%\tools\w64devkit (set CC to its gcc.exe) | simulation, capture tests |
Firmware (Zephyr 4.1 sysbuild: MCUboot + signed app in one build):
set ZEPHYR_BASE=C:\zp\zephyr
set ZEPHYR_SDK_INSTALL_DIR=C:\zp\zephyr-sdk-0.17.0
set PATH=%USERPROFILE%\tools\cmake3\bin;%USERPROFILE%\tools\ninja;C:\zp\.venv\Scripts;%PATH%
cd C:\zp
west build --sysbuild -p always -b shotpuck/nrf52840 <repo>/firmware -d build\sb -- ^
-DBOARD_ROOT=<repo>/firmware ^
-DSB_CONFIG_BOOT_SIGNATURE_KEY_FILE=\"C:/Users/<you>/.shotpuck/ota-signing-key.pem\"
python zephyr\scripts\build\mergehex.py -o shotpuck_full.hex build\sb\mcuboot\zephyr\zephyr.hex build\sb\firmware\zephyr\zephyr.signed.hexshotpuck_full.hex with J-Link/nrfjprog through the 4 SWD test pads on the bottom (VDD, SWDIO, SWDCLK, GND at 2.54 mm; pogo-pin jig or pogo probes), before the board goes onto the plate.build\sb\firmware\zephyr\zephyr.signed.bin (copied to firmware/shotpuck_update.bin), sent from a paired phone (your app with mcumgr_flutter, or Nordic's nRF Connect Device Manager). Bump firmware/VERSION for every release.-DEXTRA_CONF_FILE=debug.conf. It fits the slot and can be installed over the air too.python C:\zp\bootloader\mcuboot\scripts\imgtool.py keygen -k ota-signing-key.pem -t ecdsa-p256. Pucks flashed with one key never accept images signed with another.Simulation + unit tests: set CC=%USERPROFILE%\tools\w64devkit\bin\gcc.exe then python firmware/sim/simulate.py --sessions 36 --stress --seed 2026 (needs numpy, scipy). Must print CAPTURE TESTS: PASS, EVLOG TESTS: PASS, CHG LED TESTS: PASS, RECOVERY TESTS: PASS and RESULT: PASS.
Hardware (run with KiCad 10's Python, from hardware/):
"C:\Program Files\KiCad\10.0\bin\python.exe" gen_sch.py
"C:\Program Files\KiCad\10.0\bin\python.exe" check_netlist.py # must print PASS
kicad-cli sch erc --severity-all -o kicad\erc.rpt kicad\shotpuck.kicad_sch
"C:\Program Files\KiCad\10.0\bin\python.exe" gen_pcb.py --no-route # placement only, then DRC
"C:\Program Files\KiCad\10.0\bin\python.exe" global_route.py # routability estimate: overflow + hotspots
"C:\Program Files\KiCad\10.0\bin\python.exe" gen_pcb.py --quick # one-attempt trial route (~5 min)
"C:\Program Files\KiCad\10.0\bin\python.exe" gen_pcb.py # place, route, bridge GND islands, DRC
"C:\Program Files\KiCad\10.0\bin\python.exe" gen_bom.py
kicad-cli pcb export gerbers -o kicad\fab\gerbers -l F.Cu,B.Cu,F.Paste,B.Paste,F.Silkscreen,B.Silkscreen,F.Mask,B.Mask,Edge.Cuts --subtract-soldermask kicad\shotpuck.kicad_pcb
kicad-cli pcb export drill -o kicad\fab\gerbers --excellon-separate-th --generate-map --map-format gerberx2 kicad\shotpuck.kicad_pcb
kicad-cli pcb export pos --format csv --units mm --side both -o kicad\fab\shotpuck-pos.csv kicad\shotpuck.kicad_pcbZip kicad\fab\gerbers\ into kicad\fab\shotpuck-gerbers.zip. The single board is for reference: JLCPCB gets the panel (below). The pos file is in KiCad page coordinates, with the bolt axis at (132.064, 91.396) and Y negated. Don't set a drill/place origin to change that: it breaks KiKit's panel frame (HANDOVER §7).
Hot-plug check (plain Python with numpy and scipy, from hardware/, about 1 min): python hotplug_sim.py must report VBUS_SNS > 5.8 V in 0 and VIN > 7.0 V in 0; python hotplug_sim.py --rev-0a models the rev 0A boards (9 cases over 5.8 V, README D27).
Freerouting routes the signals only (GND comes from the pours, fan-out and stitching vias) and is not deterministic. gen_pcb.py re-routes up to 4 times until nothing is unconnected; if it still does not end with 0 DRC violations and 0 unconnected pads, run it again. ERC: 0 errors; the 2 warnings are the intentional straps of LSM6DSV32X SA0 and SDx to GND.
Hand edits: gen_pcb.py does not draw J1's board-edge notch (10.28 × 5.22 mm with two Ø0.70 NPTH leg holes), and the GND via at (−0.41, 16.09), the JP2 reset pads and the silkscreen text were added by hand in KiCad; U2, C3, C6 and C7 were moved inward by hand, away from the top panel tab. Re-running gen_pcb.py overwrites the board without them, so back it up and redo them (HANDOVER §6).
Mechanical: C:\zp\.cq\Scripts\python.exe mechanical/puck.py (CadQuery 2.8 in a Python 3.12 venv; CadQuery has no Python 3.14 wheels). It writes the mass and balance report; there is no trim weight. C:\zp\.cq\Scripts\python.exe mechanical/plate_drawing.py writes the plate drawing (out/plate_drawing.pdf) from the same layout.json, and the cheaper prototype variant in 5052 sheet (out/plate_drawing_5052.pdf + out/plate_5052.step, no chamfer).
3D viewer: open mechanical/viewer/index.html in a browser (it needs internet for three.js from jsDelivr; everything else, the PCB included, is inside the file). It is a snapshot: the cap, plate and sleeve meshes and the layout values were embedded on 2026-10-12 and the PCB is the rev 0A board (KiCad's export, with its green mask recoloured to the ordered black, the silkscreen opaque white and the FR4 core dark and opaque), so edit it (or rebuild it) when those change.
Assembly animation (Blender 3.1+): "C:\Program Files\Blender Foundation\Blender 3.1\blender.exe" -b -P mechanical/blender/render_assembly.py (after puck.py; it exports the populated board from KiCad as GLB itself). It renders an exploded view that assembles into the puck (Cycles on the GPU, 1080p, 13 s) to mechanical/out/frames/ and encodes mechanical/out/shotpuck_assembly.mp4; the scene is saved as shotpuck_assembly.blend. Add -- --preview for 5 half-size stills, -- --encode to re-encode existing frames. Existing frames are skipped, so an interrupted render resumes; when layout.json, the STLs, the board, its 3D models or the Blender scripts have changed since the frames were made (frames/scene.sha256), they are deleted first. The cell and its contacts, standoffs, M2 screws, button head bolt, the seal and clamp O-rings, Kapton and foam are modelled from layout.json; the board parts, including the USB-C port, use KiCad's 3D models.
Panel + JLCPCB assembly files (after gen_pcb.py, with KiCad 10's Python and KiKit: python.exe -m pip install --user kikit):
"C:\Program Files\KiCad\10.0\bin\python.exe" gen_panel.py # 1x2 in a frame, 4 tabs per board, mouse bites, fiducials, tooling holes
"C:\Program Files\KiCad\10.0\bin\python.exe" gen_jlc.py # kicad/fab/jlc/shotpuck-panel-bom.csv + -cpl.csv
kicad-cli pcb export gerbers -o kicad\fab\panel\gerbers -l F.Cu,B.Cu,F.Paste,B.Paste,F.Silkscreen,B.Silkscreen,F.Mask,B.Mask,Edge.Cuts --subtract-soldermask kicad\panel\shotpuck-panel.kicad_pcb
kicad-cli pcb export drill -o kicad\fab\panel\gerbers --excellon-separate-th --generate-map --map-format gerberx2 kicad\panel\shotpuck-panel.kicad_pcbZip kicad\fab\panel\gerbers\ into shotpuck-panel-gerbers.zip. The drill is split into -PTH.drl (vias) and -NPTH.drl (mouse bites, J1 legs, tooling, screw holes), as JLCPCB asks. Each comes with a -drl_map.gbr drill map, which JLC's KiCad guide asks for. Do not refill the zones on export: the panel's saved fill is the one DRC checked. gen_jlc.py rotates and shifts U1 (BMD-340, +2.0 mm to its pad-array centre), U3, Q1, Q2 (+270°), D4 (+180°, JLC's pad 1 is its cathode on the other side), D3 (+180°, JLC numbers its pads the other way; the TVS is bidirectional, so this only fixes the preview) and J1 (0.15 mm) so JLC's own footprints land on ours; this was checked pad by pad against the EasyEDA footprints of the LCSC parts.
The last order package is order/shotpuck-order-2026-10-26/ (rev 0B, PCB + assembly): upload its files and follow its ORDER.md for the JLC form settings, the note to add to the order and the checks. The cap and plate files and the risks to check on the first boards are in order/shotpuck-order-2026-09-30/ (rev 0A, whose PCB order JLC cancelled).
kicad/fab/panel/shotpuck-panel-gerbers.zip as a 1×2 panel ("panel by customer", 2 boards per panel, 91.1 × 70.1 mm; the frame's top and bottom rails are widened so the panel is 70 mm tall, JLC's minimum for assembly), order 5 panels = 10 boards, 1.2 mm, ENIG. For assembly (top side, PCBA qty 2 panels), upload kicad/fab/jlc/shotpuck-panel-bom.csv and -cpl.csv (rotations and centroids already corrected for JLC's footprints; they cover both copies, since JLC assembles only whole panels, so 4 boards get assembled) and confirm the placement preview, J1 included. Not assembled by JLCPCB: the cell BT1 and its contacts, JP1 (bridged solder jumper, copper only), JP2 (reset pads, copper only), J2 (SWD test pads). The module needs JLCPCB's X-ray inspection. Cut the tabs with flush cutters instead of snapping them (parts sit a few mm from the tabs, and bending there can crack joints or the 0603 capacitor C2), then sand the nubs flush. The BQ29700 may start with its discharge FET off when a cell is first fitted (TI SLUSBU9I §8.4.1): attach the charger once to wake it.bosses.positions in layout.json). Send mechanical/out/plate.step with plate_drawing.pdf: the STEP shows the M2 holes as plain Ø1.6 holes, and the drawing calls out the threads. Anodising is optional (mask the threads). JLCCNC makes 6061 only by CNC machining; for prototypes the cheaper route is their sheet-metal service in 5052 (the only aluminium it stocks): out/plate_5052.step + plate_drawing_5052.pdf, laser cut, same holes, no chamfer.mechanical/out/cap.step). It has the M2 counterbores, bosses that stop 0.65 mm above the PCB, the Ø8.4 bolt hole, the tube lip (a ring under the cap top: Ø10.2 inside, 0.8 mm wall, 0.6 mm deep, 0.3 mm above the module), a stepped wall with a Ø37.8 ledge for the seal O-ring (its inner band 0.8 mm, rising inside with a chamfer, with round gaps at the 4 standoffs and the cell), and the USB-C port: an obround hole in the wall where the connector's silicone ring seals (0.15 mm squeeze per side), a pocket over its body (0.80 mm of cap top left) and a flat at the receptacle face so any USB-C plug seats fully. No liquid threadlocker anywhere near PC (it causes stress cracking): use nylon-patch screws.See docs/VALIDATION.md. The blockers:
| Qty | Value | Footprint | References |
|---|---|---|---|
| 143 | NPTH | NPTH | KiKit_MB_10_2, KiKit_MB_10_3, KiKit_MB_10_4, KiKit_MB_10_5, KiKit_MB_10_6, KiKit_MB_10_7, KiKit_MB_10_10, KiKit_MB_10_11, KiKit_MB_10_12, KiKit_MB_10_13, KiKit_MB_10_14, KiKit_MB_10_15, KiKit_MB_10_16, KiKit_MB_10_17, KiKit_MB_10_18, KiKit_MB_10_19 +127 |
| 8 | 100n | Capacitor_SMD:C_0402_1005Metric | C6_0, C6_1, C7_0, C7_1, C8_0, C8_1, C9_0, C9_1 |
| 8 | M2 | ShotPuck:MountingHole_2.4mm_NPTH | H1_0, H1_1, H2_0, H2_1, H3_0, H3_1, H4_0, H4_1 |
| 6 | Fiducial | Fiducial | KiKit_FID_B_1, KiKit_FID_B_2, KiKit_FID_B_3, KiKit_FID_T_1, KiKit_FID_T_2, KiKit_FID_T_3 |
| 4 | 1k | Resistor_SMD:R_0402_1005Metric | R4_0, R4_1, R9_0, R9_1 |
| 4 | 4.7u 6.3V | Capacitor_SMD:C_0402_1005Metric | C3_0, C3_1, C4_0, C4_1 |
| 4 | 5.1k 1% | Resistor_SMD:R_0402_1005Metric | R10_0, R10_1, R11_0, R11_1 |
| 4 | BAT54J | Diode_SMD:D_SOD-323F | D1_0, D1_1, D2_0, D2_1 |
| 2 | 100k | Resistor_SMD:R_0402_1005Metric | R3_0, R3_1 |
| 2 | 10u 10V | Capacitor_SMD:C_0603_1608Metric | C2_0, C2_1 |
| 2 | 1M | Resistor_SMD:R_0402_1005Metric | R2_0, R2_1 |
| 2 | 2.2k | Resistor_SMD:R_0402_1005Metric | R8_0, R8_1 |
| 2 | 330R | Resistor_SMD:R_0402_1005Metric | R7_0, R7_1 |
| 2 | 4.7u 10V | Capacitor_SMD:C_0603_1608Metric | C1_0, C1_1 |
| 2 | 47k 1% | Resistor_SMD:R_0402_1005Metric | R1_0, R1_1 |
| 2 | BMD-340-A-R | ShotPuck:u-blox_BMD-340 | U1_0, U1_1 |
| 2 | BQ29700DSER | Package_SON:WSON-6_1.5x1.5mm_P0.5mm | U4_0, U4_1 |
| 2 | DMN2004DWK | Package_TO_SOT_SMD:SOT-363_SC-70-6 | Q2_0, Q2_1 |
| 2 | DMN63D8LDW | Package_TO_SOT_SMD:SOT-363_SC-70-6 | Q1_0, Q1_1 |
| 2 | I_MEAS (cut to measure) | Jumper:SolderJumper-2_P1.3mm_Bridged_Pad1.0x1.5mm | JP1_0, JP1_1 |
| 2 | LED yellow-green 0402 | LED_SMD:LED_0402_1005Metric | D4_0, D4_1 |
| 2 | LIR1254 (plain, spring contacts) | ShotPuck:LIR1254_Contacts_Edit | BT1_0, BT1_1 |
| 2 | LSM6DSV32XTR | Package_LGA:LGA-14_3x2.5mm_P0.5mm_LayoutBorder3x4y | U2_0, U2_1 |
| 2 | MCP73831T-2ACI/OT | Package_TO_SOT_SMD:SOT-23-5 | U3_0, U3_1 |
| 2 | RESET pads | ShotPuck:TweezerPads_2x0.8mm_Gap0.4mm | JP2_0, JP2_1 |
| 2 | SMF5.0CA | Diode_SMD:D_SOD-123F | D3_0, D3_1 |
| 2 | SWD pads | ShotPuck:SWD_Pads_1x4_P2.54 | J2_0, J2_1 |
| 2 | TYPE-C 6PFS 2JCB1.6-H6.7 IPX8 | ShotPuck:USB_C_Receptacle_ShouHan_TYPE-C-6PFS-2JCB1.6-H6.7_IPX8 | J1_0, J1_1 |
Rixard86/shot-tracker
A Ø40 × 10.4 mm puck that bolts onto the free face of an Avalon riser weight (the weight's own 5/16-24 bolt, one size longer, goes through its centre), detects each shot with a 6-axis IMU, records the bow's motion…
Rixard86/shot-tracker
A Ø40 × 10.4 mm puck that bolts onto the free face of an Avalon riser weight (the weight's own 5/16-24 bolt, one size longer, goes through its centre), detects each shot with a 6-axis IMU, records the bow's motion…
wildjames/smart_compass
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variegated-coffee/all-purpose-espresso-controller
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skyler84-tildagon-addons/goosepansion
Untitled Goose Game inspired capacitive touch reversible goose honker
It measures 91 × 70 mm and has 2 copper layers, 1.2 mm thick.
221 parts, built around the BMD-340-A-R, MCP73831T-2ACI/OT-HXY, BAT54J and DMN2004DWK. The full list of its parts is on this page, with links to each part's symbol and footprint where PCBKit's library has them.
From the Rixard86/shot-tracker repository on GitHub, at the commit this page was made from: the board is hardware/kicad/panel/shotpuck-panel.kicad_pcb and its schematic hardware/kicad/shotpuck-mini.kicad_sch. PCBKit opens the board in the browser, with nothing to install.
Its repository states no licence, so its author keeps all rights: ask Rixard86 before reusing the design.