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2 layers159.9 × 47.5 mmLVP G0S4, the printed circuit board in 3D

ForgeDrive is an open-source research and development platform for modular, scalable, and industrial-inspired systems.

Size
159.9 × 47.5 mm
Copper layers
2
Thickness
1.6 mm
Parts
69
Nets
76
Pads
251
Tracks, vias
2,114, 315
Pours
169
Routed
Yes
KiCad
KiCad 10.0 (file 20260206)
Created
24 Jul 2026
Updated
18 Sep 2026

Overview

LVP G0S4 is an open-source printed circuit board by Omar-Magdy0, from the Omar-Magdy0/ForgeDriveHW repository on GitHub, published under the MIT licence. It is a 2-layer board of 159.9 × 47.5 mm with 69 parts on 76 nets, routed with 2,114 tracks and 315 vias.

It is built around the SP485EEN-TD, AMS1117-3.3 and SD103AWS, with the AO3400A, SMBJ12A and SMBJ5.0A among its other parts. Its parts include 21 resistors, 17 connectors, 9 capacitors, 8 diodes and 4 ICs.

Main components

7

README

README.md

ForgeDriveHW

Forged by passionate engineers.

ForgeDrive is an open-source research and development platform for modular, scalable, and industrial-inspired systems.

ForgeDrive is an ecosystem of reusable hardware, firmware, tools, and documentation covering the complete development process—from power electronics and embedded software to simulation, validation, and manufacturing.

The project aims to bridge the gap between academic learning, rapid prototyping, and industrial engineering practices.


Vision

ForgeDrive is built around one simple idea:

«Engineering should be understandable, modular, and reusable.»

Every hardware module, software component, and document is designed with long-term maintainability and extensibility in mind.

Whether developing a compact BLDC controller or a complete industrial servo drive, the same design philosophy applies:

  • Modular architectures
  • Well-defined interfaces
  • Thorough documentation
  • Reusable building blocks
  • Continuous improvement through experimentation

##Core Principles

Modularity

Each subsystem has a single responsibility.

Examples include:

  • Power stages
  • Low-voltage distribution
  • Communication modules
  • Power supplies
  • Signal conditioning
  • Encoder interfaces
  • Processing modules

Modules should be independently testable and reusable across projects.


Scalability

ForgeDrive is designed to scale across applications.

The same architecture should support:

  • Laboratory prototypes
  • Educational platforms
  • Robotics
  • CNC systems
  • Industrial automation
  • Research projects

Engineering First

Design decisions are driven by engineering rather than trends.

Topics documented throughout the project include:

  • PCB layout
  • Power electronics
  • Thermal management
  • EMC considerations
  • Signal integrity
  • Embedded software architecture
  • Control algorithms
  • System reliability

Learning by Building

ForgeDrive is intended to be as educational as it is practical.

Whenever possible, documentation explains:

  • Why a decision was made
  • Alternative approaches
  • Trade-offs
  • Advantages and disadvantages
  • Experimental results

The goal is to share engineering knowledge—not only finished hardware.


Project Scope

ForgeDrive currently explores technologies including:

Hardware

  • PMSM Inverters
  • BLDC Controllers
  • Three-phase power stages
  • PFC converters
  • Flyback power supplies
  • Low-voltage power distribution
  • Encoder interfaces
  • Communication modules
  • Protection circuitry
  • High-speed PCB design

Embedded Software

  • STM32 Development
  • Embedded C/C++
  • CMSIS
  • Low-Level Drivers
  • Real-Time Systems
  • Communication Protocols
  • Bootloaders
  • Firmware Architecture

Control

  • Field Oriented Control (FOC)
  • Space Vector Modulation (SVM)
  • Trapezoidal Control
  • Current Control
  • Position Control
  • Speed Control
  • Sensorless Algorithms

Modeling & Simulation

  • MATLAB / Simulink
  • Model-Based Design (MBD)
  • Plant Modeling
  • Controller Design
  • System Validation

Mechanical

  • Enclosures
  • Thermal Design
  • Mounting Systems
  • Mechanical Integration

Documentation

Documentation is considered a first-class component of the project.

Each hardware module includes:

  • Board overview
  • Bring-up guide
  • Revision history
  • Manufacturing notes
  • Known issues
  • Validation results

Shared documentation includes:

  • System architecture
  • Communication protocols
  • Electrical standards
  • Design guidelines
  • Safety considerations
  • Development workflow

Hardware revisions are maintained independently while Git preserves complete design history.


Design Philosophy

ForgeDrive emphasizes:

  • Single Responsibility Principle (SRP)
  • Interface-driven design
  • Reusable modules
  • Hardware abstraction
  • Deterministic behavior
  • Debuggability
  • Maintainability
  • Reliability over unnecessary complexity

Open Source

ForgeDrive is developed in the open.

The repository welcomes:

  • Bug reports
  • Suggestions
  • Design discussions
  • Pull requests
  • Technical reviews

Constructive engineering feedback is always appreciated.


Roadmap

Some long-term goals include:

  • Modular PMSM inverter platform
  • Modular PFC stage
  • Modular power supplies
  • Industrial communication modules
  • FPGA acceleration
  • Complete documentation
  • Hardware validation reports
  • Automated testing infrastructure
  • Educational design guides

Disclaimer

ForgeDrive contains hardware intended for development, experimentation, and learning.

Many projects involve hazardous voltages, high currents, and high-energy systems.

Always follow appropriate electrical safety practices and verify designs before use in real-world applications.


License

This repository is released under the applicable open-source license included in this project.

Please refer to the LICENSE file for details.


Acknowledgements

ForgeDrive is built through curiosity, experimentation, continuous learning, and a passion for engineering.

«Forged by passionate engineers.»

Parts

69
QtyValueFootprintReferences
9220Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolderR1, R2, R3, R4, R5, R6, R20, R22, R23
7Conn_01x02_PinConnector_JST:JST_XH_B2B-XH-A_1x02_P2.50mm_VerticalJ7, J8, J10, J11, J12, J13, J15
420kResistor_SMD:R_1206_3216Metric_Pad1.30x1.75mm_HandSolderR8, R9, R10, R11
4Conn_02x05_Odd_EvenConnector_PinSocket_2.54mm:PinSocket_2x05_P2.54mm_VerticalJ1, J2, J3, J4
4MountingHoleMountingHole:MountingHole_3.2mm_M3_DIN965H1, H2, H3, H4
30.1uCapacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolderC3, C4, C11
310uCapacitor_SMD:C_1206_3216Metric_Pad1.33x1.80mm_HandSolderC1, C2, C6
3120Resistor_SMD:R_1206_3216Metric_Pad1.30x1.75mm_HandSolderR12, R14, R15
31kResistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolderR7, R16, R17
3SD103AWS_C5345966EasyEDA:SOD-323_L1.7-W1.3-LS2.5-RDD7, D8, D9
3SP485EEN-TDEasyEDA:SOIC-8_L4.9-W3.9-P1.27-LS6.0-BLU1, U2, U3
2100uFCapacitor_SMD:CP_Elec_8x6.5C9, C10
2LEDLED_SMD:LED_0603_1608MetricD1, D3
110kResistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolderR19
12kResistor_SMD:R_1206_3216Metric_Pad1.30x1.75mm_HandSolderR13
147uFCapacitor_SMD:CP_Elec_5x5.4C8
1AMS1117-3.3Package_TO_SOT_SMD:SOT-89-3U4
1AO3400APackage_TO_SOT_SMD:SOT-23Q2
1Conn_01x04Connector_JST:JST_XH_B4B-XH-A_1x04_P2.50mm_VerticalJ17
1Conn_01x04Connector_PinSocket_2.54mm:PinSocket_1x04_P2.54mm_VerticalJ16
1Conn_01x04_PinConnector_PinHeader_1.27mm:PinHeader_1x04_P1.27mm_Vertical_SMD_Pin1RightJ5
1Conn_02x05_Odd_EvenConnector_IDC:IDC-Header_2x05_P2.54mm_VerticalJ14
1Conn_02x20_Odd_EvenConnector_PinSocket_2.54mm:PinSocket_2x20_P2.54mm_VerticalJ6
1LOGOLOGOG***
1MountingHole_PadMountingHole:MountingHole_3.2mm_M3_Pad_ViaH5
1NetTie_2LibLocal:ground_tieNT1
1SMBJ12A_C151251EasyEDA:SMB_L4.6-W3.6-LS5.3-RDD5
1SMBJ5.0A_C83333EasyEDA:SMB_L4.6-W3.6-LS5.3-RDD4
1SS34_C8678EasyEDA:SMA_L4.3-W2.6-LS5.2-RDD2
1Screw_Terminal_01x09Connector_JST:JST_XH_B9B-XH-A_1x09_P2.50mm_VerticalJ9
1SolderJumper_2_OpenJumper:SolderJumper-2_P1.3mm_Open_TrianglePad1.0x1.5mmJP2
1SolderJumper_3_Bridged12Jumper:SolderJumper-3_P1.3mm_Bridged12_RoundedPad1.0x1.5mmJP1

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Questions

How big is the LVP G0S4 PCB?

It measures 159.9 × 47.5 mm and has 2 copper layers, 1.6 mm thick.

What parts does the LVP G0S4 use?

69 parts, built around the SP485EEN-TD, AMS1117-3.3, SD103AWS and AO3400A. The full list of its parts is on this page, with links to each part's symbol and footprint where PCBKit's library has them.

Where can I download the LVP G0S4 KiCad files?

From the Omar-Magdy0/ForgeDriveHW repository on GitHub, at the commit this page was made from: the board is ForgeX/LVP_G0S4/revA/LVP_G0S4.kicad_pcb and its schematic ForgeX/BlackDev_G0Basic/BlackDev_G0Basic.kicad_sch. PCBKit opens the board in the browser, with nothing to install.

Can I use the LVP G0S4 design in my own project?

Its repository publishes it under the MIT licence: you may reuse it on that licence's terms (keep the author's notice, and for a copyleft licence share your changes alike).