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2 layers65 × 56 mmLogHeat, the printed circuit board in 3D

This project is a temperature logging system developed during the 2024 Biomedical Engineering Master Class at Grenoble INP.

Size
65 × 56 mm
Copper layers
2
Thickness
1.6 mm
Parts
33
Nets
49
Pads
138
Tracks, vias
250, 11
Pours
1
Routed
Yes
KiCad
KiCad 8.0 (file 20240108)
Created
2 Oct 2024
Updated
2 Apr 2025

Overview

LogHeat is an open-source printed circuit board by IfTrueEqualsEqualsTrue, from the IfTrueEqualsEqualsTrue/LogHeat repository on GitHub. It is a 2-layer board of 65 × 56 mm with 33 parts on 49 nets, routed with 250 tracks and 11 vias.

It is built around the MCP3004-I/P and AD8603AUJZ-R2. Its parts include 9 connectors, 7 resistors, 6 capacitors, 4 ICs and 3 diodes.

Main components

2

README

README.md

Temperature Logger

This project is a temperature logging system developed during the 2024 Biomedical Engineering Master Class at Grenoble INP. The system is designed to record temperature data in real-time, offering students practical experience in data acquisition, processing, and visualization, relevant to biomedical applications.

Features

  • Real-time temperature logging: Captures temperature data from a connected sensor.
  • Data storage: Saves logged data for later analysis.
  • Data visualization: Provides a graphical interface for displaying temperature trends over time.
  • Simple UI: User-friendly interface for ease of use by non-technical users.

This app does not include the possibility for the MCP inputs but it can be easily tweaked in the file SpiInteface.py

Hardware Requirements

  • Thermocouple sensor
  • MAX31855 thermocouple conditionning circuit

Running the Application

The main.py file is the entry point for the application. The required packages can be installed in a new virtual environment using:

bash
pip install -r requirements.txt

To run the application, execute the main file using the following command:

bash
python src/main.py

Compiling

To use the app on as a standalone, it can be compiled using pyinstaller.

Use the following command to compile the app:

bash
pyinstaller main.spec

This will create a dist folder containing the compiled app. Compile on the os the app should be used on, but keep in mind spidev works only on the raspberry pi.

Contributors

Grenoble INP Biomedical Engineering Students:

  • Guillaume Boulet
  • Paul Ménard
  • Lucie Martinal
  • Guillermo Lazarin

Parts

33
QtyValueFootprintReferences
7RResistor_THT:R_Axial_DIN0204_L3.6mm_D1.6mm_P7.62mm_HorizontalR1, R2, R3, R4, R5, R6, R7
6CCapacitor_THT:C_Disc_D3.0mm_W1.6mm_P2.50mmC1, C2, C3, C5, C6, C7
4, , ,
3AD8603AUJZ-R2Library:AD3603U1, U2, U3
3DResistor_THT:R_Axial_DIN0204_L3.6mm_D1.6mm_P7.62mm_HorizontalD1, D2, D3
2protec_conditConnector_PinHeader_2.54mm:PinHeader_1x04_P2.54mm_VerticalJ5, J6
2protec_mcpConnector_PinHeader_2.54mm:PinHeader_1x04_P2.54mm_VerticalJ7, J8
1Analog_inputsTerminalBlock:TerminalBlock_MaiXu_MX126-5.0-04P_1x04_P5.00mmJ2
1Circuit_conditionoConnector_PinHeader_2.54mm:PinHeader_1x05_P2.54mm_VerticalJ4
1Conn_01x02_MountingPinConnector_PinHeader_2.54mm:PinHeader_1x02_P2.54mm_VerticalJ3
1Conn_01x06_MountingPinConnector_PinSocket_2.54mm:PinSocket_1x06_P2.54mm_VerticalJ1
1MCP3004-I_PLibrary:MCP3004 ISLU4
1Raspberry_Pi_4Connector_PinHeader_2.54mm:PinHeader_2x20_P2.54mm_VerticalJ10

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Questions

How big is the LogHeat PCB?

It measures 65 × 56 mm and has 2 copper layers, 1.6 mm thick.

What parts does the LogHeat use?

33 parts, built around the MCP3004-I/P and AD8603AUJZ-R2. The full list of its parts is on this page, with links to each part's symbol and footprint where PCBKit's library has them.

Where can I download the LogHeat KiCad files?

From the IfTrueEqualsEqualsTrue/LogHeat repository on GitHub, at the commit this page was made from: the board is kicad/logheat.kicad_pcb and its schematic kicad/logheat.kicad_sch. PCBKit opens the board in the browser, with nothing to install.

Can I use the LogHeat design in my own project?

Its repository states no licence, so its author keeps all rights: ask IfTrueEqualsEqualsTrue before reusing the design.